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5962H9657401VXX

Multiplexer, AC Series, 2-Func, 4 Line Input, 1 Line Output, True Output, CMOS, CDFP16, BOTTOM BRAZED, CERAMIC, DFP-16

器件类别:逻辑    逻辑   

厂商名称:Cobham Semiconductor Solutions

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器件参数
参数名称
属性值
零件包装代码
DFP
包装说明
DFP,
针数
16
Reach Compliance Code
unknown
ECCN代码
3A001.A.1.A
系列
AC
JESD-30 代码
R-CDFP-F16
JESD-609代码
e0/e4
逻辑集成电路类型
MULTIPLEXER
功能数量
2
输入次数
4
输出次数
1
端子数量
16
最高工作温度
125 °C
最低工作温度
-55 °C
输出特性
3-STATE
输出极性
TRUE
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
DFP
封装形状
RECTANGULAR
封装形式
FLATPACK
传播延迟(tpd)
16 ns
认证状态
Not Qualified
座面最大高度
2.921 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
TIN LEAD/GOLD
端子形式
FLAT
端子节距
1.27 mm
端子位置
DUAL
总剂量
1M Rad(Si) V
宽度
6.731 mm
Base Number Matches
1
文档预览
Standard Products
UT54ACS253/UT54ACTS253
Dual 4-Input Multiplexers, Three-State Outputs
Datasheet
November 2010
www.aeroflex.com/logic
FEATURES
Permits multiplexing from N lines to 1 line
Performs parallel-to-serial conversion
1.2μ
CMOS
- Latchup immune
High speed
Low power consumption
Single 5 volt supply
Available QML Q or V processes
Flexible package
- 16-pin DIP
- 16-lead flatpack
UT54ACS253 - SMD 5962-96574
UT54ACTS253 - SMD 5962-96575
DESCRIPTION
The UT54ACS253 and the UT54ACTS253 are 1-line to 4-line
multiplexers that contain drivers to supply full binary decoding.
Separate output control inputs are provided for each of the two
four-line sections.
Use the three-state outputs to drive data lines in bus-organized
systems. With all but one of the common outputs disabled the
low-impedance of the single enable output will drive the bus
line to a high or low logic level. Each output has its own strobe
(G).
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
SELECT
INPUTS
B
X
L
L
L
L
H
H
H
H
A
X
L
L
H
H
L
L
H
H
C0
X
L
H
X
X
X
X
X
X
DATA INPUTS
C1
X
X
X
L
H
X
X
X
X
C2
X
X
X
X
X
L
H
X
X
C3
X
X
X
X
X
X
X
L
H
OUTPUT
CONTROL
G
H
L
L
L
L
L
L
L
L
OUTPUT
Y
Z
L
H
L
H
L
H
L
H
PINOUTS
16-Pin DIP
Top View
1G
B
1C3
1C2
1C1
1C0
1Y
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
2G
A
2C3
2C2
2C1
2C0
2Y
16-Lead Flatpack
Top View
1G
B
1C3
1C2
1C1
1C0
1Y
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
2G
A
2C3
2C2
2C1
2C0
2Y
LOGIC SYMBOL
(14)
(2)
(1)
(6)
(5)
(4)
(3)
EN
0
1
2
3
MUX
(7)
A
B
1G
1C0
1C1
1C2
1C3
0
1
G
---
0
3
1Y
(15)
2G
(10)
2C0
(11)
2C1
(12)
2C2
(13)
2C3
(9)
2Y
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
1
LOGIC DIAGRAM
OUTPUT
CONTROL
1G
(1)
1C0 (6)
(5)
(7)
1C1
DATA 1
1C2
1Y
(4)
1C3
(3)
B
SELECT
(2)
A (14)
2C0
(10)
2C1 (11)
DATA 2
2C2
(12)
(9)
2Y
2C3
(13)
2G
OUTPUT
CONTROL
(15)
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Three-state output leakage current
Quiescent Supply Current
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
O
= V
DD
and V
SS
V
DD
= 5.5V
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
2.1
10
1.6
mW/
MHz
μA
mA
-8
mA
8
.7V
DD
V
DD
- 0.25
-200
-20
200
20
10
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
I
OS
I
OZ
I
DDQ
I
OL
mA
μA
μA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
5
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