型号 | 74HC2G17GV,125 | 74HCT2G17GW,125 | 74HCT2G17GV,125 | 74HC2G17GW,125 |
---|---|---|---|---|
描述 | IC BUFFER NON-INVERT 6V 6TSOP | IC BUF NON-INVERT 5.5V 6TSSOP | IC BUFFER NON-INVERT 5.5V 6TSOP | 逻辑电路的归属系列:74HC 逻辑类型:缓冲器,非反向 元件数:2 每元件位数:1 |
Brand Name | Nexperia | Nexperia | Nexperia | Nexperia |
零件包装代码 | TSOP | TSSOP | TSOP | TSSOP |
包装说明 | TSOP, | TSSOP, | TSOP, | TSSOP, |
针数 | 6 | 6 | 6 | 6 |
制造商包装代码 | SOT457 | SOT363 | SOT457 | SOT363 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
系列 | HC/UH | HCT | HCT | HC/UH |
JESD-30 代码 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 |
JESD-609代码 | e3 | e3 | e3 | e3 |
长度 | 2.9 mm | 2 mm | 2.9 mm | 2 mm |
逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER |
湿度敏感等级 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 |
输入次数 | 1 | 1 | 1 | 1 |
端子数量 | 6 | 6 | 6 | 6 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP | TSSOP | TSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 175 ns | 175 ns | 175 ns | 175 ns |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.95 mm | 0.65 mm | 0.95 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 1.5 mm | 1.25 mm | 1.5 mm | 1.25 mm |