型号 | 7MP4045SA25M | IDT7MP4045S55Z | IDT7MP4045S45Z | IDT7MP4045S55M | 7MP4045S45Z | 7MP4045S12Z | 7MP4045S17Z | 7MP4045SA17Z |
---|---|---|---|---|---|---|---|---|
描述 | SRAM Module, 256KX32, 25ns, CMOS, SIMM-64 | SRAM Module, 256KX32, 55ns, CMOS, PZIP64 | SRAM Module, 256KX32, 45ns, CMOS, PZIP64 | SRAM Module, 256KX32, 55ns, CMOS, PSMA64 | BOARD-64, Box | SRAM Module, 256KX32, 12ns, BICMOS, ZIP-64 | SRAM Module, 256KX32, 17ns, BICMOS, ZIP-64 | SRAM Module, 256KX32, 17ns, BICMOS, ZIP-64 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | not_compliant | not_compliant | not_compliant | not_compliant |
最长访问时间 | 25 ns | 55 ns | 45 ns | 55 ns | 45 ns | 12 ns | 17 ns | 17 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XSMA-N64 | R-PZIP-T64 | R-PZIP-T64 | R-PSMA-N64 | R-PZIP-T64 | R-XZMA-T64 | R-XZMA-T64 | R-XZMA-T64 |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | SIMM | ZIP | ZIP | SIMM | ZIP | ZIP | ZIP | ZIP |
封装等效代码 | SSIM64 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | SSIM64 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE | MICROELECTRONIC ASSEMBLY | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 16.002 mm | 16.002 mm | 15.24 mm | 16.002 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
最大压摆率 | 1.36 mA | 0.96 mA | 1.2 mA | 0.96 mA | 1.2 mA | 1.6 mA | 1.6 mA | 1.6 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | BICMOS | BICMOS | BICMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | SINGLE | ZIG-ZAG | ZIG-ZAG | SINGLE | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
是否无铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
峰值回流温度(摄氏度) | 225 | - | 225 | - | NOT SPECIFIED | 225 | 260 | 225 |
最大待机电流 | 0.12 A | - | 0.08 A | - | 0.08 A | 0.32 A | 0.32 A | 0.32 A |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
处于峰值回流温度下的最长时间 | 30 | - | 30 | - | NOT SPECIFIED | 30 | 6 | 30 |