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71V65603S100PFGI

SRAM 9M ZBT SLOW X36 P/L 3.3V

器件类别:存储   

厂商名称:IDT(艾迪悌)

厂商官网:http://www.idt.com/

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
IDT(艾迪悌)
产品种类
Product Category
SRAM
RoHS
Details
Memory Size
9 Mbit
Organization
256 k x 36
Access Time
10 ns
Maximum Clock Frequency
100 MHz
接口类型
Interface Type
Parallel
电源电压-最大
Supply Voltage - Max
3.465 V
电源电压-最小
Supply Voltage - Min
3.135 V
Supply Current - Max
270 mA
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
TQFP-100
系列
Packaging
Tray
高度
Height
1.4 mm
长度
Length
20 mm
Memory Type
SDR
工作温度范围
Operating Temperature Range
- 40 C to + 85 C
类型
Type
Synchronous
宽度
Width
14 mm
Moisture Sensitive
Yes
工厂包装数量
Factory Pack Quantity
72
单位重量
Unit Weight
0.023175 oz
文档预览
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
Features
IDT71V65603/Z
IDT71V65803/Z
Description
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control signal
registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array(fBGA).
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turn-
around.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE1, CE2,
CE2)
that allow the user
to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected
or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a
single address presented to the SRAM. The order of the burst
sequence is defined by the
LBO
input pin. The
LBO
pin selects
between linear and interleaved burst sequence. The ADV/LD signal is
used to load a new external address (ADV/LD = LOW) or increment
the internal burst counter (ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA) .
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5304 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2008
DSC-5304/08
1
©2008 Integrated Device Technology, Inc.
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Pin Definitions
(1)
Symbol
A
0
-A
18
ADV/LD
Pin Function
Address Inputs
Advance / Load
I/O
I
I
Active
N/A
N/A
Description
Synchronous Address inputs. The address register is trig gered by a combination of the
rising edge of CLK, ADV/LD low,
CEN
low, and true chip enables.
ADV/LD is a synchronous input that is used to load the internal registers with new address
and control when it is sampled low at the rising edge of clock with the chip selected. When
ADV/LD is low with the chip deselected, any burst in progress is terminated. When ADV/
LD
is sampled hig h then the internal burst counter is advanced for any burst that was in
progress. The external addresses are ignored when ADV/LD is sampled high.
R/W signal is a synchronous input that identifies whether the current load cycle initiated is a
Read or Write access to the memory array. The data bus activity for the current cycle takes
place two clock cycles later.
Synchronous Clock Enable Input. When
CEN
is sampled high, all other synchronous
inputs, including clock are ignored and outputs re main unchanged. The effect of
CEN
sampled high on the device outp uts is as if the low to hig h clock transition did not occur.
For normal operation,
CEN
must be sampled low at rising edge of clock.
Synchro nous byte write enables. Each 9-bit byte has its own active low byte write enable.
On load write cycles (When R/W and ADV/LD are sampled low) the appropriate byte write
signal (BW
1
-BW
4
) must be valid. The byte write signal must also be valid on each cycle of
a burst write. Byte Write signals are ignored when R/W is sampled high. The appropriate
byte(s) of data are written into the device two cycles later.
BW
1
-BW
4
can all be tied low if
always doing write to the entire 36-bit word.
Synchronous active low chip enable.
CE
1
and
CE
2
are used with CE
2
to enable the
IDT71V65603/5803. (CE
1
or
CE
2
sampled high or CE
2
sampled low) and ADV/LD low at the
rising edge of clock, initiates a deselect cycle. The ZBT
TM
has a two cycle deselect, i.e.,
the data bus will tri-state two clock cycles after deselect is initiated.
Synchrono us active high chip enable. CE
2
is used with
CE
1
and
CE
2
to enable the chip.
CE
2
