Flame Retardant
Encapsulating & Potting Compound
834ATH Technical Data Sheet
834ATH
Description
The 834ATH
Flame Retardant Epoxy Encapsulating and Potting Compound
is a two-part, economical,
electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical, and
electrical protection and offers a degree of thermal conductivity.
It protects against static discharges, shocks, vibrations, and mechanical impacts. It is extremely resistant
to environmental humidity, salt water, and harsh chemicals. It also helps hide and restrict access to
intellectual property, and it much harder to remove than standard epoxy encapsulating compounds.
Applications & Usages
The 834ATH epoxy is used to pot or encapsulate printed circuit assemblies in a protective block. The cured
epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts.
Benefits and Features
Certified
UL 94V-0
(File #
E334302)
Specification Verified as per
UL 746A
Excellent Comparative Tracking Index
(400–599 V,
PLC = 1)
Cost effective
Increased thermal conductivity
Mix ratio 2A:1B
compatible with most dispensing equipment
Resistance to water and humidity
allowing submersion if needed
ENVIRONMENT
RoHS
REACH compliant
Protects electronics from
moisture, corrosion, fungus, thermal shock, and static discharges
Free of solvents
Curing & Work Schedule
Properties
Working Life
a)
Shelf Life
Full Cure @20 °C [68 °F]
Full Cure @80 °C [176 °F]
Full Cure @100 °C [212 °F]
Storage Temperature
of Unmixed Parts
Value
2h
5y
24 h
60 min
45 min
16 to 27 °C
[61 to 81 °F]
Service Ranges
Properties
Service Temperature
Max Intermittent Temp.
a)
Value
-30 to +175 °C
[-22 to +347 °F]
-40 to +200 °C
[-40 to 392 °F]
b) Maximum short-term exposure temperature
toleration limit—not recommended as a sustained
or repeated operation condition
a) Working life and full cure assumes room
temperature and 100g. A 10 °C increase can
decreases the pot life by half.
Page
1
of
7
Date: 21 October 2013 / Ver. 1.01
Flame Retardant
Encapsulating & Potting Compound
834ATH Technical Data Sheet
834ATH
Principal Components
Name
Part A: Epoxide Resin
Part B: Curing Amide
Aluminum Trihydrate
1,1-(ethane-1,2-diyl)bis(pentabromobenzene)
Antimony Trioxide
CAS Number
25068-38-6 + 68609-97-2
68410-23-1 + 112-24-3
21645-51-2
84852-53-9
1309-64-4
Properties of Cured 834ATH
Physical Properties
Color
Density @25 °C [77 °C]
Method
Visual
Shore D
ASTM D 638
"
ASTM D 695
Value
a
Black
~1.4 g/cm
3
Hardness
Tensile Elongation
Tensile Strength
Compression Strength
85D
6.2%
28 N/mm
2
99.8 N/mm
2
[4,100 lb/in
2
]
[14,500 lb/in
2
]
[4.0 ft
·
lb/in
2
]
[2,160 lb/in
2
]
[7,400 lb/in2]
Tensile Impact
Izod Impact
Lap Shear Strength (Al alloy 5052)
Flexural Strength
Water Absorption (WAB)
Linear Dimension Change @after 168 h in water
Electric Properties
Breakdown Voltage @1.514 mm
Dielectric Strength
Breakdown Voltage @3.175 mm [1/8”]
Dielectric Strength
Volume Resistivity @23 °C & 50% RH
Volume Resistivity @35 °C & 90% RH
Comparative Tracking Index (CTI)
Hot Wire Ignition (HWI)
High Voltage Arc Tracking Rate (HVTR)
High Voltage Arc Resistance to Ignition (HVAR)
High Voltage, Low Current, Dry Arc Resistance
High-Current Arc Ignition (HAI)
ASTM D 1822
ASTM D 256
ASTM D 1002
ASTM D 790
ASTM D1042
Method
ASTM D 149
"
Reference fit
b
ASTM D 257
"
ASTM D 3628
ASTM D3874
ASTM D 495
CSA C22.2
8.4 kJ/m
2
20 J/m
14.9 N/mm
2
51 N/mm2
0.15%
0.0037%
Value
33 kV
22 kV/mm [550 V/mil]
47 kV
15 kV/mm [380 V/mil]
7 x10
14
Ωcm
2 x10
14
Ωcm
400 V to 599 V
Performance Level Class (PCL) = 1
120 s
121 mm/min
300 s
127 s
+150 arc
Note:
Specifications are for epoxy samples cured at 65 °C for 1 hour, with additional curing time at room
temperature for optimal results. For most tests, samples were conditioned at 23 °C and 50% RH.
a) N/mm
2
= mPa; lb/in
2
= psi;
b) To allow comparison between products, the Tautscher equation was fitted to five experimental dielectric
strengths and interpolated for a standard reference thickness of 1/8” (3.175 mm).
