描述 |
SRAM Low Power Dual-Port RAM IC |
SRAM Low Power Dual-Port RAM IC |
SRAM Low Power Dual-Port RAM IC |
SRAM Low Power Dual-Port RAM IC |
SRAM Low Power Dual-Port RAM IC |
SRAM Low Power Dual-Port RAM IC |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
零件包装代码 |
BGA |
CABGA |
CABGA |
CABGA |
BGA |
BGA |
包装说明 |
0.50 MM PITCH, GREEN, BGA-100 |
0.5 MM PITCH, GREEN, BGA-100 |
0.5 MM PITCH, GREEN, BGA-100 |
0.5 MM PITCH, GREEN, BGA-100 |
0.50 MM PITCH, GREEN, BGA-100 |
BGA, BGA100,10X10,20 |
针数 |
100 |
100 |
100 |
100 |
100 |
100 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
最长访问时间 |
65 ns |
65 ns |
65 ns |
90 ns |
65 ns |
65 ns |
其他特性 |
IT CAN ALSO OPERATES WITH 2.5 AND 3 VOLT |
IT CAN OPERATE ALSO 2.5 TO 3 VOLT |
IT CAN OPERATE ALSO 2.5 TO 3 VOLT |
IT CAN OPERATE ALSO 2.5 TO 3 VOLT |
IT CAN OPERATE ALSO 2.5 TO 3 VOLT |
IT CAN OPERATE ALSO 2.5 TO 3 VOLT |
I/O 类型 |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 代码 |
S-PBGA-B100 |
S-PBGA-B100 |
S-PBGA-B100 |
S-PBGA-B100 |
S-PBGA-B100 |
S-PBGA-B100 |
JESD-609代码 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
内存密度 |
262144 bit |
65536 bit |
262144 bit |
131072 bit |
65536 bit |
131072 bit |
内存集成电路类型 |
DUAL-PORT SRAM |
DUAL-PORT SRAM |
DUAL-PORT SRAM |
DUAL-PORT SRAM |
DUAL-PORT SRAM |
DUAL-PORT SRAM |
内存宽度 |
16 |
16 |
16 |
16 |
16 |
16 |
湿度敏感等级 |
3 |
3 |
3 |
3 |
3 |
3 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
端口数量 |
2 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
100 |
100 |
100 |
100 |
100 |
100 |
字数 |
16384 words |
4096 words |
16384 words |
8192 words |
4096 words |
8192 words |
字数代码 |
16000 |
4000 |
16000 |
8000 |
4000 |
8000 |
工作模式 |
ASYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
组织 |
16KX16 |
4KX16 |
16KX16 |
8KX16 |
4KX16 |
8KX16 |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
封装等效代码 |
BGA100,10X10,20 |
BGA100,10X10,20 |
BGA100,10X10,20 |
BGA100,10X10,20 |
BGA100,10X10,20 |
BGA100,10X10,20 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
并行/串行 |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
电源 |
1.8/3 V |
1.8/3 V |
1.8/3 V |
1.8/3 V |
1.8/3 V |
1.8/3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
最大待机电流 |
0.000008 A |
0.000008 A |
0.000008 A |
0.000008 A |
0.000008 A |
0.000008 A |
最大压摆率 |
0.07 mA |
0.07 mA |
0.07 mA |
0.06 mA |
0.07 mA |
0.07 mA |
最大供电电压 (Vsup) |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
最小供电电压 (Vsup) |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
标称供电电压 (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
处于峰值回流温度下的最长时间 |
30 |
30 |
30 |
30 |
30 |
30 |
Base Number Matches |
1 |
1 |
- |
- |
1 |
1 |