REVISIONS
LTR
A
DESCRIPTION
Add two packages, C-5 and C-4. Make changes to table I, and throughout. For
case X, the dimensions have been changed and figure 2 has been replaced with
D-10 configuration. Inactivate devices 01XX and 02XX for new design. Use
M38510 device. Add a truth table.
Add device types 05, 06, 07, and 08. Add vendors CAGES 1ES66, OH9K9, and
33256. Editorial changes throughout.
Add class V devices. Add Z package. Editorial changes throughout.
Changes in accordance with NOR 5962-R368-97. – drw
Change descriptive designator for case outline Z from GDFP2-F28 to
CDFP3-F28. Editorial changes throughout. Redrawn. - drw
Sheet 7, table I, V
IL
test, change max limit from –0.8 V to 0.8 V. - drw
Add radiation features and post irradiation limits. - drw
Add device type 01 to the post irradiation limits in table I. - drw
Sheet 6, table I,
Integral linearity error test (ILE), post irradiation limits for
DATE (YR-MO-DA)
90-01-24
APPROVED
M. A. Frye
B
C
D
E
93-03-15
97-04-15
97-06-23
99-12-30
M. A. Frye
R. Monnin
Raymond Monnin
Raymond Monnin
F
G
H
J
00-03-01
01-05-16
02-07-10
03-04-25
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
device types 01 and 02, subgroup 1, change from -1.0 LSB min to
-1.5 LSB min and from 1.0 LSB max to 1.5 LSB max.
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
H
15
H
16
H
17
H
18
REV
SHEET
PREPARED BY
Sandra B. Rooney
H
19
H
20
J
1
H
2
H
3
H
4
H
5
J
6
H
7
H
8
H
9
H
10
H
11
H
12
H
13
H
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besore
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
86-07-10
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, MICROPROCESSOR
COMPATIBLE, 12-BIT ANALOG-TO-DIGITAL
CONVERTERS, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
J
SIZE
A
SHEET
CAGE CODE
67268
1 OF
20
5962-85127
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E297-03
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
85127
01
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
-
85127
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
Generic number
574AU
574AT
574AU
574AT
574ZA
574ZB
574AU
574AT
Circuit function
Monolithic, high performance, 12-bit A/D converter with
microprocessor interface
Monolithic, medium performance, 12-bit A/D converter with
microprocessor interface
Multi-chip, high performance, 12-bit A/D converter with
microprocessor interface
Multi-chip, medium performance, 12-bit A/D converter with
microprocessor interface
Monolithic, high performance, low power, 12-bit A/D converter
with microprocessor interface
Monolithic, medium performance, low power, 12-bit A/D converter
with microprocessor interface
Monolithic, high performance, low power, 12-bit A/D converter
with microprocessor interface
Monolithic, medium performance, low power, 12-bit A/D converter
with microprocessor interface
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-85127
SHEET
H
2
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
3
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N44
CDFP3-F28
CQCC1-N28
Terminals
28
44
28
28
Package style
dual-in-line
square leadless chip carrier
flat pack
square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
V
CC
to digital common ..........................................................................................................
V
EE
to digital common ..........................................................................................................
V
LOG
to digital common ........................................................................................................
Analog to digital common:
Device types 01, 02, 03, 04 ..............................................................................................
Device types 05, 06, 07, 08 ..............................................................................................
Control inputs (CE, CS, A
O
, 12/8, R/C) to digital common..................................................
Analog inputs (REF IN, BIP OFF, 10 V
IN
) to analog common ............................................
20 V
IN
analog input voltage to analog common...................................................................
V
REF OUT
.................................................................................................................................
Power dissipation at 75°C:
Device types 01, 02, 05, 06, 07, 08..................................................................................
Device types 03, 04 ..........................................................................................................
Lead temperature (soldering, 10 seconds)..........................................................................
Storage temperature ............................................................................................................
Thermal resistance, junction-to-ambient (θ
JA
):
Cases X and 3 ..................................................................................................................
Case Y...............................................................................................................................
Case Z...............................................................................................................................
Thermal resistance, junction-to-case (θ
JC
)...........................................................................
Junction temperature (T
J
) ....................................................................................................
0 to +16.5 V dc
0 to -16.5 V dc
0 to +7 V dc
+1 V dc
-0.5 V dc to +1 V dc
-0.5 V dc to V
LOG
+0.5 V dc
V
EE
to V
CC
+24 V dc
Indefinite short to common,
10 ms short to V
CC
1,000 mW 2/
2,080 mW 2/
+300°C
-65°C to +150°C
70°C/W
38°C/W
60°C/W
See MIL-STD-1835
+175°C
1/
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
For cases X and 3, derate linearly above T
A
= +75°C at 20.8 mW/°C.
For cases Y, derate linearly above T
A
= +75°C at 22.7 mW/°C.
For cases Z, derate linearly above T
A
= +115°C at 17 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-85127
SHEET
H
3
1.4 Recommended operating conditions.
Power supply
Operating voltage range:
Positive supply (V
LOG
)....................................................................................................
Positive supply (V
CC
) .....................................................................................................
Negative supply (V
EE
)....................................................................................................
Ambient operating temperature range .................................................................................
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rad(Si)/s) ..........................................
≤100
Krads (Si)
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
+4.5 V dc to +5.5 V dc
+11.4 V dc to +16.5 V dc
-11.4 V dc to -16.5 V dc
-55°C to +125°C
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device
class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-85127
SHEET
H
4
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Block or logic diagrams. The block or logic diagrams shall be as specified on figure 3.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient
operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests
for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M
shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing
shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or
for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)
involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available
onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit
group number 81 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-85127
SHEET
H
5
