Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CQCC44, CERAMIC, LCC-44
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:AMD(超微)
厂商官网:http://www.amd.com
下载文档型号 | 8751H-8/BUA | 8751H-8/BQA | 8753H-8/BUA | 8751H/BQA | 8753H-8/BQA | 8751H/BUA | 8753H/BUA | 8753H/BQA |
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描述 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | LCC | DIP | LCC | DIP | DIP | LCC | LCC | DIP |
包装说明 | QCCN, LCC44,.65SQ | DIP, DIP40,.6 | CERAMIC, LCC-44 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCN, LCC44,.65SQ | CERAMIC, LCC-44 | DIP, DIP40,.6 |
针数 | 44 | 40 | 44 | 40 | 40 | 44 | 44 | 40 |
Reach Compliance Code | unknow | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 12 MHz | 8 MHz | 12 MHz | 12 MHz | 12 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-N44 | R-GDIP-T40 | R-GDIP-T40 | S-CQCC-N44 | S-CQCC-N44 | R-GDIP-T40 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 16.51 mm | 52.3875 mm | 16.51 mm | 52.3875 mm | 52.3875 mm | 16.51 mm | 16.51 mm | 52.3875 mm |
I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 44 | 40 | 44 | 40 | 40 | 44 | 44 | 40 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | QCCN | DIP | DIP | QCCN | QCCN | DIP |
封装等效代码 | LCC44,.65SQ | DIP40,.6 | LCC44,.65SQ | DIP40,.6 | DIP40,.6 | LCC44,.65SQ | LCC44,.65SQ | DIP40,.6 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
ROM(单词) | 4096 | 4096 | 8192 | 4096 | 8192 | 4096 | 8192 | 8192 |
ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
座面最大高度 | 3.556 mm | 5.588 mm | 3.556 mm | 5.588 mm | 5.588 mm | 3.556 mm | 3.556 mm | 5.588 mm |
速度 | 8 MHz | 8 MHz | 8 MHz | 12 MHz | 8 MHz | 12 MHz | 12 MHz | 12 MHz |
最大压摆率 | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 16.51 mm | 15.24 mm | 16.51 mm | 15.24 mm | 15.24 mm | 16.51 mm | 16.51 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
厂商名称 | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |