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8329TCM-6ML

Thermal Interface Products THERM CONDV EPOXY MC 6ml(.20oz) SYRINGES

器件类别:热管理产品   

厂商名称:MG Chemicals

厂商官网:https://www.mgchemicals.com

器件标准:

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器件参数
参数名称
属性值
Product Attribute
Attribute Value
制造商
Manufacturer
MG Chemicals
产品种类
Product Category
Thermal Interface Products
Shipping Restrictions
Available in USA only. Must ship UPS or FedEx Ground.
RoHS
Details
类型
Type
Thermal Adhesive Compound
Breakdown Voltage
29 kVAC
Color
Gray
系列
Packaging
Bulk
Tensile Strength
1450 psi
工厂包装数量
Factory Pack Quantity
1
单位重量
Unit Weight
1 oz
文档预览
Technical Data Sheet
Medium Cure Thermally Conductive Adhesive
Description
8329TCM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, viscous, thixotropic,
and bonds well to a wide variety of substrates.
This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic
assemblies.
8329TCM has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity,
use 8329TFM. For a faster working life, use 8329TCF. For a longer working life, use 8329TCS.
8329TCM
Features and Benefits
• Thermal conductivity: 1.4 W/(m·K)
• 1:1 mix ratio
• Working life: 45 minutes
• Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F)
• Provides strong electrical insulation
• High tensile and compressive strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• Shelf life:
≥3
years
• RoHS 3 compliant
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 3.00
Page 1
8329TCM
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life @22 °C [72 °F]
Service cure @22 °C [72 °F]
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Value
45 min
≥3
y
5h
24 h
1h
Temperature Ranges
Properties
Constant service temperature
Storage temperature
Value
-65 to 165 °C [-85 to 329 °F]
22 to 27 °C [72 to 81 °F]
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 3.00
Page 2
8329TCM
Cured Properties
Physical Properties
Color
Density @25 °C [77 °F]
Hardness
Tensile strength
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Lap shear strength (polycarbonate)
Lap shear strength (ABS)
Water absorption (relative mass change)
Outgassing (total mass loss)
@125 °C [257 °F] for 24 h
Water vapor regain
Collected volatile condensable materials
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 570
ASTM E 595
ASTM E 595
ASTM E 595
Value
a)
Dark grey
2.30 g/mL
77D
10 N/mm
2
[1 400 lb/in
2
]
34 N/mm
2
[4 900 lb/in
2
]
6.4 N/mm
2
[930 lb/in
2
]
6.1 N/mm
2
[880 lb/in
2
]
6.0 N/mm
2
[870 lb/in
2
]
5.7 N/mm
2
[830 lb/in
2
]
1.7 N/mm
2
[250 lb/in
2
]
2.4 N/mm
2
[350 lb/in
2
]
0.35%
3.54%
0.15%
0.18%
Note: Specifications are for epoxy samples cured at 64 °C for 1 h and conditioned at ambient temperature
and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 3.00
Page 3
8329TCM
Cured Properties
Electrical Properties
Breakdown voltage @4.5 mm
Dielectric strength @4.5 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Volume resistivity
Volume conductivity
Dielectric dissipation, D @1 MHz
Dielectric constant, k’ @1 MHz
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
ASTM D 150-11
ASTM D 150-11
Value
29 000 V [29 kV]
164 V/mil [6.5 kV/mm]
24 300 V [24.3 kV]
195 V/mil [7.7 kV/mm]
9 x 10
12
Ω·cm
1.1 x 10
-13
S/cm
0.025
5.43
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [222 °F]
@100 °C [212 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Heat deflection termperature (HDT)
Method
ASTM E 3418
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 648
Value
46 °C [115 °F]
71 ppm/°C [160 ppm/°F]
131 ppm/°C [268 ppm/°F]
1.4 W/(m·K)
1.3 W/(m·K)
1.3 W/(m·K)
0.7 mm
2
/s
0.9 J/(g·K)
42 °C [108 °F]
Note: Specifications are for epoxy samples cured at 65 °C for 1 h and conditioned at ambient temperature
and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 3.00
Page 4
8329TCM
Uncured Properties
Physical Properties
Color
Viscosity
Density
Mix ratio by volume
Mix ratio by weight
Solids content (w/w)
Mixture (A:B)
Dark grey
Thixotropic
2.47 g/mL
1:1
0.93:1
100%
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
Dark grey
780 000 cP [780 Pa·s]
a)
2.51 g/mL
Mild
Part B
Dark grey
810 000 cP [810 Pa·s]
b)
2.43 g/mL
Mercaptan
a)
Brookfield viscometer at 12 rpm with spindle RV F96
b)
Brookfield viscometer at 1 rpm with spindle RV F96
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 April 2018 / Ver. 3.00
Page 5
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