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832C-450ML

化学物质 EPOXY COMPOUND 450ML (15.5oz) CRTRG

器件类别:工具与设备    化学物质   

厂商名称:MG Chemicals

厂商官网:https://www.mgchemicals.com

器件标准:

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器件参数
参数名称
属性值
厂商名称
MG Chemicals
产品种类
化学物质
发货限制
Mouser 目前在您所在地区不销售该产品。
产品
Epoxy Compounds
类型
Encapsulating and Potting Compound
大小
450 mL
外壳
Cartridge
封装类型
Cartridge
工厂包装数量
2
单位重量
453.592 g
文档预览
Technical Data Sheet
Translucent Epoxy, Encapsulating & Potting Compound
Description
832C
potting and encapsulating compound
is a general purpose, hard, translucent amber two-part epoxy that
offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic
assemblies.
832C is specifically designed for applications where visual inspection is required. Due to its low mixed
viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and
protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt
water, fungus, and many harsh chemicals.
This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment.
832C can be cured at room temperature or higher.
832C
Features and Benefits
Translucent amber color (allows for visual inspection)
Convenient 2A:1B volume mix ratio
Low mixed viscosity of 2 700 cP
Extremely high compressive and tensile strength
Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and
many plastics
Excellent electrical insulating characteristics
Broad service temperature range -40 to 140 °C (-40 to 284 °F)
Extreme resistance to water and humidity (allows for submersion where needed)
Solvent-free
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 14 February 2018 / Ver. 3.00
Page 1
832C
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Full cure @100 °C [212 °F]
Value
1h
5y
24 h
1h
To be determined
To be determined
Temperature Ranges
Properties
Constant service temperature
Maximum intermittent temperature
a)
Storage temperature of unmixed parts
Value
-40 to 140 °C [-40 to 284 °F]
175 °C [347 °F]
16 to 27 °C [61 to 81 °F]
a)
Temperature that can be withstood for short periods without sustaining damage.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 14 February 2018 / Ver. 3.00
Page 2
832C
Cured Properties
Physical Properties
Color
Density @26 °C [79 °F]
Hardness
Tensile strength
Elongation %
Lap shear strength (SS 304)
Izod impact @0.214"
Compressive strength
Flexural strength
Method
Visual
ASTM D 792
Shore D Durometer
ASTM D 638
ASTM D 638
ASTM D 1002
ASTM D 256
ASTM D 695
ASTM D 790
Value
a)
Translucent
1.12 g/mL
84D
56 N/mm
2
[8 100 lb/in
2
]
6.4%
4.4 N/mm
2
[640 lb/in
2
]
1.5 kJ/m
2
[0.700 ft·lb/in]
182 N/mm
2
[26 500 lb/in
2
]
38 N/mm
2
[5 500 lb/in
2
]
Note: Specifications are for epoxy samples cured at 65 °C for 1 hour and conditioned at ambient
temperature and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 14 February 2018 / Ver. 3.00
Page 3
832C
Cured Properties
Electrical Properties
Breakdown voltage @2.9 mm
Dielectric strength @2.9 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8”]
Volume resistivity
Volume conductivity
Surface resistivity
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
ASTM D 257
Value
48 500 V [48.5 kV]
425 V/mil [16.7 kV/mm]
50 700 V [50.7 kV]
406 V/mil [15.7 kV/mm]
1.2 x 10
16
Ω·cm
8.3 x 10
-17
S/cm
5.5 x 10
15
Ω/sq
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [122 °F]
@100 °C [212 °F]
Heat Deflection Temperature (HDT)
c)
Method
ASTM D 3418
ASTM E 831
ASTM E 831
ASTM E 1461
ASTM E 1461
ASTM E 1461
ASTM D 648
Value
35 °C [95 °F]
77 ppm/°C [171 ppm/°F]
195 ppm/°C [383 ppm/°F]
0.28 W/(m·K)
0.29 W/(m·K)
0.31 W/(m·K)
44 °C [111 °F]
Note: Specifications are for epoxy samples cured at 65 °C for 1 hour and conditioned at ambient
temperature and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8" (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
c)
HDT under 1820 kPa [264 lb/in
2
] load.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 14 February 2018 / Ver. 3.00
Page 4
832C
Uncured Properties
Physical Properties
Color
Viscosity @20 °C [73 °F]
Density
Mix ratio by volume
Mix ratio by weight
Solids content (w/w)
Mixture (A:B)
Translucent, amber
2 700 cP [2.7 Pa·s]
a)
1.08 g/mL
2:1
2.3:1
100%
Physical Properties
Color
Viscosity @24 °C [73 °F]
Density
Odor
Part A
Translucent, amber
1 900 cP [1.9 Pa·s]
a)
1.13 g/mL
Mild
Part B
Clear, amber
5 800 cP [25.8 Pa·s]
a)
0.96 g/mL
Musty
a)
Brookfield viscometer at 50 rpm with spindle LV S64
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 14 February 2018 / Ver. 3.00
Page 5
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