Technical Data Sheet
One-part Epoxy, General Purpose Adhesive, Low T
g
Description
9300 is a general purpose, one-part epoxy adhesive with a low cure temperature. It is smooth, thixotropic,
self-leveling, and bonds well to a wide variety of substances. It has an unlimited working life at room
temperature and does not require frozen storage.
This product is designed for low stress bonding in electronic assembly operations. It does not require
mixing and can be readily used in manual, pneumatic and robotic dispensing processes.
9300 has been formulated to have a low T
g
, which minimizes stress on substrates during temperature
changes. For a higher T
g
, use 9310.
9300
Features and Benefits
• Minimum cure temperature of 70 °C [158 °F]
• Unlimited working life
• Shelf life: 2 years at room temperature
• Provides strong electrical insulation
• T
g
of 22 °C [72 °F]
• Strong resistance to humidity, salt water, acids, bases, and aliphatic hydrocarbons
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 1
9300
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life @22 °C [72 °F]
Full cure @22 °C [72 °F]
Full cure @70 °C [158 °F]
Full cure @80 °C [176 °F]
Full cure @90 °C [194 °F]
Value
Unlimited
2y
Heat cure only
1h
40 min
25 min
Temperature Ranges
Properties
Constant service temperature
Storage temperature
Value
-55 to 140 °C [-67 to 284 °F]
-10 to 27 °C [14 to 81 °F]
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 2
9300
Cured Properties
Physical Properties
Color
Density @25 °C [77 °F]
Hardness
Tensile strength
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
Value
a)
Amber
1.18 g/mL
80D
4.7 N/mm
2
[680 lb/in
2
]
91 N/mm
2
[13 200 lb/in
2
]
7.9 N/mm
2
[1 100 lb/in
2
]
6.2 N/mm
2
[900 lb/in
2
]
8.6 N/mm
2
[1 200 lb/in
2
]
7.2 N/mm
2
[1 000 lb/in
2
]
Electrical Properties
Breakdown voltage @3.7 mm
Dielectric strength @3.7 mm
Breakdown voltage @3.175 mm [1/8”]
Dielectric strength @3.175 mm [1/8”]
Volume resistivity
Volume conductivity
Method
ASTM D 149
ASTM D 149
Reference fit
b)
Reference fit
b)
ASTM D 257
ASTM D 257
Value
47 800 V [47.8 kV]
330 V/mil [13 kV/mm]
45 000 V [45 kV]
357 V/mil [14 kV/mm]
3.4 x 10
12
Ω·cm
2.9 x 10
-13
S/cm
Note: Specifications are for epoxy samples cured at 90 °C for 25 min and conditioned at ambient
temperature and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
b)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 3
9300
Cured Properties
Thermal Properties
Glass transition temperature (T
g
)
CTE
a)
prior T
g
after T
g
Method
ASTM E 831
ASTM E 831
ASTM E 831
Value
22 °C [72 °F]
49 ppm/°C [120 ppm/°F]
197 ppm/°C [387 ppm/°F]
Note: Specifications are for epoxy samples cured at 90 °C for 25 min and conditioned at ambient
temperature and humidity.
a)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
Uncured Properties
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Method
Visual
IPC TM-650
Method 2.4.34.4
ASTM D 1475
Value
Amber
1 200 000 cP [1 200 Pa·s]
a)
1.17 g/mL
a)
Brookfield viscometer at 2.5 rpm with spindle RV B92
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 4
9300
Compatibility
Adhesion—9300
epoxy adheres to most
plastics and metals used to house printed
circuit assemblies; however, it is not compatible
with contaminants like water, oil, or greasy
flux residues that may affect adhesion. If
contamination is present, first clean the surface
to be coated with MG Chemicals 824 Isopropyl
Alcohol.
For substrates with weak adhesion strength,
surface preparation (such as sanding, or pre-
coating with a suitable primer) may improve
adhesion.
Chemical—The
cured epoxy adhesive is inert
under normal conditions. It can tolerate short-
term exposure to fuels or similar non-polar
organic solvents, but it may not be suitable for
prolonged exposure. Avoid using with strong
acids, strong bases, or strong oxidizers.
Application Instructions
For best results, follow the procedure below.
This product does not require mixing prior to
use, and can be applied with a spatula, trowel,
or automated dispensing machine.
Syringe or cartridge:
1.
For 10 mL size, twist and remove the cap from
the syringe. Do not discard the cap.
2.
For the 300 mL size, cut the end of the
cartridge tip.
a.
Screw the tip on the cartridge.
b.
Insert the cartridge in a caulking gun.
3.
Dispense the adhesive evenly to both surfaces.
4.
To stop the flow, pull back on the plunger.
5.
Clean nozzle to prevent contamination and
material buildup.
6.
Replace the cap on the cartridge or syringe.
Storage
Store between -10 and 27 °C [14 and 81 °F]
in a dry area, away from sunlight. Some of the
components are sensitive to air. To maximize
shelf life, always recap product firmly when not
in use.
Cure Instructions
Room temperature cure:
Do NOT cure at room temperature. This product
will only cure at elevated temperatures.
Heat cure:
• Put in oven at 70 °C [158 °F] for 1 h.
—OR—
• Put in oven at 80 °C [176 °F] for 40 min.
—OR—
• Put in oven at 90 °C [194 °F] for 25 min.
Health and Safety
Please see the 9300 Safety Data Sheet (SDS)
for further details on transportation, storage,
handling, safety guidelines, and regulatory
compliance.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 5
FPGA/CPLD
