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82V3352TF

TQFP-64, Tray

器件类别:电信电路   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
Brand Name
Integrated Device Technology
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
TQFP
包装说明
10 X 10 MM, 1.4 MM HEIGHT, MO-136BJ, MS-026BCC, LQFP-64
针数
64
制造商包装代码
PP64
Reach Compliance Code
not_compliant
ECCN代码
EAR99
Is Samacsys
N
JESD-30 代码
S-PQFP-G64
JESD-609代码
e0
长度
10 mm
湿度敏感等级
3
功能数量
1
端子数量
64
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装等效代码
QFP64,.47SQ,20
封装形状
SQUARE
封装形式
FLATPACK
峰值回流温度(摄氏度)
240
电源
3.3 V
认证状态
Not Qualified
座面最大高度
1.6 mm
最大压摆率
0.436 mA
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
电信集成电路类型
TELECOM CIRCUIT
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.8 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
10 mm
Base Number Matches
1
文档预览
SYNCHRONOUS ETHERNET
WAN PLL
IDT82V3352
Version 6
May 30, 2014
6024 Silver Creek Valley Road, San Jose, CA 95138
Telephone: (800) 345-7015 • TWX: 910-338-2070 • FAX: (408) 284-2775
Printed in U.S.A.
© 2014 Integrated Device Technology, Inc.
DISCLAIMER
Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best pos-
sible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The Company makes no representations that circuitry
described herein is free from patent infringement or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent, patent rights or other
rights, of Integrated Device Technology, Inc.
LIFE SUPPORT POLICY
Integrated Device Technology's products are not authorized for use as critical components in life support devices or systems unless a specific written agreement pertaining to such intended use is exe-
cuted between the manufacturer and an officer of IDT.
1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform, when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any components of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
Table of Contents
FEATURES .............................................................................................................................................................................. 8
HIGHLIGHTS.................................................................................................................................................................................................... 8
MAIN FEATURES ............................................................................................................................................................................................ 8
OTHER FEATURES ......................................................................................................................................................................................... 8
APPLICATIONS....................................................................................................................................................................... 8
DESCRIPTION......................................................................................................................................................................... 9
FUNCTIONAL BLOCK DIAGRAM ........................................................................................................................................ 10
1 PIN ASSIGNMENT ........................................................................................................................................................... 11
2 PIN DESCRIPTION .......................................................................................................................................................... 12
3 FUNCTIONAL DESCRIPTION ......................................................................................................................................... 16
3.1
3.2
3.3
RESET ........................................................................................................................................................................................................... 16
MASTER CLOCK .......................................................................................................................................................................................... 16
INPUT CLOCKS & FRAME SYNC SIGNALS ............................................................................................................................................... 17
3.3.1 Input Clocks .................................................................................................................................................................................... 17
3.3.2 Frame SYNC Input Signals ............................................................................................................................................................ 17
3.4 INPUT CLOCK PRE-DIVIDER ...................................................................................................................................................................... 18
3.5 INPUT CLOCK QUALITY MONITORING ..................................................................................................................................................... 19
3.5.1 Activity Monitoring ......................................................................................................................................................................... 19
3.5.2 Frequency Monitoring ................................................................................................................................................................... 20
3.6 DPLL INPUT CLOCK SELECTION .............................................................................................................................................................. 21
3.6.1 External Fast Selection .................................................................................................................................................................. 21
3.6.2 Forced Selection ............................................................................................................................................................................ 22
3.6.3 Automatic Selection ....................................................................................................................................................................... 22
3.7 SELECTED INPUT CLOCK MONITORING .................................................................................................................................................. 23
3.7.1 DPLL Locking Detection ................................................................................................................................................................ 23
3.7.1.1 Fast Loss .......................................................................................................................................................................... 23
3.7.1.2 Coarse Phase Loss .......................................................................................................................................................... 23
3.7.1.3 Fine Phase Loss ............................................................................................................................................................... 23
3.7.1.4 Hard Limit Exceeding ....................................................................................................................................................... 23
