BALL GRID ARRAYS
For 0.8mm Grid
Male Pin Adapters & Female Socket
•
BGA adapter/socket systems are a reliable way to make BGAs
pluggable, they may also be used as a high
density board-to-board interconnect.
•
The BGA device is soldered to a 9929
adapter (or a 7929 adapter is soldered
to a PCB); and then either one can be
plugged into a 9645 surface mount socket.
•
Both socket and adapter have the same
footprint as the BGA device.
•
Insertion force is only .4N per pin, and a pry-bar tool
(part #828-01-010) is available for extraction.
•
Insulator material is FR-4 epoxy having a TCE to match the BGA
device and circuit board.
BGA MOUNT
ADAPTER PIN TYPE 9929
Series 5XX
Ordering Information
FOR BGA MOUNT ADAPTERS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
Series
Plating
Code
Window
5 9 9
-
1 0
-
No. of pins
-
-
Grid size
Pattern #
4 2 9
Determined from footprint pattern on page 111.2
PRINTED CIRCUIT MOUNT
ADAPTER PIN TYPE 7929
FOR PCB MOUNT ADAPTERS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
Series
Plating
Code
Window
5 7 9
-
1 0
-
No. of pins
-
10
10μ” Au
-
Grid size
Pattern #
4 2 9
Determined from footprint pattern on page 111.2
PLATING CODE XX=
Pin Plating
SURFACE MOUNT
RECEPTACLE TYPE 9942
FOR FEMALE SOCKETS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
Series
Plating
Code
Window
5 9 9
-
1 1
-
No. of pins
-
11
10μ” Au
10μ” Au
-
Grid size
Pattern #
4 4 2
Determined from footprint pattern on page 111.2
SPECIFY PLATING CODE XX=
Sleeve (Pin)
Contact (Clip)
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111.1
516-922-6000
BALL GRID ARRAY FOOTPRINTS (0.8mm GRID)
Top view shown. Many other standard footprints are available.
Visit
www.mill-max.com
for a complete selection.
.035 TYP.
0.8mm TYP.
11 X 11
XXX-XX-100-06-001
13 X 13
XXX-XX-144-07-001
13 X 13
XXX-XX-169-07-001
14 X 14
XXX-XX-131-07-001
14 X 14
XXX-XX-179-07-001
14 X 14
XXX-XX-196-07-001
15 X 15
XXX-XX-225-08-001
18 X 18
XXX-XX-324-09-001
20 X 20
XXX-XX-400-10-007
22 X 22
XXX-XX-484-11-000
23 X 23
XXX-XX-424-12-001
26 X 26
XXX-XX-676-13-001
SPECIFICATIONS:
Materials:
- Socket contact: Three finger, stamped beryllium
copper alloy 172, HT (Mill-Max type #04); plated 10µ”
gold over 50µ” nickel
- Socket shell and adapter pins: Precision machined
brass alloy; plated 10µ” gold over 100µ” nickel
- Insulator material: .047” thick glass-epoxy type FR-4,
rated UL94V-0.
TCE = 10-13ppm/°C,
ε
r = 5.0
Mechanical:
- Insertion and withdrawal forces (using .010” dia.
polished steel gage pin): Insertion: .36N typ. per pin
Withdrawal: .20N typ. per pin
- Insertion force of an actual 225 pin device: 90N
- Durability: 100 cycles
- Coplanarity: <.005”
Electrical:
- Current rating (per pin): 1 A
- Working voltage: 100 VRMS/150 VDC max.
- Low level contact resistance: 10 mΩ max.
- Insulation resistance @ 500 VRMS:
Initial value: 1,000,000 MΩ min.
After climatic tests: 10,000 MΩ min.
- Dielectric withstanding voltage: 500 VRMS
- Capacitance between adjacent contacts: 1 pF max.
- Self inductance per pin: 2 nH max.
- Electrical length: 31 pS
Environmental:
- Operating temperature range: -55 °C to +125 °C
BGA adapter/socket systems have withstood the following
environmental tests without mechanical or electrical failure:
- Damp heat, steady state: 40 °C, 93% rH, 21 days
- Damp heat, cyclic: 25/55 °C, 6 days
- Dry heat: 100°C, 1,000 hours
- Thermal shock: -55 to +125 °C, 5 cycles
- Random vibration: 50 to 500 Hz, 8g, 20 min. per axis
- Shock: 50 g per axis
- Solderability: 235 °C, 2 seconds
- Resistance to soldering heat: 270 °C, 10 seconds
- Resistance to corrosion:
Salt spray: 48 hours
Sulphur dioxide: 96 hours @ 25 ppm SO2, 25 °C, 75% rH
Hydrogen sulphide: 96 hours @ 12 ppm H2S, 25°C, 75% rH
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111.2
516-922-6000
