Technical Data Sheet
Water Clear Epoxy, Encapsulating & Potting Compound
Description
832WC
potting and encapsulating compound
is a general purpose, water-clear, hard, two-part epoxy that
offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic
assemblies.
This product is designed for applications where high clarity is required. It does not yellow when exposed to
UV light; it maintains clarity in applications with service temperatures up to 65 °C (149 °F) and intermittent
exposures up to 100 °C (212 °F). It also provides excellent electrical insulation and protects circuit board and
other electronic devices from static discharges, vibration, abrasion, thermal shock, environmental humidity,
salt water, fungus, and many harsh chemicals.
This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment.
832WC can be cured at room temperature or higher.
832WC
Features and Benefits
•
Optically clear color (allows visual inspection)
•
UV light stable (minimal yellowing)
•
Very low mixed viscosity of 980 cP
•
Convenient 2A:1B volume mix ratio
•
Excellent electrical insulating characteristics
•
Extremely high compressive and tensile strength
•
Good adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and
many plastics
•
Broad service temperature range -40 to 140 °C (-40 to 284 °F)
•
Extreme resistance to water and humidity (allows for submersion where needed)
•
Solvent-free
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 November 2018 / Ver. 2.01
Page 1
832WC
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life
Full cure @22 °C [72 °F]
Full Cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Full Cure @100 °C [212 °F]
Value
1h
5y
72 h
2h
1h
30 min
Temperature Ranges
Properties
Constant service temperature
Intermittent temperature limit
a)
Storage temperature of unmixed parts
Value
-40 to 140 °C [-40 to 284 °F]
-50 to 155 °C [-58 to 311 °F]
16 to 27 °C [61 to 81 °F]
a)
Temperature range that can be withstood for short periods without sustaining damage.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 November 2018 / Ver. 2.01
Page 2
832WC
Cured Properties
Physical Properties
Color
Density @22 °C [72 °F]
Hardness
Tensile strength
Compressive strength
Lap shear strength (aluminum)
Lap shear strength (brass)
Lap shear strength (copper)
Lap shear strength (stainless steel)
Lap shear strength (ABS)
Lap shear strength (polycarbonate)
Refractive index
Method
Visual
ASTM D 792
Shore D Durometer
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1218
Value
a)
Optically clear
1.06 g/mL
82D
10 N/mm
2
[1 500 lb/in
2
]
160 N/mm
2
[22 800 lb/in
2
]
6.8 N/mm
2
[980 lb/in
2
]
3.8 N/mm
2
[560 lb/in
2
]
2.9 N/mm
2
[420 lb/in
2
]
3.3 N/mm
2
[480 lb/in
2
]
1.5 N/mm
2
[220 lb/in
2
]
2.1 N/mm
2
[300 lb/in
2
]
1.53
Note: Specifications are for epoxy samples cured at 80 °C for 1 h and conditioned at ambient temperature
and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 November 2018 / Ver. 2.01
Page 3
832WC
Cured Properties
Electrical Properties
a)
Breakdown voltage @2.3 mm
Dielectric strength @2.3 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8”]
Volume resistivity
Volume conductivity
Dielectric dissipation, D @1 MHz
Dielectric constant, k’ @1 MHz
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
ASTM D 150-11
ASTM D 150-11
Value
41 000 V [41 kV]
465 V/mil [18 kV/mm]
49 000 V [49 kV]
394 V/mil [16 kV/mm]
1.6 x 10
17
Ω·cm
6.3 x 10
-18
S/cm
0.028
3.23
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Method
ASTM E 831
ASTM E 831
ASTM E 831
Value
33 °C [91 °F]
80 ppm/°C [176 ppm/°F]
192 ppm/°C [378 ppm/°F]
Note: Specifications are for epoxy samples cured at 80 °C for 1 h and conditioned at ambient temperature
and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8" (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 November 2018 / Ver. 2.01
Page 4
832WC
Uncured Properties
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Mix ratio by volume
Mix ratio by weight
a)
Brookfield viscometer at 100 rpm with spindle LV S63
Mixture (A:B)
Clear
980 cP [0.98 Pa·s]
a)
1.06 g/mL
2:1
2:1
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
Clear
2 860 cP [2.86 Pa·s]
b)
1.09 g/mL
Mild
Part B
Clear
340 cP [0.34 Pa·s]
c)
1.03 g/mL
Ammonia-like
b)
Brookfield viscometer at 100 rpm with spindle LV S64
c)
Brookfield viscometer at 60 rpm with spindle LV S62
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 November 2018 / Ver. 2.01
Page 5
