型号
- 型号
- 关键词
| 型号 | 74FCT373APCQR | 74FCT373ALCQR | 74FCT373ASCQR | 74FCT373ALC | 74FCT373AFC | 74FCT373AFCQR |
|---|---|---|---|---|---|---|
| 描述 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, SOIC-20 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | IC FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
| 零件包装代码 | DIP | QLCC | SOIC | QLCC | DFP | DFP |
| 包装说明 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | SOP, SOP20,.4 | QCCN, LCC20,.35SQ | DFP, FL20,.3 | DFP, FL20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDIP-T20 | S-CQCC-N20 | R-PDSO-G20 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 24.892 mm | 8.89 mm | 12.8 mm | 8.89 mm | 13.72 mm | 13.72 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | SOP | QCCN | DFP | DFP |
| 封装等效代码 | DIP20,.3 | LCC20,.35SQ | SOP20,.4 | LCC20,.35SQ | FL20,.3 | FL20,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 传播延迟（tpd） | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.905 mm | 2.65 mm | 1.905 mm | 2.286 mm | 2.286 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | FLAT | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 7.62 mm | 8.89 mm | 7.5 mm | 8.89 mm | 6.731 mm | 6.731 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Prop。Delay @ Nom-Sup | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 8.5 ns | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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