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71V65602S150BQGI

ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA165, 13 X 15 MM, FPBGA-165

器件类别:存储    存储   

厂商名称:IDT (Integrated Device Technology)

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
BGA
包装说明
13 X 15 MM, FPBGA-165
针数
165
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
最长访问时间
3.8 ns
其他特性
PIPELINED ARCHITECTURE
JESD-30 代码
R-PBGA-B165
JESD-609代码
e1
长度
15 mm
内存密度
9437184 bit
内存集成电路类型
ZBT SRAM
内存宽度
36
湿度敏感等级
3
功能数量
1
端子数量
165
字数
262144 words
字数代码
256000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
256KX36
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
13 mm
Base Number Matches
1
文档预览
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
IDT71V65602
IDT71V65802
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
BW
Three chip enables for simple depth expansion
3.3V power supply (±5%)
2.5V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad and
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Description
The IDT71V65602/5802 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65602/5802 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used to
disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65602/5802
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be initiated.
However, any pending data transfers (reads or writes) will be completed. The
data bus will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65602/5802 have an on-chip burst counter. In the burst
mode, the IDT71V65602/5802 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is defined
by the
LBO
input pin. The
LBO
pin selects between linear and interleaved burst
sequence. The ADV/LD signal is used to load a new external address (ADV/
LD
= LOW) or increment the internal burst counter (ADV/LD = HIGH).
The IDT71V65602/5802 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA)
and a 165 fine pitch ball grid array (fBGA).
Pin Description Summary
A
0
-A
18
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5303 tbl 01
CE
1
, CE
2
,
CE
2
OE
R/
W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/
LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2004
DSC-5303/05
1
©2004 Integrated Device Technology, Inc.
IDT71V65602, IDT71V65802, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Pin Definitions
(1)
Symbol
A
0
-A
18
ADV/
LD
Pin Function
Address Inputs
Advance / Load
I/O
I
I
Active
N/A
N/A
Description
Synchronous Address inputs. The address register is trig gered by a combination of the
rising edge of CLK, ADV/
LD
low,
CEN
low, and true chip enables.
ADV/
LD
is a synchronous input that is used to load the internal registers with new address
and control when it is sampled low at the rising edge of clock with the chip selected. When
ADV/
LD
is low with the chip deselected, any burst in progress is terminated. When ADV/
LD
is sampled hig h then the internal burst counter is advanced for any burst that was in
progress. The external addresses are ignored when ADV/
LD
is sampled high.
R/
W
signal is a synchronous input that identifies whether the current load cycle initiated is a
Read or Write access to the memory array. The data bus activity for the current cycle takes
place two clock cycles later.
Synchronous Clock Enable Input. When
CEN
is sampled high, all other synchronous
inputs, including clock are ignored and outputs re main unchanged. The effect of
CEN
sampled high on the device outputs is as if the low to hig h clock transition did not occur.
For normal operation,
CEN
must be sampled low at rising edge of clock.
Synchronous byte write enables. Each 9-bit byte has its own active low byte write enable.
On load write cycles (When R/
W
and ADV/
LD
are sampled low) the appropriate byte write
signal (
BW
1
-
BW
4
) must be valid. The byte write signal must also be valid on each cycle of
a burst write. Byte Write signals are ignored when R/
W
is sampled high. The appropriate
byte(s) of data are written into the device two cycles later.
BW
1
-
BW
4
can all be tied low if
always doing write to the entire 36-bit word.
Synchronous active low chip enable.
CE
1
and
CE
2
are used with CE
2
to enable the
IDT71V65602/5802. (
CE
1
or
CE
2
sampled high or CE
2
sampled low) and ADV/
LD
low at the
