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74AHC244D,118

buffers & line drivers octal buffer 3-state

器件类别：逻辑    逻辑   

厂商名称：NXP(恩智浦)

厂商官网：https://www.nxp.com

器件标准：

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器件参数
参数名称
属性值
Brand Name
NXP Semiconductor
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
SOP
包装说明
SOP, SOP20,.4
针数
20
制造商包装代码
SOT163-1
Reach Compliance Code
compliant
控制类型
ENABLE LOW
系列
AHC/VHC/H/U/V
JESD-30 代码
R-PDSO-G20
JESD-609代码
e4
长度
12.8 mm
逻辑集成电路类型
BUS DRIVER
最大I（ol）
0.008 A
湿度敏感等级
1
位数
4
功能数量
2
端口数量
2
端子数量
20
最高工作温度
125 °C
最低工作温度
-40 °C
输出特性
3-STATE
输出极性
TRUE
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP20,.4
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
包装方法
TAPE AND REEL
峰值回流温度（摄氏度）
260
电源
2/5.5 V
Prop。Delay @ Nom-Sup
9.5 ns
传播延迟（tpd）
15 ns
认证状态
Not Qualified
座面最大高度
2.65 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
2 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
7.5 mm
文档预览
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Rev. 05 — 20 December 2007
Product data sheet
1. General description
The 74AHC244; 74AHCT244 is a high-speed Si-gate CMOS device.
The 74AHC244; 74AHCT244 has octal non-inverting buffer/line drivers with 3-state
outputs. The 3-state outputs are controlled by the output enable inputs (nOE). A HIGH on
nOE causes the outputs to assume a high-impedance OFF-state.
2. Features
s
s
s
s
s
s
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC244 only: operates with CMOS input levels
For 74AHCT244 only: operates with TTL input levels
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
x
CDM JESD22-C101C exceeds 1000 V
s
Multiple package options
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC244D
74AHCT244D
74AHC244PW
74AHCT244PW
74AHC244BQ
74AHCT244BQ
−40 °C
to +125
°C
DHVQFN20
−40 °C
to +125
°C
TSSOP20
−40 °C
to +125
°C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
Type number
plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
NXP Semiconductors
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
4. Functional diagram
2
1A0
1Y0
18
4
1A1
1Y1
16
6
1A2
1Y2
14
8
1
1A3
1OE
1Y3
12
17
2A0
2Y0
3
15
2A1
2Y1
5
13
2A2
2Y2
7
11
19
2A3
2OE
2Y3
9
mna170
Fig 1. Functional diagram
1
EN
18
16
14
12
1A0
2
18
1Y0
2A0
17
3
2Y0
2
4
1A1
4
16
1Y1
2A1
15
5
2Y1
6
8
1A2
6
14
1Y2
2A2
13
7
2Y2
19
EN
9
7
5
3
mna873
1A3
1OE
8
1
12
1Y3
2A3
2OE
11
19
9
2Y3
11
13
mna874
15
17
Fig 2. Logic symbol
Fig 3. IEC logic symbol
74AHC_AHCT244_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 20 December 2007
2 of 16
NXP Semiconductors
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
74AHC244
74AHCT244
1OE
2
3
4
5
6
7
8
9
GND 10
2A3 11
GND
(1)
1
terminal 1
index area
20 V
CC
19 2OE
18 1Y0
17 2A0
16 1Y1
15 2A1
14 1Y2
13 2A2
12 1Y3
74AHC244
74AHCT244
1OE
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
1
2
3
4
5
6
7
8
9
20 V
CC
19 2OE
18 1Y0
17 2A0
16 1Y1
15 2A1
14 1Y2
13 2A2
12 1Y3
11 2A3
001aae258
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
GND 10
001aah079
Transparent top view
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 4. Pin configuration SO20, TSSOP20
