型号
- 型号
- 关键词
| 型号 | 74LV273DB | 74LV273PW | 74LV273N | 74LV273PW-T | 74LV273DB-T | 74LV273D |
|---|---|---|---|---|---|---|
| 描述 | Flip Flops 3.3V D-TYPE W/RESET POS | Flip Flops 3.3V D-TYPE W/RESET POS | Flip Flops 3.3V D-TYPE W/RESET POS | Flip Flops 3.3V D-TYPE W/RESET POS | Flip Flops 3.3V D-TYPE W/RESET POS | Flip Flops 3.3V D-TYPE W/RESET POS |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 7.2 mm | 6.5 mm | 26.73 mm | 6.5 mm | 7.2 mm | 12.8 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | TSSOP | DIP | TSSOP | SSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 |
| 传播延迟（tpd） | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 1.1 mm | 4.2 mm | 1.1 mm | 2 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 | 30 | 30 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 5.3 mm | 4.4 mm | 7.62 mm | 4.4 mm | 5.3 mm | 7.5 mm |
| 最小 fmax | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
| 包装说明 | SSOP, SSOP20,.3 | TSSOP, TSSOP20,.25 | - | TSSOP, | SSOP, | SOP, SOP20,.4 |
| 最大频率@ Nom-Sup | 20000000 Hz | 20000000 Hz | 20000000 Hz | - | - | 20000000 Hz |
| 最大I（ol） | 0.006 A | 0.006 A | 0.006 A | - | - | 0.006 A |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 |
| 封装等效代码 | SSOP20,.3 | TSSOP20,.25 | DIP20,.3 | - | - | SOP20,.4 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V |
| Prop。Delay @ Nom-Sup | 24 ns | 24 ns | 24 ns | - | - | 24 ns |
