Heat Transfer Compounds
Page 1 of 2
Non-Silicone Heat Transfer Compound
8610
Special synthetic base, fortified with metal oxides and compounded to a paste-like
consistency for ease of application
High efficient thermal conductive properties
Means more rapid transfer of heat for longer component life
High temperature stability
Provides physical properties of low bleed and low evaporation for long-term
service in any application that requires Heat Sink Compound.
Uses synthetic fluids and metal oxide fillers
Provides excellent conductive properties that exceed those of other heat
sink formulas
Will not dry, harden, melt or migrate in any heat sink application
Compatible with metal and plastic components
Also available in a
silicone version
Benefits of Non Silicone Heat Transfer Compound OVER Silicone
No migration and component contamination.
Applications
Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM
Electronic Component Plants to insure fast, accurate heat transfer in electronic
components and circuitry
Other used:
Semiconductor Mounting Devices
Thermal joints
Ballast heat transfer mediums
Power resistor mountings
Thermocouple wells
Transistor diodes & silicone rectifier base and mounting studs
ALL electric and electronic devices where efficient heat transfer cooling
through thermal coupling is required
Specifications
Physical Properties
Appearance
Consistency
Specific Gravity
@ 25°C (77°F)
Bleed %
24 hours @ 200°C
Evaporation
24 hours @ 200°C
Dropping Point
Min. operating temp.
Max. operating temp.
FTM-321
FTM-321
ASTM D-566
Test Method
Visual
ASTM D 217
Non Silicone
8610
Off white /
smooth paste
310-320
2.5 min
1.0% max
2.0% max
> 500°F (260°C)
-40°F/-40°F
200°C
2.3 min
2.0% max
2.0% max
> 500°F (260°C)
55°F/48°C
200°C (consistent)
300°C (intermittent)
Silicone
860
White paste
http://www.mgchemicals.com/products/8610.html
4/28/2010
Heat Transfer Compounds
Electrical Properties
Thermal Conductivity
Dielectric Strength
(0.05l gap)
Dielectric Constant @
1000 Hz
Dissipation Factor
@ 1000 Hz
Resistivity @ 21°C
Test Method
Hot Wire Method
Heat Flow #36 °C
ASTM D-149
ASTM D- 150
ASTM D 150
ASTM D 150
Non Silicone
8610
0.773 W/m•K
350 V/MIL
4.4
0.0021
6.38 x 10
13
Ohm•cm
Silicone
860
0.657 W/m•K
400 V/MIL
3.81
0.0032
1.5 x 10
15
Ohm•cm
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Available Sizes
Catalog Number
8610-60G
8610-1P
Sizes Available
60g (2 oz)
1 pint (2.5 lbs)
Description
Liquid - TUBE
Tub
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4/28/2010