Fig 5. Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Symbol
1OE
1A[0:3]
2A[0:3]
1Y[0:3]
2Y[0:3]
GND
2OE
V
CC
Pin description
Pin
1
2, 4, 6, 8
Description
output enable input (active LOW)
data input
17, 15, 13, 11 data input
18, 16, 14, 12 data output
3, 5, 7, 9
10
19
20
data output
ground (0 V)
output enable input (active LOW)
supply voltage
74AHC_AHCT244_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 20 December 2007
3 of 16
NXP Semiconductors
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
6. Functional description
Table 3.
Control
nOE
L
H
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
Function table
[1]
Input
nAn
L
H
X
Output
nYn
L
H
Z
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
V
I
I
IK
I
OK
I
O
I
CC
I
GND
T
stg
P
tot
Parameter
supply voltage
input voltage
input clamping current
output clamping current
output current
supply current
ground current
storage temperature
total power dissipation
SO20 package
TSSOP20 package
DHVQFN20 package
[1]
[2]
[3]
[4]
Conditions
Min
−0.5
−0.5
Max
+7.0
+7.0
-
±20
±25
75
-
+150
500
500
500
Unit
V
V
mA
mA
mA
mA
mA
°C
mW
mW
mW
V
I
<
−0.5
V
V
O
<
−0.5
V or V
O
> V
CC
+ 0.5 V
V
O
=
−0.5
V to (V
CC
+ 0.5 V)
[1]
[1]
−20
-
-
-
−75
−65
T
amb
=
−40 °C
to +125
°C
[2]
[3]
[4]
-
-
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
P
tot
derates linearly with 8 mW/K above 70
°C.
P
tot
derates linearly with 5.5 mW/K above 60
°C.
P
tot
derates linearly with 4.5 mW/K above 60
°C.
74AHC_AHCT244_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 20 December 2007
4 of 16
NXP Semiconductors
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
V
CC
V
I
V
O
T
amb
∆t/∆V
supply voltage
input voltage
output voltage
ambient temperature
input transition rise
and fall rate
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Conditions
74AHC244
Min
2.0
0
0
−40
-
-
Typ
5.0
-
-
+25
-
-
Max
5.5
5.5
V
CC
+125
100
20
74AHCT244
Min
4.5
0
0
−40
-
-
Typ
5.0
-
-
+25
-
-
Max
5.5
5.5
V
CC
+125
-
20
V
V
V
°C
ns/V
ns/V
Unit
9. Static characteristics
Table 6.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
For type 74AHC244
V
IH
HIGH-level
input voltage
V
CC
= 2.0 V
V
CC
= 3.0 V
V
CC
= 5.5 V
V
IL
LOW-level
input voltage
V
CC
= 2.0 V
V
CC
= 3.0 V
V
CC
= 5.5 V
V
OH
HIGH-level
V
I
= V
IH
or V
IL
output voltage
I
O
=
−50 µA;
V
CC
= 2.0 V
I
O
=
−50 µA;
V
CC
= 3.0 V
I
O
=
−50 µA;
V
CC
= 4.5 V
I
O
=
−4.0
mA; V
CC
= 3.0 V
I
O
=
−8.0
mA; V
CC
= 4.5 V
V
OL
LOW-level
V
I
= V
IH
or V
IL
output voltage
I
O
= 50
µA;
V
CC
= 2.0 V
I
O
= 50
µA;
V
CC
= 3.0 V
I
O
= 50
µA;
V
CC
= 4.5 V
I
O
= 4.0 mA; V
CC
= 3.0 V
I
O
= 8.0 mA; V
CC
= 4.5 V
I
OZ
OFF-state
V
I
= V
IH
or V
IL
;
output current V
O
= V
CC
or GND;
V
CC
= 5.5 V
input leakage
current
V
I
= 5.5 V or GND;
V
CC
= 0 V to 5.5 V
1.5
2.1
3.85
-
-
-
1.9
2.9
4.4
2.58
3.94
-
-
-
-
-
-
-
-
-
-
-
-
2.0
3.0
4.5
-
-
0
0
0
-
-
-
-
-
-
0.5
0.9
1.65
-
-
-
-
-
0.1
0.1
0.1
0.36
0.36
±0.25
1.5
2.1
3.85
-
-
-
1.9
2.9
4.4
2.48
3.8
-
-
-
-
-
-
-
-
-
0.5
0.9
1.65
-
-
-
-
-
0.1
0.1
0.1
0.44
0.44
±2.5
1.5
2.1
3.85
-
-
-
1.9
2.9
4.4
2.40
3.70
-
-
-
-
-
-
-
-
-
0.5
0.9
1.65
-
-
-
-
-
0.1
0.1
0.1
0.55
0.55
±10.0
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
Conditions
