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668-B-2001B13

Array/Network Resistor, Bussed, Thin Film, 0.1W, 2000ohm, 100V, 0.1% +/-Tol, -25,25ppm/Cel, 3916,

器件类别:无源元件    电阻器   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

下载文档
器件参数
参数名称
属性值
是否Rohs认证
不符合
Objectid
910556799
Reach Compliance Code
compliant
ECCN代码
EAR99
构造
Epoxy Molded
引线间距
1.27 mm
网络类型
Bussed
端子数量
16
最高工作温度
125 °C
最低工作温度
-55 °C
封装高度
1.73 mm
封装长度
9.98 mm
封装形式
SMT
封装宽度
3.99 mm
包装方法
TR, 13 Inch
额定功率耗散 (P)
0.1 W
参考标准
MIL-R-83401
电阻
2000 Ω
电阻器类型
ARRAY/NETWORK RESISTOR
系列
668
尺寸代码
3916
技术
THIN FILM
温度系数
-25,25 ppm/°C
容差
0.1%
工作电压
100 V
文档预览
MODELS 664, 667, 668
Isolated and bussed circuits
Thin film resistor network
0.150” SOIC packages
RoHS compliant available
FEATURES
Precision Nichrome Resistors on Ceramic
Passivation coating provides protection in humid environments
Excellent frequency response
Excellent long term resistance stability
JEDEC 95, MS-012
(SOIC narrow body in 8, 14 and 16 lead pin counts)
< ± 0.05%
< ± 5 ppm/°
C
Industry Standard Packaging
Ratio Tolerances
TCR Tracking Tolerances
SCHEMATICS
ELECTRICAL
1
Standard Resistance Range
TCR
TCR Tracking
Operating Temperature Range
Interlead Capacitance
Insulation Resistance
Maximum Operating Voltage
Noise, Maximum (MIL-STD-202, Method 308)
Resistor Power Rating at 70°
C
2
1K ohms to 100K ohms (Isolated)
1K ohms to 20K ohms (Bussed)
± 25 ppm/°
C
± 5 ppm/°
C
-55°C to +125°C
< 2pF
10,000 Megohms
100 Vdc or
PR
-40 dB
0.1 Watts
1
2
Specifications subject to change without notice.
E96 codes available.
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
May 29, 2008
page 1 of 3
BI technologies
664, 667, 668
DERATING
PACKAGE POWER AND DERATING CURVE
Model
664
667
668
Package Power @ 70°C(watts)
°
0.4
0.5
0.5
3
(MIL-
ENVIRONMENTAL (MIL-R-83401)
Thermal Shock plus Power Conditioning
Short Time Overload
Terminal Strength
Moisture Resistance
Mechanical Shock
Vibration
Low Temperature Operation
High Temperature Exposure
Load Life, 1,000 Hours
Resistance to Solder Heat
Dielectric Withstanding Voltage
Temperature Exposure, Maximum
Marking Permanency
Lead Solderability
Flammability
Storage Temperature Range
∆R
0.25%
∆R
0.1%
∆R
0.1%
∆R
0.2%
∆R
0.25%
∆R
0.25%
∆R
0.1%
∆R
0.1%
∆R
0.1%
∆R
0.1%
100V for 1 minute
215°C for 3 minutes
MIL-STD-202, Method 215
MIL-STD-202, Method 208
UL-94V-0 Rated
-65°C to +125°C
MECHANICAL
Lead Plating
Lead Material
Lead Configuration
Lead Coplanarity
Substrate Material
Resistor Material
Body Material
80/20 Tin Lead (Standard)
100 matte Tin (RoHS)
Copper Alloy
Gull Wing
0.004” (0.102 mm)
Alumina
Passivated Nichrome
Molded Epoxy
3
Maximum power per resistor @ 70° is 100 mW, not to exceed package power
C
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
May 29, 2008
page 2 of 3
BI technologies
664, 667, 668
ORDERING INFORMATION
4
66 4 -A-1002 A LF 7
Model Series:
66 = Passivated Nichrome
on Ceramic
Number of Leads:
4= 8 leads
7=14 leads
8=16 leads
Circuit Type:
A=Isolated
B=Bussed
Packaging Option:
7=7” Tape & Reel
13 = 13" Tape & Reel
(No Code used for Tubes)
Lead Finish:
No Code=SnPb
LF=Lead Free (RoHS)
Tolerance Code
Resistance Code
RESISTANCE CODE
4
First 3 digits are significant. Fourth digit denotes number of trailing zeros. For values less than 100, use “R” to denote a
decimal point. Example, 51 and 10000 ohms are coded as 51R0 and 1002 respectively. Standard values follow E96.
RESISTANCE TOLERANCE CODE
Accuracy Code at 25°
C
Absolute Resistance Tolerances (%)
Ratio Tolerances (R1 Ref) (%)
A
± 0.1
± 0.05
B
± 0.1
± 0.1
D
± 0.5
± 0.1
F
± 1.0
± 0.5
±25
±5
Temperature Coefficient of Resistance (ppm/°C)
Temperature Coefficient of Resistance, Tracking (ppm/°C)
(UNIT
TYPE)
PACKAGING OPTIONS (UNIT COUNT/PACKAGE TYPE)
Model + Pin count
664
667
668
Tubes
100
50
50
7” Tape & Reel
1000
500
500
13” Tape & Reel
2500
2500
2500
TYPICAL MARKING
4
Contact customer service for custom designs and features.
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
May 29, 2008
page 3 of 3
BI technologies
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