has inverted po larity but otherwise identical to
CE
1
and
CE
2
.
This is the clock input to the IDT71V65603/5803. Except for
OE,
all timing references for the
device are made with respect to the rising edge of CLK.
Synchro nous data input/output (I/O) pins. Both the data input path and data output path are
registered and triggered by the rising edge of CLK.
Burst order selection input. When
LBO
is high the Interleaved burst sequence is selected.
When
LBO
is low the Line ar burst sequence is selected.
LBO
is a static input and it must
not change during device operation.
Asynchronous output enable.
OE
must be low to read data from the 71V65603/5803. When
OE
is high the I/O pins are in a high-impedance state.
OE
does not need to be actively
controlled for read and write cycles. In normal operation,
OE
can be tied low.
Asynchro nous sleep mode input. ZZ HIGH will gate the CLK internally and power down the
71V65603/5803 to its lowest p ower consumption level. Data retention is guaranteed in
Sleep Mode.
3.3V core power supply.
3.3V I/O Supply.
Ground.
5304tbl 02
R/W
Read / Write
I
N/A
CEN
Clock Enable
I
LOW
BW
1
-BW
4
Individual Byte
Write Enables
I
LOW
CE
1
,
CE
2
Chip Enables
I
LOW
CE
2
CLK
I/O
0
-I/O
31
I/O
P1
-I/O
P4
LBO
Chip Enable
Clock
Data Input/Output
Linear Burst Order
I
I
I/O
I
HIGH
N/A
N/A
LOW
OE
Output Enable
I
LOW
ZZ
Sleep Mode
I
N/A
V
DD
V
DDQ
V
SS
NOTE:
Power Supply
Power Supply
Ground
N/A
N/A
N/A
N/A
N/A
N/A
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
6.42
2
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO
Address A [0:18]
C E1,
CE2,
C E2
R/W
C EN
ADV/LD
BW
x
D
Clk
D
Input Register
512x18 BIT
MEMORY ARRAY
D
Q
Address
Q
Control
DI
DO
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
OE
Gate
5304 drw 01
,
Data I/O [0:15],
I/O P[1:2]
6.42
3
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO
Address A [0:18]
C E1,
CE2,
C E2
R/W
C EN
ADV/LD
BW
x
D
Clk
D
Q
Control
D
Q
512x18 BIT
MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
OE
Gate
5304 drw 01
,
Data I/O [0:15],
I/O P[1:2]
Recommended DC Operating
Conditions
Symbol
V
DD
V
DDQ
V
SS
V
IH
V
IH
V
IL
Parameter
Core Supply Voltage
I/O Supply Voltage
Supply Voltage
Input High Voltage - Inputs
Input High Voltage - I/O
Input Low Voltage
Min.
3.135
3.135
0
2.0
2.0
-0.3
(1)
Typ.
3.3
3.3
0
____
____
____
Max.
3.465
3.465
0
V
DD
+0.3
V
DDQ
+0.3
0.8
Unit
V
V
V
V
V
V
5304 tbl 04
NOTES:
1. V
IL
(min.) = –1.0V for pulse width less than t
CYC
/2, once per cycle.
6.42
4
Recommended Operating
Temperature and Supply Voltage
Grade
Commercial
Industrial
NOTES:
IDT71V65603, IDT71V65803, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs
Commercial and Industrial Temperature Ranges
Ambient
Temperature
(1)
0° C to +70° C
-40°C to +85°C
V
SS
0V
0V
V
DD
3.3V±5%
3.3V±5%
V
DDQ
3.3V±5%
3.3V±5%
5304 tbl 05
1.
During production testing, the case temperature equals the ambient temperature
.
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
I/O
P3
I/O
16
I/O
17
V
DDQ
V
SS
I/O
18
I/O
19
I/O
20
I/O
21
V
SS
V
DDQ
I/O
22
I/O
23
V
DD
(1)
V
DD
V
DD
(1)
V
SS
I/O
24
I/O
25
V
DDQ
V
SS
I/O
26
I/O
27
I/O
28
I/O
29
V
SS
V
DDQ
I/O
30
I/O
31
I/O
P4
CE
2
BW
4
BW
3
BW
2
BW
1
CE
2
V
DD
V
SS
CLK
R/W
CEN
OE
ADV/LD
NC
(2)
A
17
A
8
A
9
Pin Configuration - 256K x 36
A
6
A
7
CE
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
I/O
P2
I/O
15
I/O
14
V
DDQ
V
SS
I/O
13
I/O
12
I/O
11
I/O
10
V
SS
V
DDQ
I/O
9
I/O
8
V
SS
V
DD
(1)
V
DD
ZZ
I/O
7
I/O
6
V
DDQ
V
SS
I/O
5
I/O
4
I/O
3
I/O
2
V
SS
V
DDQ
I/O
1
I/O
0
I/O
P1
5304 drw 02
NOTES:
1. Pins 14, 16 and 66 do not have to be connected directly to VDD as long as the input voltage is
VIH.
2. Pin 84 is reserved for a future 16M.
3.
DNU=Do not use. Pins 38, 39, 42 and 43 are reserved for respective JTAG pins: TMS, TDI, TDO and TCK. The current die
revision allows these pins to be left unconnected, tied LOW (V
SS
), or tied HIGH (V
DD
).
LBO
A
5
A
4
A
3
A
2
A
1
A
0
DNU
(3)
DNU
(3)
V
SS
V
DD
DNU
(3)
DNU
(3)
A
10
A
11
A
12
A
13
A
14
A
15
A
16
,
Top View
100 TQFP
6.42
5
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