834-43-003-10-001000,834-43-003-10-001000 pdf中文资料,834-43-003-10-001000引脚图,834-43-003-10-001000电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否无铅

不含铅

是否Rohs认证

符合

厂商名称

Mill-Max

包装说明

ROHS AND REACH COMPLIANT

Reach Compliance Code

compliant

ECCN代码

EAR99

主体/外壳类型

SOCKET

连接器类型

BOARD CONNECTOR

联系完成配合

GOLD (30) OVER NICKEL (100)

联系完成终止

Matte Tin (Sn) - with Nickel (Ni) barrier

触点性别

FEMALE

触点材料

BERYLLIUM COPPER

DIN 符合性

滤波功能

IEC 符合性

JESD-609代码

MIL 符合性

混合触点

安装方式

STRAIGHT

安装类型

BOARD

装载的行数

选件

GENERAL PURPOSE

端子节距

2.54 mm

端接类型

SOLDER

触点总数

Base Number Matches

文档预览

INTERCONNECTS

SERIES 834 & 835 • 2,54 GRID OFP

PASS-THROUGH SOCKETS

Ø0,76

£0,64

PINS• SINGLE AND DOUBLE ROW STRIPS

•

834/835 Series Pass-Through Sockets have a low

•

3,30 profile and will accept Ø 0,76 round pin, as

well as industry standard 0,64 square pin

headers.

They are typically used to interconnect two or

more parallel circuit boards.

Sockets are designed for hand, wave or reflow*

soldering. The high temperature insulator is

compatible with all solder processes.

Unique ORGANIC FIBRE PLUG® barriers prevent

solder, paste or flux from contaminating the

internal spring contacts. After soldering, the

OFP® barriers are pushed out of the socket when

the mating header is inserted.

Mill-Max sockets use a receptacle consisting of a

precision-machined brass sleeve with a press-fit

beryllium copper “multi-finger” spring contact.

Recommended mounting holes are Ø1,17 ±0,08

PTH (1,2 mm drilled prior to plating).

UPPER

CIRCUIT

BOARD

Ø 0,76 or



0,64 PINS

MIDDLE

CIRCUIT

BOARD

Typical Application

INTERCONNECTION

#47 SPRING

CONTACT

*Intrusive

reflow (also called “pin-in-paste”) is a technique

of using conventional through-hole components in a

reflow soldering process. The pass-through socket is placed

into plated through-holes in the circuit board (solder paste

has previously been screen printed on pads adjacent to the

holes) and the board is reflowed in the same pass as other

SMT components. Solder will fill the plated through-holes

and achieve solder joints as reliable as wave soldering. The

OFP® barrier prevents solder paste from being picked up

inside the contact during assembly.

0,64-0,91

0,64 * 0,64

2,54

SOCKET

INSULATOR

PASS THROUGH

SOCKETS

RECEPTACLE

SLEEVE

CIRCUIT

BOARD

LOWER

CIRCUIT

BOARD

SOLDER

JOINT

PUSHED OUT BY INTERCONNECT

PIN AFTER SOLDERING

ORGANIC FIBER PLUG

Number of Pins

X 2,54

US Patent #7,086,870

2,79

2,24

ORDERING INFORMATION

Series 834...001

Single Row OFP

Pass-Through Socket

834-XX-0 _ _-10-001000

Specify number of pins

01-64

3,3

1,55 DIA.

1,09 DIA.

0,91 DIA.

Through-Hole

2,03

FIG. 1

2,54

0,64-0,91

0,64 * 0,64

5,08

Number of Pins

X 2,54 / 2

Specify number of pins

RoHS - 2

04-72

For

Electrical, Mechanical

& Enviromental Data,

See page 264

2,79

2,24

3,3

1,55 DIA.

1,09 DIA.

0,91 DIA.

Through-Hole

2,54

2,03

2011/65/EU

XX=Plating Code

See Below

5,08μm

Sn/Pb

2,54

SPECIFY PLATING CODE XX=

Sleeve

(Pin)

Contact

(Clip)

5,08μm

0,76μm

FIG. 2

0,76μm

Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com

PAGE 63 | INTERCONNECTS

FIG. 1

Series 835...001

Double Row OFP

Pass-Through Socket

835-XX-0 _ _-10-001000

FIG. 2

参数对比

与834-43-003-10-001000相近的元器件有：834-43-004-10-001000、834-93-010-10-001000。描述及对比如下：

型号	834-43-003-10-001000	834-43-004-10-001000	834-93-010-10-001000
描述	Board Connector, 3 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT	Board Connector, 4 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, PFOA, PFOS, ROHS AND REACH COMPLIANT	Board Connector, 10 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket,
是否无铅	不含铅	不含铅	含铅
是否Rohs认证	符合	符合	不符合
Reach Compliance Code	compliant	compliant	compliant
主体/外壳类型	SOCKET	SOCKET	SOCKET
连接器类型	BOARD CONNECTOR	BOARD CONNECTOR	BOARD CONNECTOR
联系完成配合	GOLD (30) OVER NICKEL (100)	GOLD (30) OVER NICKEL (50)	GOLD (30) OVER NICKEL (100)
联系完成终止	Matte Tin (Sn) - with Nickel (Ni) barrier	Gold (Au) - with Nickel (Ni) barrier	TIN LEAD (200) OVER NICKEL (150)
触点性别	FEMALE	FEMALE	FEMALE
触点材料	BERYLLIUM COPPER	BERYLLIUM COPPER	NOT SPECIFIED
DIN 符合性	NO	NO	NO
滤波功能	NO	NO	NO
IEC 符合性	NO	NO	NO
JESD-609代码	e3	e4	e0
MIL 符合性	NO	NO	NO
混合触点	NO	NO	NO
安装方式	STRAIGHT	STRAIGHT	STRAIGHT
安装类型	BOARD	BOARD	BOARD
装载的行数	1	1	1
选件	GENERAL PURPOSE	GENERAL PURPOSE	GENERAL PURPOSE
端子节距	2.54 mm	2.54 mm	2.54 mm
端接类型	SOLDER	SOLDER	SOLDER
触点总数	3	4	10
Base Number Matches	1	1	1
厂商名称	Mill-Max	-	Mill-Max
包装说明	ROHS AND REACH COMPLIANT	ROHS AND REACH COMPLIANT	-
ECCN代码	EAR99	-	EAR99