3.7.2 Locking Status ............................................................................................................................................................................... 23
3.7.3 Phase Lock Alarm .......................................................................................................................................................................... 23
3.8 SELECTED INPUT CLOCK SWITCH ........................................................................................................................................................... 25
3.8.1 Input Clock Validity ........................................................................................................................................................................ 25
3.8.2 Selected Input Clock Switch ......................................................................................................................................................... 25
3.8.2.1 Revertive Switch ............................................................................................................................................................... 25
3.8.2.2 Non-Revertive Switch ....................................................................................................................................................... 25
3.8.3 Selected / Qualified Input Clocks Indication ................................................................................................................................ 25
3.9 SELECTED INPUT CLOCK STATUS VS. DPLL OPERATING MODE ....................................................................................................... 27
3.9.1 T0 Selected Input Clock vs. DPLL Operating Mode .................................................................................................................... 27
3.10 DPLL OPERATING MODE ........................................................................................................................................................................... 29
3.10.1 T0 DPLL Operating Mode .............................................................................................................................................................. 29
3.10.1.1 Free-Run Mode ................................................................................................................................................................ 29
3.10.1.2 Pre-Locked Mode ............................................................................................................................................................. 29
3.10.1.3 Locked Mode .................................................................................................................................................................... 29
3.10.1.3.1 Temp-Holdover Mode .................................................................................................................................... 29
3.10.1.4 Lost-Phase Mode ............................................................................................................................................................. 29
Table of Contents
3
May 30, 2014
IDT82V3352
SYNCHRONOUS ETHERNET WAN PLL
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.10.1.5 Holdover Mode ................................................................................................................................................................. 29
3.10.1.5.1 Automatic Instantaneous ............................................................................................................................... 30
3.10.1.5.2 Automatic Slow Averaged ............................................................................................................................. 30
3.10.1.5.3 Automatic Fast Averaged .............................................................................................................................. 30
3.10.1.5.4 Manual ........................................................................................................................................................... 30
3.10.1.5.5 Holdover Frequency Offset Read .................................................................................................................. 30
3.10.1.6 Pre-Locked2 Mode ........................................................................................................................................................... 30
DPLL OUTPUT .............................................................................................................................................................................................. 31
3.11.1 PFD Output Limit ............................................................................................................................................................................ 31
3.11.2 Frequency Offset Limit .................................................................................................................................................................. 31
3.11.3 PBO ................................................................................................................................................................................................. 31
3.11.4 Phase Offset Selection .................................................................................................................................................................. 31
3.11.5 Four Paths of T0 DPLL Outputs .................................................................................................................................................... 31
3.11.5.1 T0 Path ............................................................................................................................................................................. 31
T0 / T4 APLL ................................................................................................................................................................................................. 32
OUTPUT CLOCKS & FRAME SYNC SIGNALS ........................................................................................................................................... 32
3.13.1 Output Clocks ................................................................................................................................................................................. 32
3.13.2 Frame SYNC Output Signals ......................................................................................................................................................... 35
INTERRUPT SUMMARY ............................................................................................................................................................................... 37
T0 SUMMARY ............................................................................................................................................................................................... 37
POWER SUPPLY FILTERING TECHNIQUES ............................................................................................................................................. 38
LINE CARD APPLICATION .......................................................................................................................................................................... 39
4 MICROPROCESSOR INTERFACE .................................................................................................................................. 40