Page
2
of
7
Date: 21 October 2013 / Ver. 1.01
Flame Retardant
Encapsulating & Potting Compound
834ATH Technical Data Sheet
834ATH
Properties of Cured 834ATH (Continued)
Thermal Properties
Glass Transition Temperature
Coefficient of Thermal Expansion
Below Tg
Above Tg
Thermal Conductivity @25 °C [77 °C]
Thermal Diffusivity @25 °C [77 °C]
Specific Heat Capacity @25 °C [77 °C]
Heat Deflection Temperature
Method
ASTM D 3481
ASTM E 831
"
ASTM E 1461 92
"
ASTM E 1269 01
ASTM D 648
Value
51 °C [124 °F]
84 ppm/°C
178 ppm/°C
0.37 W/mK
2.1 x 10
-7
m
2
/s
1.2 J/(kgK)
53.7 °C [129 °F]
d) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
Properties of Uncured 834ATH
Physical Property
Color
Viscosity @20 °C [73 °F]
Density
Mix Ratio by weight (A:B)
Mix Ratio by volume (A:B)
Mixture (2A:1B)
Black
5,900 cP [5.9 Pa·s]
a)
1.39 g/mL
2.25:1.00
2:1
Physical Property
Color
Viscosity @24°C [73 °F]
Density
Flash Point
% solids
Odor
Part A
Black
4,600 cP [4.6 Pa·s]
1.40 g/mL
150 °C [302 °F]
~98%
Mild aromatic
Part B
Black
12,900 cP [12.9 Pa·s]
1.26 g/mL
185 °C [365 °F]
100%
Ammonia like
a) Brookfield viscometer at 50 RPM with spindle LV4
Page
3
of
7
Date: 21 October 2013 / Ver. 1.01
Flame Retardant
Encapsulating & Potting Compound
834ATH Technical Data Sheet
834ATH
Compatibility
Adhesion—As
seen in the substrate adhesion table, the 834ATH epoxy adheres to most materials found
on printed circuit assemblies; however, it is not compatible with contaminants like water, oil, and greasy
flux residues that may affect adhesion. If contamination is present, clean the printed circuit assembly with
electronic cleaner such as MG Chemicals 4050 Safety Wash, 406B Superwash, or 824 Isopropyl Alcohol.
Substrate Adhesion in Decreasing Order
Physical Properties
Aluminum
Steel
Fiberglass
Wood
Paper, Fiber
Glass
Rubber
Polycarbonate
Acrylic
Polypropylene
a
a) Does not bond to polypropylene
Adhesion
Stronger
Weaker
Storage
Store between 16 and 27 °C [60 and 80 °F] in dry area away from sunlight. Prolonged storage or storage
at or near freezing temperatures can result in crystallization. If crystallization occurs, reconstitute the
component to its original state by temporarily warming it to 50 to 60 °C [122 to 140 °F]. To ensure full
homogeneity, stir thoroughly the warm component, reincorporating all settled material. Re-secure
container lid and let cool down before use.
Page
4
of
7
Date: 21 October 2013 / Ver. 1.01
Flame Retardant
Encapsulating & Potting Compound
834ATH Technical Data Sheet
834ATH
Health and Safety
Please see the 834ATH
Material Safety Data Sheet
(MSDS) parts A and B for more details on
transportation, storage, handling and other security guidelines.
Part A
HMIS RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
2
1
0
NFPA CODES
1
2
0
Part B
HMIS RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
3
1
0
NFPA CODES
1
3
0
Health and Safety:
The 834ATH parts can ignite if the liquid is both heated and exposed to flames or
sparks.
Wear safety glasses or goggles and disposable polyvinyl chloride, neoprene, or nitrile gloves while
handling liquids. Part B in particular causes skin burns and may cause sensitization if exposed over a long
period of time. The epoxy is black and will not wash off once cured: wear protective work clothing. Wash
hands thoroughly after use or if skin contact occurs. Do not ingest.
Use in well-ventilated area since vapors may cause irritation of the respiratory tract and cause respiratory
sensitization in susceptible individuals.
The cured epoxy resin presents no known hazard.
Page
5
of
7
Date: 21 October 2013 / Ver. 1.01
FPGA/CPLD
