901-910 SERIES CHIPSET HEAT SINKS
PIN FIN &
ELLIPTICAL
HEAT SINKS
Wakefield-Vette’s 901-910 Series Heat Sinks
for Chipset can match up to devices from
Intel, Broadcom, Xilinx. TI, Motorola and
many more! These heat sinks are designed
for air flow applications. Enclosed pages
have thermal performance data for natural
forced convection values.
4 Springs at
each corner
Wakefield-Vette heat sink assembles onto
chip set using the space that is between the
PCB and the substrate of the solder balls.
The solder balls provide a minimal gap of
.5mm to .7mm. Attachment feature is below
a .4mm thickness. The clipping system will
not interfere or damage chip. Contact area
is the edge of chip.
Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS
Material:
AL 6063
Finish:
Black Anodize
All dimensions in millimeters (mm)
Part Numbering System
*
*Note: When selecting part number chip set
thickness (CST) relates to spring selection!
Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS
THERMAL PERFORMANCE
Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS
THERMAL PERFORMANCE
Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS
SHOCK TEST SPECIFICATION：
Wave Form
：Half
sine wave
Acceleration
：50
g
Duration Time
：11
ms
No. of Shock
：Each
axis 3 times
Shock Direction
：±X,
±Y, ±Z axis
Reliability & Communication Testing
Instruments
Random Vibration test
Frequency
：5
Hz to 500 Hz
Acceleration
：3.13
grms
P.S.D
：0.01
g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis
：X,
Y, Z axis
Test Time
：10
mins (Each axis)
Total Test Time
：30
mins
STEP 1:
Center heat
Sink onto BGA. Tilt
and hook one side of
the clip under the
BGA chip.
STEP 2:
Press down
the other side of
clip to snap it onto
the BGA chip.
STEP :3
Make sure
the stop pin is not
on top of the chip
set. Installation
Done!
Thermal Cooling Solutions from SMART to FINISH
