Technical Data Sheet
Black Flexible Epoxy, Encapsulating & Potting Compound
Description
832FX
potting and encapsulating compound
is a flexible, black, two-part epoxy that offers extreme
environmental, mechanical and physical protection for printed circuit boards and electronic assemblies.
This product is designed for applications where minimizing the physical stress on components is critical. It
is also good in low temperature and arctic environments, as well as applications that involve temperature
cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and
cost-effectiveness of epoxy.
Due to its very low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent
electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock,
environmental humidity, salt water, fungus, and many harsh chemicals.
This epoxy has a convenient 1:1 volume mix ratio, making it compatible with most dispensing equipment.
832FX can be cured at room temperature or higher.
832FX
Features and Benefits
•
Very flexible and low modulus
•
Convenient 1A:1B volume mix ratio
•
Very low mixed viscosity of 700 cP
•
High elongation
• Good adhesion to a wide variety of substrates including metals, composites, glass, ceramics,
and many plastics
•
Excellent electrical insulating characteristics
•
Extreme resistance to water and humidity (allows for submersion where needed)
•
Solvent-free
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 2.00
Page 1
832FX
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life
Full cure @22 °C [72 °F]
Full cure @45 °C [113 °F]
Full cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Full cure @100 °C [212 °F]
Value
2.5 h
5y
48 h
5h
2h
1h
30 min
Note: After heat cure, let stand at room temperature for 30 minutes.
Temperature Ranges
Properties
Constant service temperature
Intermittent temperature limit
a)
Storage temperature of unmixed parts
Value
-40 to 140 °C [-40 to 284 °F]
-50 to 150 °C [-58 to 302 °F]
16 to 27 °C [61 to 81 °F]
a)
Temperature range that can be withstood for short periods without sustaining damage.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 2.00
Page 2
832FX
Cured Properties
Physical Properties
Color
Density @25 °C [77 °F]
Hardness
Tensile strength
Elongation %
Method
Visual
ASTM D 1475
Shore A Durometer
ASTM D 638
ASTM D 638
Value
a)
Black
1.08 g/mL
88A
9.6 N/mm
2
[1 400 lb/in
2
]
160%
Electrical Properties
Breakdown voltage @2.3 mm
Dielectric strength @2.3 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Volume resistivity @2.4 mm
Volume conductivity @2.4 mm
Dielectric dissipation, D @1 MHz
Dielectric constant, k’ @1 MHz
Method
ASTM D 149
ASTM D 149
Reference fit
b)
Reference fit
b)
ASTM D 257
ASTM D 257
ASTM D 150-11
ASTM D 150-11
Value
36 300 V [36.3 kV]
400 V/mil [15.7 kV/mm]
42 800 V [42.8 kV]
343 V/mil [13.5 kV/mm]
5.8 x 10
12
Ω·cm
1.7 x 10
-13
S/cm
0.050
3.06
Note: Specifications are for epoxy samples cured at 65 °C for 2 hours and conditioned at ambient
temperature and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
b)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8" (3.175 mm).
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 2.00
Page 3
832FX
Cured Properties
Thermal Properties
Glass transition temperature (T
g
)
CTE
a)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Method
ASTM D 3418
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1269 01
Value
8.8 °C [48 °F]
114 ppm/°C [237 ppm/°F]
218 ppm/°C [424 ppm/°F]
0.26 W/(m·K)
0.09 mm
2
/s
2.7 J/(g·K)
Note: Specifications are for epoxy samples cured at 65 °C for 2 hours and conditioned at ambient
temperature and humidity.
a)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
Uncured Properties
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Mix ratio by volume
Mix ratio by weight
Mixture (A:B)
Black
700 cP [0.700 Pa·s]
a)
1.06 g/mL
1:1
100:85
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
Black
800 cP [0.800 Pa·s]
a)
1.13 g/mL
Mild
Part B
Clear, amber
165 cP [0.165 Pa·s]
b)
0.98 g/mL
Ammonia-like
a)
Brookfield viscometer at 30 rpm with spindle LV S62
b)
Brookfield viscometer at 30 rpm with spindle LV S61
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 2.00
Page 4
832FX
Compatibility
Adhesion—As
seen in the substrate adhesion
table, 832FX epoxy adheres to most plastics and
metals used to house printed circuit assemblies;
however, it is not compatible with contaminants
like water, oil, or greasy flux residues that may
affect adhesion. If contamination is present,
first clean the surface to be coated with MG
Chemicals 824 Isopropyl Alcohol.
Substrate Adhesion
(In Decreasing Order)
Physical Properties
Steel
Aluminum
Copper/bronze
Fiberglass
Wood
Paper, Fiber
Glass
Rubber
Acrylic
Polycarbonate
Polypropylene
Teflon™
Weaker
Does not bond
Does not bond
Adhesion
Stronger
Storage
Store between 16 and 27 °C [61 and 81 °F] in
a dry area, away from sunlight. Storage below
16 °C [61 °F] can result in crystallization.
If crystallization occurs, reconstitute the product
to its original state by temporarily warming it to
between 50 and 60 °C [122 and 140 °F]. To
ensure full homogeneity, stir the warm product
thoroughly. Make sure to reincorporate all settled
material, close the lid, and then let cool before
use.
Health and Safety
Please see the 832FX Safety Data Sheet (SDS)
parts A and B for further details on transportation,
storage, handling, safety guidelines, and
regulatory compliance.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 2.00
Page 5
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