rising edge of clock, initiates a deselect cycle. The ZBT
TM
has a two cycle deselect, i.e.,
the data bus will tri-state two clock cycles after deselect is initiated.
Synchronous active high chip enable. CE
2
is used with
CE
1
and
CE
2
to enable the chip.
CE
2
has inverted polarity but otherwise identical to
CE
1
and
CE
2
.
This is the clock input to the IDT71V65602/5802. Except for
OE
, all timing references for the
device are made with respect to the rising edge of CLK.
Synchronous data input/output (I/O) pins. Both the data input path and data output path are
registered and triggered by the rising edge of CLK.
Burst order selection input. When
LBO
is high the Interleaved burst sequence is selected.
When
LBO
is low the Linear burst sequence is selected.
LBO
is a static input and it must
not change during device operation.
Asynchronous output enable.
OE
must be low to read data from the IDT71V65602/5802.
When
OE
is high the I/O pins are in a high-impedance state.
OE
do es not need to be
actively controlled for read and write cycles. In normal operation,
OE
can be tied low.
Asynchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down
71V65602/5802 to the lowest power consumption level. Data retention is guaranteed in
Sleep Mode.
3.3V core power supply.
2.5V I/O Supply.
Ground.
5303 tbl 02
R/
W
Read / Write
I
N/A
CEN
Clock Enable
I
LOW
BW
1
-
BW
4
Individual Byte
Write Enables
I
LOW
CE
1
,
CE
2
Chip Enables
I
LOW
CE
2
CLK
I/O
0
-I/O
31
I/O
P1
-I/O
P4
Chip Enable
Clock
Data Input/Output
Linear Burst Order
I
I
I/O
I
HIGH
N/A
N/A
LOW
LBO
OE
Output Enable
I
LOW
ZZ
Sleep Mode
I
HIGH
V
DD
V
DDQ
V
SS
NOTE:
Power Supply
Power Supply
Ground
N/A
N/A
N/A
N/A
N/A
N/A
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
6.42
2
IDT71V65602, IDT71V65802, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO
Address A [0:17]
CE1,
CE2,
CE2
R/W
CEN
ADV/LD
BWx
D
Clk
D
Q
Control
D
Q
256Kx36 BIT
MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
OE
Gate
5303 drw 01a
,
Data I/O [0:31],
I/O P[1:4]
6.42
3
IDT71V65602, IDT71V65802, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO
Address A [0:18]
CE1,
CE2,
CE2
R/W
CEN
ADV/LD
BWx
D
Clk
D
Q
Control
D
Q
512x18 BIT
MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
OE
Gate
5303 drw 01
,
Data I/O [0:15],
I/O P[1:2]
Recommended DC Operating
Conditions
Symbol
V
DD
V
DDQ
V
SS
V
IH
V
IH
V
IL
Parameter
Core Supply Voltage
I/O Supply Voltage
Supply Voltage
Input High Voltage - Inputs
Input High Voltage - I/O
Input Low Voltage
Min.
3.135
2.375
0
1.7
1.7
-0.3
(1)
Typ.
3.3
2.5
0
____
____
____
Max.
3.465
2.625
0
V
DD
+0.3
V
DDQ
+0.3
0.7
Unit
V
V
V
V
V
V
5303 tbl 03
NOTES:
1. V
IL
(min.) = –1.0V for pulse width less than t
CYC
/2, once per cycle.
6.42
4
IDT71V65602, IDT71V65802, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Recommended Operating
Temperature and Supply Voltage
Grade
Commercial
Industrial
Ambient
Temperature
(1)
0° C to +70° C
-40° C to +85° C
V
SS
0V
0V
V
DD
3.3V± 5%
3.3V± 5%
V
DDQ
2.5V± 5%
2.5V± 5%
5303tbl 05
NOTES:
1. During production testing, the case temperature equals the ambient temperature.
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
I/O
P3
I/O
16
I/O
17
V
DDQ
V
SS
I/O
18
I/O
19
I/O
20
I/O
21
V
SS
V
DDQ
I/O
22
I/O
23
V
DD
(1)
V
DD
V
DD
(1)
V
SS
I/O
24
I/O
25
V
DDQ
V
SS
I/O
26
I/O
27
I/O
28
I/O
29
V
SS
V
DDQ
I/O
30
I/O
31
I/O
P4
BW
3
BW
2
BW
1
CE
2
V
DD
V
SS
CLK
R/W
CEN
OE
ADV/
LD
NC
(2)
A
17
A
8
A
9
Pin Configuration - 256K x 36
A
6
A
7
CE
1
CE
2
BW
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
I/O
P2
I/O
15
I/O
14
V
DDQ
V
SS
I/O
13
I/O
12
I/O
11
I/O
10
V
SS
V
DDQ
I/O
9
I/O
8
V
SS
V
DD
(1)
V
DD
ZZ
I/O
7
I/O
6
V
DDQ
V
SS
I/O
5
I/O
4
I/O
3
I/O
2
V
SS
V
DDQ
I/O
1
I/O
0
I/O
P1
5303 drw 02
LBO
A
5
A
4
A
3
A
2
A
1
A
0
DNU
(3)
DNU
(3)
V
SS
V
DD
DNU
(3)
DNU
(3)
Top View
100 TQFP
NOTES:
1. Pins 14, 16 and 66 do not have to be connected directly to V
DD
as long as the input voltage is
V
IH
.
2. Pin 84 is reserved for a future 16M.
3. DNU=Do not use. Pins 38, 39, 42 and 43 are reserved for respective JTAG pins: TMS, TDI, TDO and TCK. The
current die revision allows these pins to be left unconnected, tied Low (V
SS
) or tied High (V
DD
).
6.42
5
A
10
A
11
A
12
A
13
A
14
A
15
A
16
,
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