描述 |
-0, Tube |
-0, Tube |
-0, Tube |
-0, Tube |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
是否无铅 |
含铅 |
含铅 |
含铅 |
含铅 |
厂商名称 |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
包装说明 |
PGA-142 |
PGA-142 |
PGA-142 |
PGA, PGA142,13X13 |
制造商包装代码 |
GU142 |
GU142 |
GU142 |
GU142 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
最长访问时间 |
20 ns |
25 ns |
30 ns |
25 ns |
其他特性 |
SEATED HGT-CALCULATED |
SEATED HGT-CALCULATED |
SEATED HGT-CALCULATED |
SEATED HGT-CALCULATED |
I/O 类型 |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 代码 |
S-CPGA-P142 |
S-CPGA-P142 |
S-CPGA-P142 |
S-CPGA-P142 |
JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
长度 |
34.036 mm |
34.036 mm |
34.036 mm |
34.036 mm |
内存密度 |
147456 bit |
147456 bit |
147456 bit |
147456 bit |
内存集成电路类型 |
MULTI-PORT SRAM MODULE |
MULTI-PORT SRAM MODULE |
MULTI-PORT SRAM MODULE |
MULTI-PORT SRAM MODULE |
内存宽度 |
36 |
36 |
36 |
36 |
湿度敏感等级 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
端口数量 |
2 |
2 |
2 |
2 |
端子数量 |
142 |
142 |
142 |
142 |
字数 |
4096 words |
4096 words |
4096 words |
4096 words |
字数代码 |
4000 |
4000 |
4000 |
4000 |
工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
70 °C |
70 °C |
125 °C |
125 °C |
组织 |
4KX36 |
4KX36 |
4KX36 |
4KX36 |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
封装代码 |
PGA |
PGA |
PGA |
PGA |
封装等效代码 |
PGA142,13X13 |
PGA142,13X13 |
PGA142,13X13 |
PGA142,13X13 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
并行/串行 |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
电源 |
5 V |
5 V |
5 V |
5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
6.223 mm |
6.223 mm |
6.223 mm |
6.223 mm |
最大压摆率 |
1.44 mA |
1.36 mA |
1.44 mA |
1.48 mA |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
NO |
NO |
NO |
NO |
技术 |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
温度等级 |
COMMERCIAL |
COMMERCIAL |
MILITARY |
MILITARY |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
端子形式 |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
端子节距 |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
端子位置 |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
34.036 mm |
34.036 mm |
34.036 mm |
34.036 mm |