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8329TFF-50ML

导热接口产品 THERMALLY CONDUCTIVE ADHESIVE, FAST CURE Flowable

器件类别:热管理产品    导热接口产品   

厂商名称:MG Chemicals

厂商官网:https://www.mgchemicals.com

器件标准:

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器件参数
参数名称
属性值
厂商名称
MG Chemicals
产品种类
导热接口产品
发货限制
Mouser目前不销售该产品。
类型
Thermally Conductive Adhesive
材料
Epoxy Adhesive
击穿电压
43.8 kV
颜色
White
抗拉强度
26 N/mm
可燃性等级
UL 94 V-0
最大工作温度
+ 150 C
最小工作温度
- 55 C
工厂包装数量
1
文档预览
Technical Data Sheet
Thermally Conductive Epoxy Adhesive
Description
8329TFF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic,
and bonds well to a wide variety of substances. It is also flame retardant, and meets the UL 94V-0 standard.
For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full
cure in 4 hours.
This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies.
It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems.
For a longer working life, use 8329TFM or 8329TFS.
8329TFF
Features and Benefits
• Thermal conductivity of 0.8 W/(m·K)
• 1:1 mix ratio
• Working life: 4 minutes
• Set time: 15 minutes
• Cure time: 4 hours at room temperature or 15 minutes at 65 °C (149 °F)
• Flame retardant—meets UL 94V-0 standard
• Provides strong electrical insulation
• Low CTE prior Tg
• High tensile and compressive strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• Shelf life:
≥3
years
• RoHS 3 compliant
ISO 9001:2015 Quality System Management. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 September 2018 / Ver. 1.03
Page 1
8329TFF
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life @22 °C [72 °F]
a)
Set time @22 °C [72 °F]
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Value
4 min
≥3
y
15 min
4h
15 min
10 min
Temperature Ranges
Properties
Constant service temperature
Maximum intermittent temperature
a)
Storage temperature
Value
-40 to 150 °C [-40 to 302 °F]
175 °C [347 °F]
22 to 27 °C [72 to 81 °F]
a)
Temperature that can be withstood for short periods without sustaining damage.
ISO 9001:2015 Quality System Management. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 September 2018 / Ver. 1.03
Page 2
8329TFF
Cured Properties
Physical Properties
Color
Density @26 °C [79 °F]
Hardness
Tensile strength
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Lap shear strength (polycarbonate)
Lap shear strength (ABS)
Flammability
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638-08
ASTM D 695-10
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
UL 94
Value
a)
Beige
1.63 g/mL
82D
13 N/mm
2
[1 900 lb/in
2
]
65 N/mm
2
[9 500 lb/in
2
]
7.1 N/mm
2
[1 000 lb/in
2
]
8.3 N/mm
2
[1 200 lb/in
2
]
18 N/mm
2
[2 500 lb/in
2
]
16 N/mm
2
[2 300 lb/in
2
]
1.6 N/mm
2
[230 lb/in
2
]
1.7 N/mm
2
[240 lb/in
2
]
Meets 94 V-0
Note: Specifications are for epoxy samples cured at 22 °C for 24 h.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2015 Quality System Management. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 September 2018 / Ver. 1.03
Page 3
8329TFF
Cured Properties
Electrical Properties
Breakdown voltage @3.0 mm
Dielectric strength @3.0 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Volume resistivity
Volume conductivity
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
Value
43 800 V [43.8 kV]
375 V/mil [14.8 kV/mm]
45 900 V [45.9 kV]
367 V/mil [14.5 kV/mm]
7.9 x 10
12
Ω·cm
1.3 x 10
-13
S/cm
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [222 °F]
@100 °C [212 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Method
ASTM E 3418
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
Value
25 °C [77 °F]
34 ppm/°C [94 ppm/°F]
146 ppm/°C [294 ppm/°F]
0.8 W/(m·K)
0.7 W/(m·K)
0.7 W/(m·K)
0.3 mm
2
/s
1.4 J/(g·K)
Note: Specifications are for epoxy samples cured at 22 °C for 24 h.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
ISO 9001:2015 Quality System Management. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 September 2018 / Ver. 1.03
Page 4
8329TFF
Uncured Properties
Physical Properties
Color
Viscosity
Density
Mix ratio by volume
Mix ratio by weight
Solids content (w/w)
Mixture (A:B)
Beige
Thixotropic
1.94 g/mL
1:1
1:0.9
100%
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
Beige
72 000 cP [72 Pa·s]
a)
1.71 g/mL
Mild
Part B
Off white
110 000 cP [110 Pa·s]
b)
1.50 g/mL
Mercaptan
a)
Brookfield viscometer at 5 rpm with spindle RV S92
b)
Brookfield viscometer at 2.5 rpm with spindle RV S92
ISO 9001:2015 Quality System Management. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 September 2018 / Ver. 1.03
Page 5
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参数对比
与8329TFF-50ML相近的元器件有:8329TFF-25ML。描述及对比如下:
型号 8329TFF-50ML 8329TFF-25ML
描述 导热接口产品 THERMALLY CONDUCTIVE ADHESIVE, FAST CURE Flowable 导热接口产品
厂商名称 MG Chemicals MG Chemicals
产品种类 导热接口产品 导热接口产品
发货限制 Mouser目前不销售该产品。 Mouser目前不销售该产品。
类型 Thermally Conductive Adhesive Thermally Conductive Adhesive
材料 Epoxy Adhesive Epoxy Adhesive
击穿电压 43.8 kV 43.8 kV
颜色 White White
抗拉强度 26 N/mm 26 N/mm
可燃性等级 UL 94 V-0 UL 94 V-0
最大工作温度 + 150 C + 150 C
最小工作温度 - 55 C - 40 C
工厂包装数量 1 1
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