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Technical Data Sheet
296 Flux-Cored Wire
Zero-Halogen, No-Clean Cored Wire for Lead-bearing and Lead-free
Alloys Suitable for manual and automated soldering
Product Description
Kester 296 No-Clean Flux-Cored Wire is halogen-free and halide-free with no intentional addition of bromine and chlorine,
conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications. With its unique
chemistry system, 296 provides consistent workability performance for both manual and automated soldering in the
electronics industry, as compared to the conventional halogen/halide-based systems. 296 provides a good break-off and
prevents occurrences of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 296 results
in a clear post-soldering residue without the need for cleaning. 296 is classified as Type ROL0 flux under J-STD-004B
specifications.
Performance Characteristics:
■
Conforms to halogen-free
requirements of IEC 61249-2-21,
JPCA-ES-01 and IPC-410B
specifications with no intentionally
added halogens and halides
■
Low smoke and odor
■
Clear residue, resulting in excellent
joint aesthetics after soldering
■
Excellent surface wettability and
spreading suitable for automated sol-
dering besides manual soldering
■
Excellent manufacturing consistency
and uniform quality, minimizes defect
for all types of soldering
■
Eliminates the need and expense of
cleaning
■
Classified as ROL0 per J-STD-004B
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead
containing products at the user level. (Applies only if this core flux is combined with a lead-free alloy)
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Tested to J-STD-004B, IPC-TM-650, Method
2.3.32
Tested to J-STD-004B, IPC-TM-650, Method
2.6.15
Quantitative Halides:
None Detected
Tested to J-STD-004, IPC-TM-650, Method
2.3.28.1
Electrochemical Migration
Resistance:
Pass
Quantitative Halogens:
None
Detected
Tested to J-STD-004B, IPC-TM-650, Method
2.6.14.1
Silver Chromate:
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.3.33
Tested to IPC-TM-650, Method 2.3.35; JPCA-
ES-01; prEN14582 and IEC61189-2 Test 2C12
specifications
Surface Insulation Resistance (SIR),
(typical):
Pass,
All Readings >1.0*10
8
Ω
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
Blank
Day 1 (96h)
Day 4 (500h)
9.2*10 Ω
9
296
3.0*10
8
Ω
3.5*10
9
Ω
4.1*10
9
Ω
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
For most applications, Sn96.5Ag3.0Cu0.5 is recommended for lead-free soldering whilst Sn63Pb37 is recommended
for leaded soldering. For low-cost, lead-free soldering applications, K100LD can be used. Wire diameters typically
range from 0.25-1.27mm (0.010-0.050in). A Standard Wire Diameters chart is included in Kester’s Product Catalog. The
amount of flux in the wire dictates the ease of soldering for an application. For tin/lead applications, 2.2% flux by weight
is recommended. For lead-free applications, 2.2% flux by weight or 3.3% flux by weight is recommended. Please contact
Kester Technical Support for assistance on availability of other core sizes and wire diameters.
®
Process Considerations
Solder iron tip temperatures are most commonly between 260-370°C (500-700°F) for Sn63Pb37 and 371-400°C (662-
752°F) for SnAgCu alloys. Heat both the land area and component lead to be soldered with the iron prior to adding 296
cored wire. Apply the solder wire to the land area or component lead. Do not apply the solder to the soldering iron tip in
order to reduce spattering of the wire. If needed, Kester 952-D6 Flux Pen may be used as a compatible liquid flux to aid in
reworking soldered joints.
Cleaning
296 flux residues are non-corrosive, non-conductive and do not require removal in most applications. If residue removal is
required, call Kester Technical Support.
Storage and Shelf Life
Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull shade of gray.
This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life
determined by the alloy used in the wire. For alloys containing more than 70% lead, the shelf life is two years from the
date of manufacture. Other alloys have a shelf life of three years from the date of manufacture.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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