HIGH SPEED MEZZANINE
APPLICATION SPECIFICATION
HIGH SPEED MEZZANINE
BOARD TO BOARD CONNECTOR
75005 Receptacle Assembly
75003 Plug Assembly
Table of Contents
1.0
2.0
3.0
4.0
Scope
Product Description
Applicable Documents and Specifications
Insertion and Withdrawal of Connectors
4.1 Recommended Insertion and Withdrawal
4.2 Maximum Offset
4.3 Mating Sequence
Application to PCB
5.1 Recommended Stencil Layout
5.2 Reflow and Rework Profile
5.3 Recommended PCB Thickness
5.4 Inspection
Stack Heights
5.0
6.0
REVISION:
ECR/ECN INFORMATION: TITLE:
EC No:
UCP2003-2204
DATE:
2003 / 04 / 09
C
APPLICATION SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
BOARD TO BOARD CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
1
of
9
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
AS-75005-001
Ken Stiles
Ken Stiles
Manny Banakis
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HIGH SPEED MEZZANINE
APPLICATION SPECIFICATION
1.0 SCOPE
This specification covers the mating and unmating process, soldering process, and board layout techniques for
the High Speed Mezzanine connector. The interface consists of a differential pair of signal lines over molded in
plastic surrounded by a plated plastic housing. The signal contacts are on 1.2mm pitch, with the differential
pairs being on 3.51mm pitch.
2.0 PRODUCT DESCRIPTION
2.1 Product Name and Part Numbers:
High Speed Mezzanine Connector
Plug Assemblies
Series 75003
Receptacle Assemblies
Series 75005
2.2 Dimensions, Materials, Platings, and Markings:
(See appropriate sales drawings for information)
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
Product Specification
Sales Drawing
Sales Drawing
Sales Drawing
PS-75005-001
SD-75003-001
SD-75005-001
RSD-75005-001
REVISION:
ECR/ECN INFORMATION: TITLE:
EC No:
UCP2003-2204
DATE:
2003 / 04 / 09
C
APPLICATION SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
BOARD TO BOARD CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
2
of
9
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
AS-75005-001
Ken Stiles
Ken Stiles
Manny Banakis
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HIGH SPEED MEZZANINE
APPLICATION SPECIFICATION
4.0 INSERTION AND WITHDRAWAL
This section describes the preferred methods for inserting and withdrawing the High Speed Mezzanine
connectors. It also describes the special zippering feature of this connector which allows for the full rotation of
the connector about a specific point of rotation.
4.1 Preferred Method of Insertion and Withdrawal:
INSERTION
Figure 1 is the preferred method of insertion. Straight
insertion of the connectors insures proper alignment
during the mating process.
Zippering during Insertion:
The “zippering” together of the connectors during
insertion is permissible. This can reduce the amount of
force required to insert the connector. However, to do
this the mating connector must be properly placed at the
point of rotation. See Figure 2.
Figure 1
WITHDRAWAL
Zippering during Withdrawal:
Zippering the connector during the withdrawal
process is the preferred method of withdrawing the
connector. This allows for reduced withdrawal
forces. The connector is designed to rotate fully
about its point of rotation during the withdrawal
process, without binding or damaging the
components of the connector.
The connector may also be withdrawn evenly with
out damaging any components of the connector.
This method is less preferable only because it
requires more force during the withdrawal
process.
Rotation
Point
Figure 2
REVISION:
ECR/ECN INFORMATION: TITLE:
EC No:
UCP2003-2204
DATE:
2003 / 04 / 09
C
APPLICATION SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
BOARD TO BOARD CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
3
of
9
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
AS-75005-001
Ken Stiles
Ken Stiles
Manny Banakis
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HIGH SPEED MEZZANINE
APPLICATION SPECIFICATION
4.2 Maximum Offset in X and Y Direction During Insertion:
Centerline
Centerline
Maximum Offset = 0.85 mm
Maximum Offset = 0.80 mm
Centerline
Centerline
X-Direction
4.3 Mating Sequence During Insertion:
Y-Direction
Initial = 0.00mm
Signals Contact = 2.50mm
Step 1
Step 2
Ground Mating Area = 0.75mm
C1
Signal Mating Area = 0.75mm
Grounds Contact = 4.40mm
C2
Final Seating = 5.50mm
Step 3
Step 4
Mating Height = C1 + C2 (C1 and C2 are the same as Dimension C on the Sales Drawing)
REVISION:
ECR/ECN INFORMATION: TITLE:
EC No:
UCP2003-2204
DATE:
2003 / 04 / 09
C
APPLICATION SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
BOARD TO BOARD CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
4
of
9
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
AS-75005-001
Ken Stiles
Ken Stiles
Manny Banakis
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HIGH SPEED MEZZANINE
APPLICATION SPECIFICATION
5.0 Application to PCB
This product is designed for Pin thru Paste attachment and recommended for convection or IR reflow processing.
Refer to the following sections for information on the proper solder stencil layout, reflow temperatures,
appropriate PCB thickness’s, and inspection of the attachment.
5.1 Recommended Stencil Layout:
12 Pair Stencil Shown for Reference
(Dimensions B and D are equivalent to Dimensions B and D on the Sales Drawings.)
Note: The 2.00x2.00mm Apetures should be centered over the ground peg plated thru holes.
REVISION:
ECR/ECN INFORMATION: TITLE:
EC No:
UCP2003-2204
DATE:
2003 / 04 / 09
C
APPLICATION SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
BOARD TO BOARD CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
5
of
9
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
AS-75005-001
Ken Stiles
Ken Stiles
Manny Banakis
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
