SMT
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Air Velocity—Feet Per Minute
400
200
600
800
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
0
100
Case Temp Rise
Rise Above Ambient—°C
80
60
40
20
0
0.0
20
15
10
5
0
0.5
1.0
1.5
2.0
Heat Dissipated—Watts
2.5
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
25
8.00
(0.315)
22.86
(0.900)
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
573100D00010G
573100D00000G
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
10.16
(0.400)
1.3
(0.05)
10.41
(0.410)
8.13
(0.320)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
5733
Surface mount heat sink for D
2
PAK (TO-263) package semiconductors
Air Velocity—Feet Per Minute
400
200
600
800
0
50
Case Temp Rise
Rise Above Ambient—°C
40
30
20
10
0
0.0
16
12
8
4
0
0.5
1.0
1.5
2.0
Heat Dissipated—Watts
2.5
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
20
12.70
(0.500)
26.16
(1.030)
Surface mount heat sink for D
2
PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
573300D00010G
573300D00000G
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
10.16
(0.400)
1.3
(0.05)
12.70
(0.500)
7.37
(0.290)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
7106
Surface mount heat sink for D
2
PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Air Velocity—Feet Per Minute
400
200
600
800
5.33
(0.210)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
10
8
6
4
2
0
0
1
2
3
Heat Dissipated—Watts
4
5
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
14.99
(0.590)
10.92 14.99
(0.430) (0.590)
Surface mount heat sink for D PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
7106D/TRG
7106DG
Packaging
13" Reel, 200 per reel
Bulk, 500 per bag
2
25.91
(1.020)
10.16
(0.400)
9.52
(0.375)
7.62
(0.300)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure C on page 26 for board footprint information
See page 25 for tape and reel information
24
AMERICA
EUROPE
www.aavidthermalloy.com
USA
Tel: +1 (603) 224-9988 email: info@aavid.com
Italy
Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom
Tel: +44 1793 401400 email: sales.uk@aavid.com
ASIA
Singapore
Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan
Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
SMT
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7109
Surface mount heat sink for D
2
PAK (TO-263) package semiconductors
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
Air Velocity—Feet Per Minute
400
200
600
800
1000
4
3
2
1
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
19.38
(0.763)
Surface mount heat sink for D PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
7109D/TRG
7109DG
Packaging
13" Reel, 125 per reel
Bulk, 500 per bag
2
25.40
(1.000)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Refer to Figure D on page 26 for board footprint information
1
2
3
Heat Dissipated—Watts
4
5
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
5734
Surface mount heat sink for D
3
PAK (TO-268) package semiconductors
0
50
Case Temp Rise
Rise Above Ambient—°C
40
30
20
10
0
0.0
Air Velocity—Feet Per Minute
400
200
600
800
16
12
8
4
0
0.5
1.0
1.5
2.0
Heat Dissipated—Watts
2.5
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
20
12.70
(0.500)
Surface mount heat sink for D
3
PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
573400D00010G
573400D00000G
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
30.99
(1.220)
10.16
(0.400)
1.3
(0.05)
7.37
(0.290)
17.53
(0.690)
Refer to Figure A and B on page 26 for board footprint information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Tape and Reel information
D
B
A
C
ORDERING INFORMATION
Part Number
7106D/TRG
7109D/TRG
573100D00010G
573300D00010G
573400D00010G
“A” Dim
44.00 (1.730)
44.00 (1.730)
44.00 (1.730)
44.00 (1.730)
44.00 (1.730)
“B” Dim
40.40 (1.590)
40.40 (1.590)
40.40 (1.590)
40.40 (1.590)
40.40 (1.590)
“C” Dim
24.00 (0.940)
36.00 (1.420)
16.00 (0.630)
24.00 (0.940)
24.00 (0.940)
“D” Dim
4.06 (0.160)
4.06 (0.160)
4.06 (0.160)
4.06 (0.160)
4.06 (0.160)
AMERICA
EUROPE
www.aavidthermalloy.com
USA
Tel: +1 (603) 224-9988 email: info@aavid.com
Italy
Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom
Tel: +44 1793 401400 email: sales.uk@aavid.com
ASIA
Singapore
Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan
Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
25