Min
25
°C
Typ
Max
−40 °C
to +85
°C −40 °C
to +125
°C
Unit
Min
Max
Min
Max
I
I
I
CC
-
-
-
-
0.1
4.0
-
-
1.0
40
-
-
2.0
80
µA
µA
supply current V
I
= V
CC
or GND; I
O
= 0 A;
V
CC
= 5.5 V
74AHC_AHCT244_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 20 December 2007
5 of 16
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参数对比
与74AHC244D,118相近的元器件有：74AHCT244PW,112、74AHC244D,112、74AHCT244D,112、74AHCT244BQ,115、74AHC244PW,118、74AHCT244D,118、74AHC244BQ,115、74AHCT244PW,118。描述及对比如下：
型号 74AHC244D,118 74AHCT244PW,112 74AHC244D,112 74AHCT244D,112 74AHCT244BQ,115 74AHC244PW,118 74AHCT244D,118 74AHC244BQ,115 74AHCT244PW,118
描述 buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state buffers & line drivers octal buffer 3-state
Brand Name NXP Semiconductor NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SOP TSSOP2 SOP SOP QFN TSSOP2 SOP QFN TSSOP2
包装说明 SOP, SOP20,.4 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 SOP, SOP20,.4 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 TSSOP, TSSOP20,.25 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 HVQCCN, LCC20,.1X.18,20 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
针数 20 20 20 20 20 20 20 20 20
制造商包装代码 SOT163-1 SOT360-1 SOT163-1 SOT163-1 SOT764-1 SOT360-1 SOT163-1 SOT764-1 SOT360-1
Reach Compliance Code compliant compli compli compli compli compliant compliant compliant compliant
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
系列 AHC/VHC/H/U/V AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20
长度 12.8 mm 6.5 mm 12.8 mm 12.8 mm 4.5 mm 6.5 mm 12.8 mm 4.5 mm 6.5 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I（ol） 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
湿度敏感等级 1 1 1 1 1 1 1 1 1
位数 4 4 4 4 4 4 4 4 4
功能数量 2 2 2 2 2 2 2 2 2
端口数量 2 2 2 2 2 2 2 2 2
端子数量 20 20 20 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP SOP SOP HVQCCN TSSOP SOP HVQCCN TSSOP
封装等效代码 SOP20,.4 TSSOP20,.25 SOP20,.4 SOP20,.4 LCC20,.1X.18,20 TSSOP20,.25 SOP20,.4 LCC20,.1X.18,20 TSSOP20,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL TUBE TUBE TUBE TAPE AND REEL TAPE AND REEL TAPE AND REEL TUBE TAPE AND REEL
峰值回流温度（摄氏度） 260 260 260 260 260 260 260 260 260
电源 2/5.5 V 5 V 2/5.5 V 5 V 5 V 2/5.5 V 5 V 2/5.5 V 5 V
传播延迟（tpd） 15 ns 10.5 ns 15 ns 10.5 ns 10.5 ns 15 ns 10.5 ns 15 ns 10.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.65 mm 1.1 mm 2.65 mm 2.65 mm 1 mm 1.1 mm 2.65 mm 1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 2 V 4.5 V 4.5 V 2 V 4.5 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU)
端子形式 GULL WING GULL WING GULL WING GULL WING NO LEAD GULL WING GULL WING NO LEAD GULL WING
端子节距 1.27 mm 0.65 mm 1.27 mm 1.27 mm 0.5 mm 0.65 mm 1.27 mm 0.5 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL QUAD DUAL DUAL QUAD DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30 30
宽度 7.5 mm 4.4 mm 7.5 mm 7.5 mm 2.5 mm 4.4 mm 7.5 mm 2.5 mm 4.4 mm
JESD-609代码 e4 e4 e4 e4 e4 e4 e4 e4 -
Prop。Delay @ Nom-Sup 9.5 ns - - - - 9.5 ns 10.5 ns 9.5 ns 10.5 ns
负载电容（CL） - 50 pF - 50 pF 50 pF - 50 pF - 50 pF
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器件捷径:
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