74HC(T)14 - Hex inverting Schmitt trigger SSOP1 14-Pin
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
器件标准:
下载文档型号 | 74HC14DB,118 | 74HC14PW-T | 74HCT14PW-T | 74HC14N/S212,112 | 74HC14N/S242,112 | 74HCT14D/S206,118 | 74HCT14D/S242,118 | 74HC14D/S242,118 |
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描述 | 74HC(T)14 - Hex inverting Schmitt trigger SSOP1 14-Pin | IC HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOT-402-1, TSSOP-14, Gate | IC HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOT-402-1, TSSOP-14, Gate | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,DIP,14PIN,PLASTIC | Hex inverting Schmitt trigger, SOT27-1 Package, Standard Marking, IC'S Tube - DSC Bulk Pack | IC IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,SOP,14PIN,PLASTIC, Gate | Hex inverting Schmitt trigger, SOT108-1 Package, Standard Marking, Reel Pack, SMD, 13" | Hex inverting Schmitt trigger, SOT108-1 Package, Standard Marking, Reel Pack, SMD, 13" |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | compliant | unknown | unknow |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | AND GATE | INVERTER | AND GATE | INVERTER | INVERTER |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | TSSOP | TSSOP | DIP | DIP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | NO | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
包装说明 | SSOP, SSOP14,.3 | TSSOP, | TSSOP, | - | - | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 |
JESD-609代码 | e4 | e4 | e4 | e3 | - | e3 | - | - |
最大I(ol) | 0.004 A | - | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | - | - |
封装等效代码 | SSOP14,.3 | - | - | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | SOP14,.25 |
包装方法 | TAPE AND REEL | - | - | TUBE | TUBE | TAPE AND REEL | TAPE AND REEL | TR |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | - | NOT SPECIFIED | - | - |
电源 | 2/6 V | - | - | 2/6 V | 2/6 V | 5 V | 5 V | 2/6 V |
Prop。Delay @ Nom-Sup | 38 ns | - | - | 38 ns | 38 ns | 51 ns | 51 ns | - |
施密特触发器 | YES | - | - | YES | YES | YES | YES | YES |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | - |
端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | Matte Tin (Sn) | - | - |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | - | NOT SPECIFIED | - | - |
Source Url Status Check Date | - | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - | 2013-10-15 00:00:00 | - | 2013-10-15 00:00:00 | 2013-10-15 00:00:00 |