5 JTAG ................................................................................................................................................................................ 42
6 PROGRAMMING INFORMATION .................................................................................................................................... 43
6.1
6.2
REGISTER MAP ............................................................................................................................................................................................ 43
REGISTER DESCRIPTION ........................................................................................................................................................................... 48
6.2.1 Global Control Registers ............................................................................................................................................................... 48
6.2.2 Interrupt Registers ......................................................................................................................................................................... 55
6.2.3 Input Clock Frequency & Priority Configuration Registers ....................................................................................................... 59
6.2.4 Input Clock Quality Monitoring Configuration & Status Registers ........................................................................................... 70
6.2.5 T0 DPLL Input Clock Selection Registers .................................................................................................................................... 81
6.2.6 T0 DPLL State Machine Control Registers .................................................................................................................................. 84
6.2.7 T0 DPLL & APLL Configuration Registers ................................................................................................................................... 86
6.2.8 Output Configuration Registers .................................................................................................................................................... 97
6.2.9 PBO & Phase Offset Control Registers ...................................................................................................................................... 100
6.2.10 Synchronization Configuration Registers ................................................................................................................................. 102
JUNCTION TEMPERATURE ...................................................................................................................................................................... 104
EXAMPLE OF JUNCTION TEMPERATURE CALCULATION ................................................................................................................... 104
HEATSINK EVALUATION .......................................................................................................................................................................... 104
7 THERMAL MANAGEMENT ........................................................................................................................................... 104
7.1
7.2
7.3
8.1
8.2
8.3
8 ELECTRICAL SPECIFICATIONS .................................................................................................................................. 105
8.4
8.5
ABSOLUTE MAXIMUM RATING ................................................................................................................................................................ 105
RECOMMENDED OPERATION CONDITIONS .......................................................................................................................................... 105
I/O SPECIFICATIONS ................................................................................................................................................................................. 106
8.3.1 CMOS Input / Output Port ............................................................................................................................................................ 106
8.3.2 PECL / LVDS Input / Output Port ................................................................................................................................................ 107
8.3.2.1 PECL Input / Output Port ................................................................................................................................................ 107
8.3.2.2 LVDS Input / Output Port ................................................................................................................................................ 109
8.3.2.3 Single-Ended Input for Differential Input ........................................................................................................................ 110
JITTER & WANDER PERFORMANCE ....................................................................................................................................................... 111
OUTPUT WANDER GENERATION ............................................................................................................................................................ 114
Table of Contents
4
May 30, 2014
IDT82V3352
SYNCHRONOUS ETHERNET WAN PLL
PACKAGE DIMENSIONS.................................................................................................................................................... 122
ORDERING INFORMATION................................................................................................................................................ 127
8.6
8.7
INPUT / OUTPUT CLOCK TIMING ............................................................................................................................................................. 115
OUTPUT CLOCK TIMING ........................................................................................................................................................................... 116
5
May 30, 2014
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参数对比
与82V3352TF相近的元器件有:82V3352EDG、82V3352TFG。描述及对比如下:
型号 82V3352TF 82V3352EDG 82V3352TFG
描述 TQFP-64, Tray TQFP-64, Tray TQFP-64, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅
是否Rohs认证 不符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 TQFP TQFP TQFP
包装说明 10 X 10 MM, 1.4 MM HEIGHT, MO-136BJ, MS-026BCC, LQFP-64 HTFQFP, TQFP64,.47SQ LQFP, QFP64,.47SQ,20
针数 64 64 64
制造商包装代码 PP64 EDG64 PPG64
Reach Compliance Code not_compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
Is Samacsys N N N
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609代码 e0 e3 e3
长度 10 mm 10 mm 10 mm
湿度敏感等级 3 3 3
功能数量 1 1 1
端子数量 64 64 64
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP HTFQFP LQFP
封装等效代码 QFP64,.47SQ,20 TQFP64,.47SQ QFP64,.47SQ,20
封装形状 SQUARE SQUARE SQUARE
封装形式 FLATPACK FLATPACK FLATPACK
峰值回流温度(摄氏度) 240 260 260
电源 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.2 mm 1.6 mm
最大压摆率 0.436 mA 0.436 mA 0.436 mA
标称供电电压 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
电信集成电路类型 TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.5 mm 0.8 mm
端子位置 QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 10 mm 10 mm 10 mm
Base Number Matches 1 1 1
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