No Clean Flux, Halogen Free
8351 Technical Data Sheet
8351
Description
The 8351
No Clean Flux, Halogen Free
is designed for lead free alloys and is also well suited for leaded
alloys. Because it is low solids, this organic flux leaves virtually no residues so that the board appears
cosmetically clean after exiting the wave soldering machine. It is specially designed to minimize bridge
defects and solder defects.
Application
Use the MG 8351 flux for solder touch up, repair, or rework surface mount assemblies.
The 8351 is re-flowable in air or nitrogen. It can be used with profiles with peak maximum up to 270 °C
and reflow times between 30 to 90 seconds.
Benefits
•
•
•
•
•
•
Halogen free
Low residues, leaving the board and joints shinny and bright
Excellent wettability
Usable for both lead free and leaded alloys
Rosin/Resin Free
RoHS Compliant
Usage Parameters
Store at around room temperature and protect from direct heat or sunlight.
Properties
Shelf Life after DOM
Storage Temperature
Value
3y
0 to 27 °C [32 to 80 °F]
Flux Paste Properties
Physical Properties
Flux Classification
Appearance
Specific Gravity
Surface Insulation Resistance (SIR)
SIR, J-STD-004
Copper Mirror
Acid Number (mg KOH/g)
Solids
Cleaning Requirements
Method
J-STD-004
J-STD-004B
IPC-TM-650 2.6.3.3
IPC-TM-650 2.3.32
Titration
—
Value
ORL0
Colorless
0.815 ±0.006
2.1 × 10
9
Ω
Low
14—16
1.8–2.4%
None
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No Clean Flux, Halogen Free
8351 Technical Data Sheet
8351
Cleaning
The no-clean residue does not need to be removed for typical applications.
If removal is desired, a solvent system like the
MG 4140
or
MG 413B
can be used.
Health and Safety
Please see the 8351
Safety Data Sheet
(SDS) for more details on transportation, storage, handling and
other security guidelines.
Environmental Impact:
The volatile organic content is 95% by EPA and WHMIS standards.
This product meets the European Directive
2011/65/EU Annex II (ROHS);
recasting 2002/95/EC.
Health and Safety:
Avoid breathing fumes. Wash hands thoroughly after use. Do not ingest.
HMIS® RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
Approximate HMIS and NFPA Risk Ratings Legend:
0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)
NFPA® 704 CODES
* 2
3
0
3
2
0
Application Instructions
This product is suitable for spray, foam, or wave fluxing application. Spray applications typically deliver
750–1500 µg/in
2
. In order to keep the foam density and uniformity special attention should be paid to the
air supply and tank. Compressed air supply should be free of water or oil. The flux tank should be kept full
at all times. The following table lists ideal operational parameters.
Fluxing Operational Parameters
Parameters
Amount of flux for Foam, Wave
Foam Stone Pore Size
Flux Level Above Stone
Chimney Opening
Air Pressure
a)
Typical
1000–2000 µg/in
2
solids
20–50 µm
25–40 mm [1–1.5 inch]
10–13 mm [3/8—1/2 inch]
1-2 lb/in
2
a) Adjust the air pressure to achieve the optimum foam height.
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No Clean Flux, Halogen Free
8351 Technical Data Sheet
8351
After fluxing, use an air knife to remove excess foam for the printed circuit board assembly.
Wave Operational Parameters
Parameters
Top Side Preheat Temperature
Bottom Side Preheat Temperature
Conveyor Speed
Contact Time in the Solder (including Chip & Lambda)
Solder Pot Temperatures
Solder Type
Sn96.5/Ag3.5
Sn95/Ag5
Sn99.3/Cu0.7
Sn96.5Ag3Cu0.5
Sn95Sb5
Typical
260–276 °C [500–530 °F]
280–296 °C [536–565 °F]
265–276 °C [510–530 °F]
271–276 °C [520–530 °F]
280–296 °C [536–565 °F]
Typical
85–110 °C [190–230 °F]
35 °C [65 °F]
1.2–2.8 m/min [4–5 ft/min]
2.5–4.5 s
Process Control
Due to the low solids content, the density cannot be used to accurately provide a measure of the solids
content. Instead, titration is the preferred method of monitoring. To measure the flux content being
deposited, perform a titration. If needed, the flux number activity can be reduced by thinning with the
MG 824—99.9% Isopropyl Alcohol.
T
IP
!
If debris accumulates in reservoir, purge and clean the reservoir.
Packaging and Supporting Products
Cat. No.
8351-125ML
8351-1L
8351-4L
8351-20L
8351-55G
Packaging
Bottle
Bottle
Jug
Pail
Drum
Net Volume
125 mL
4.23 fl oz
1L
1.1 qt
4L
1.1 gal
20 L
5.3 gal
200 L
55 gal
Net Weight
101 g
3.25 oz
809 g
26.0 oz
3.2 kg
7.1 lb
16.2 kg
35.6 lb
161 kg
356 lb
Packaging Weight
TBD
TBD
"
"
"
"
"
"
"
"
Note:
TBD = To be determined.
Suitable Flux Cleaners
•
Heavy Duty Flux Remover:
Cat. No. 413B-1L, 413B-4L, 413B-20L, 413B-425G
•
Flux Remover for PC Boards:
Cat. No. 4140-P, 4140-400G, 4140-1L, 4140-4L, 4140-20L
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No Clean Flux, Halogen Free
8351 Technical Data Sheet
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Technical Support
Contact us regarding any questions, improvement suggestions, or problems with this product. Application
notes, instructions, and FAQs are located at
www.mgchemicals.com.
Email:
support@mgchemicals.com
Phone: +(1) 800-340-0772 (Canada, Mexico & USA)
+(1) 905-331-1396 (International)
Fax: +(1) 905-331-2862 or +(1) 800-340-0773
Mailing address:
Manufacturing & Support
1210 Corporate Drive
Burlington, Ontario, Canada
L7L 5R6
Head Office
9347–193rd Street
Surrey, British Columbia, Canada
V4N 4E7
Warranty
M.G. Chemicals Ltd.
warranties this product for 12 months from the date of purchase by the end user.
M.G. Chemicals Ltd.
makes no claims as to shelf life of this product for the warranty. The liability of
M.G.
Chemicals Ltd.
whether based on its warranty, contracts, or otherwise shall in no case include incidental or
consequential damage.
Disclaimer
This information is believed to be accurate. It is intended for professional end users having the skills to
evaluate and use the data properly.
M.G. Chemicals Ltd.
does not guarantee the accuracy of the data and
assumes no liability in connection with damages incurred while using it.
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