型号
- 型号
- 关键词
| 型号 | 74HCT4066BQ | 74HC4066PW | 74HCT4066DB | 74HC4066D | 74HCT4066PW | 74HC4066BQ |
|---|---|---|---|---|---|---|
| 描述 | SPST | SPST | SPST | SPST | SPST | SPST |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | DHVQFN-14 | TSSOP, | SSOP, | SOP, | TSSOP, | DHVQFN-14 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PQCC-N14 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 5 mm | 6.2 mm | 8.65 mm | 5 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | 5 Ω | 5 Ω | 5 Ω | 5 Ω | 5 Ω | 5 Ω |
| 最大通态电阻 (Ron) | 142 Ω | 142 Ω | 142 Ω | 142 Ω | 142 Ω | 142 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | TSSOP | SSOP | SOP | TSSOP | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 座面最大高度 | 1 mm | 1.1 mm | 2 mm | 1.75 mm | 1.1 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 10 V | 5.5 V | 10 V | 5.5 V | 10 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 53 ns | 45 ns | 53 ns | 45 ns | 53 ns | 45 ns |
| 最长接通时间 | 36 ns | 30 ns | 36 ns | 30 ns | 36 ns | 30 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.5 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 2.5 mm | 4.4 mm | 5.3 mm | 3.9 mm | 4.4 mm | 2.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
