BergStik 2.54mm
Unshrouded Headers
®
BergStik
®
2.54mm pitch unshrouded headers provide Board-
to-Board, Wire-to-Board and Cable-to-Board interconnect
solutions for all types of electronic equipment and devices.
www.fci.com/products/bergstik
CONTENT PAGE
BERGSTIK
®
2.54MM UNSHROUDED HEADERS
Overview
For Pin-in-Paste Processes
Vertical Headers Standard sizes
Vertical Headers Special sizes
Continuous Headers
Right Angle Headers Standard sizes
Right Angle Headers Special sizes
Stacking Headers
3
4-7
8-9
10-11
12-13
14-15
16-17
18-19
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
2
BOARD/WIRE-TO-BOARD
CONNECTORS
BERGSTIK
®
2.54MM
UNSHROUDED HEADERS
OVERVIEW
BergStik
®
2.54mm unshrouded headers are available in
surface-mount (SMT), through-hole (THT), press-fit, stacking
and pin-in-paste (PIP) versions. Designed in single and double
row, they are available in straight or right angle options, from
2 to 72 positions.
Featuring a “breakaway” design, each connector can be cut or
broken to length to suit the application profile. The maximum
current rating is 3A per contact.
This product range is extended with BergStik
®
2.54mm
unshrouded vertical headers in 0.25µm plating, available in
standard sizes. It offers an economical solution for various
applications. It is also specified up to 100 mating cycles.
BergStik
®
product range provides Board-to-Board, Wire-
to-Board and Cable-to-Board interconnect solutions for all
electronic equipment and devices.
FEATURES
• High temperature thermoplastic material
• Variable spacing height for stacking headers
• Allow dual entry; mating from top or bottom
• Blank 0.64mm square contacts presents 4 surfaces of
equal quality
• Standoff design
• Duplex plating
• Tin-lead plating in press-fit area
• Retention legs option
• Press-fit designed to fit 1.02mm diameter hole, solder-to-
board product
• Meets DIN 41651 specification, HE13 and BT D2632
BENEFITS
• Reflow compatible
• Cater to a wide range of applications
• Suitable for mezzanine application and gives more flexibility in
meeting different stack height requirements
• Can be used for wire wrapping
• Allows cleaning to remove soldering contamination
• Cost-efficient
• Easy pin insertion onto PCB
• High retention force onto PCB
• Same layout on THT and press-fit
• Qualified product
www.fci.com/products/bergstik
3
BOARD/WIRE-TO-BOARD
CONNECTORS
BERGSTIK
®
UNSHROUDED HEADERS
FOR PIN-IN-PASTE PROCESSES
Pin-in-Paste (PIP) technology allows the use of THT products in SMT manufacturing processes. THT connectors are automatically or
manually soldered to PCB, and soldered in the same operation as the SMT connectors. Mechanical strength is retained through THT leads.
This process is critical for applications in industrial and automotive markets.
PRODUCT
PLASTIC MATERIAL
BergStik
®
PIP headers are moulded in high temperature thermoplastic. The headers are able to withstand exposure to 260°C peak
temperature for 30 seconds maximum in a convection, infrared or vapor phase reflow oven.
HOUSING DESIGN
A special housing has been developed for the double row straight product. A row of higher standoffs has been placed in the longitudinal
center axis, between both rows of pins for a good solder paste deposit around the pin. Please follow the stencil design guidelines TA-894
and TA-897 on the following page in order to avoid solder paste deposit under the standoffs.
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BERGSTIK
®
UNSHROUDED HEADERS
FOR PIN-IN-PASTE PROCESSES
APPLICATION
FCI’s application guideline helps to achieve optimum performance for BergStik
®
PIP process.
STENCIL DESIGN
The stencil design is crucial for a good solder joint. It determines
the amount of paste and the position of the paste print on the
board. Each PCB hole has its own stencil aperture with enough
spacing in between to allow separate solder deposits. This prevents
solder robbing from one hole to another and ensures the correct
amount of solder paste for each hole. The print position is placed
asymmetrical to optimize the flow of molten solder paste.
PASTE APPLICATION
The amount of paste for each hole depends on the soldering process
parameters and the degree of hole filling. It is recommended to
apply the squeegee at a 45° angle. You can use a smaller angle for an
even greater degree of hole filling. The squeegee moves in parallel
with the shorter sides of the stencil apertures.
BOARD LAYOUT
Please use a hole of 1.00 +/– 0.05 mm for an optimum paste deposit.
For automatic pick-and place, lean towards the upper end of the
tolerance. Refer to TA-894 for further information.
www.fci.com/products/bergstik
5
嵌入式系统
