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934050600113

DIODE SILICON, PIN DIODE, HERMETIC SEALED, GLASS PACKAGE-2, PIN Diode

器件类别:分立半导体    二极管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
包装说明
O-LALF-W2
针数
2
Reach Compliance Code
unknown
ECCN代码
EAR99
Is Samacsys
N
应用
ATTENUATOR
外壳连接
ISOLATED
配置
SINGLE
最大二极管电容
6 pF
二极管元件材料
SILICON
最大二极管正向电阻
10 Ω
二极管类型
PIN DIODE
频带
LOW FREQUENCY
JESD-30 代码
O-LALF-W2
少数载流子标称寿命
25 µs
元件数量
1
端子数量
2
封装主体材料
GLASS
封装形状
ROUND
封装形式
LONG FORM
认证状态
Not Qualified
表面贴装
NO
技术
POSITIVE-INTRINSIC-NEGATIVE
端子形式
WIRE
端子位置
AXIAL
Base Number Matches
1
文档预览
DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D119
BAQ800
AM PIN diode
Product specification
File under Discrete Semiconductors, SC01
1997 Aug 26
Philips Semiconductors
Product specification
AM PIN diode
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Available in ammopack.
APPLICATIONS
RF attenuator with low distortion for
frequencies above 100 kHz.
Fig.1 Simplified outline (SOD81) and symbol.
handbook, 4 columns
BAQ800
DESCRIPTION
Cavity free cylindrical glass package
through Implotec™
(1)
technology.
This package is hermetically sealed
and stress free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
k
a
MAM123
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
V
RRM
V
R
I
F(AV)
PARAMETER
repetitive peak reverse voltage
continuous reverse voltage
average forward current
T
tp
= 25
°C;
lead length = 10 mm;
see Fig.2
T
amb
= 60
°C;
printed-circuit board
mounting (see Fig.17); see Fig.3
T
stg
T
j
storage temperature
junction temperature
CONDITIONS
MIN.
−65
−65
MAX.
100
100
1.25
600
+175
+150
V
V
A
mA
°C
°C
UNIT
1997 Aug 26
2
Philips Semiconductors
Product specification
AM PIN diode
BAQ800
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified; all characteristics must be tested in the dark because of the light sensitivity
of this product.
SYMBOL
V
F
PARAMETER
forward voltage
CONDITIONS
I
F
= 100 mA; see Figs 4 and 5
I
F
= 100 mA; T
j
= T
j max
;
see Figs 4 and 5
I
R
τ
reverse current
charge carrier life time
V
R
= 100 V; see Fig.14
V
R
= 100 V; T
j
= 125
°C;
see Fig.14
when switched from I
F
= 10 mA to
I
R
= 6 mA; measured at 10% of I
R
;
see Fig.15
f = 1 MHz; see Figs 6, 7, 8 and 9
V
R
= 0
V
R
= 2 V
r
D
diode forward resistance
f = 100 kHz; see Figs 10 and 16
I
F
= 10
µA
I
F
= 100
µA
I
F
= 1 mA
I
F
= 10 mA
r
s
diode series resistance
f = 100 kHz; see Figs 11, 12 and 13
V
R
= 0
V
R
= 2 V
f = 1 MHz; see Figs 11, 12 and 13
V
R
= 0
V
R
= 2 V
25
100
50
220
kΩ
kΩ
1000
5000
2200
11000
kΩ
kΩ
3100
380
42
5
6000
800
80
10
10
5
12
6
pF
pF
MIN.
10
TYP.
0.9
0.7
20
MAX.
1.1
0.9
0.1
30
V
V
µA
µA
µs
UNIT
C
d
diode capacitance
THERMAL CHARACTERISTICS
All characteristics must be tested in the dark because of the light sensitivity of this product.
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
≥40 µm,
see Fig.17.
For more information please refer to the
“General Part of Handbook SC01”.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
lead length = 10 mm
VALUE
60
120
UNIT
K/W
K/W
1997 Aug 26
3
Philips Semiconductors
Product specification
AM PIN diode
GRAPHICAL DATA
BAQ800
handbook, halfpage
1.5
MGG498
handbook, halfpage
1.5
MGG499
IF(AV)
(A)
1.0
IF(AV)
(A)
1.0
0.5
0.5
0
0
100
Ttp (°C)
200
0
0
100
Tamb (°C)
200
DC application.
DC application.
Fig.2
Maximum permissible average forward
current as a function of tie-point temperature.
Fig.3
Maximum permissible average forward
current as a function of ambient temperature.
10
4
handbook, halfpage
IF
(mA)
10
3
10
2
MGG500
10
4
handbook, halfpage
IF
(mA)
10
3
10
2
MGG501
10
10
1
10
−1
10
−2
0
0.4
0.8
1.2
1.6
VF (V)
2.0
1
10
−1
10
−2
0
0.4
0.8
1.2
1.6
VF (V)
2.0
Dotted line: T
j
= 150
°C.
Solid line: T
j
= 25
°C.
Dotted line: T
j
= 150
°C.
Solid line: T
j
= 25
°C.
Fig.4
Forward voltage as a function of
forward current; typical values.
Fig.5
Forward voltage as a function of
forward current; maximum values.
1997 Aug 26
4
Philips Semiconductors
Product specification
AM PIN diode
BAQ800
handbook, halfpage
12
MGG503
handbook, halfpage
12
MGL101
(1)
Cd
(pF)
8
Cd
(pF)
8
(2)
4
4
0
0
2
4
6
8
VR (V)
10
0
10
10
2
10
3
f (kHz)
10
4
f = 1 MHz; T
j
= 25
°C.
T
j
= 25
°C.
(1) V
R
= 0.
(2) V
R
= 2 V.
Fig.6
Diode capacitance as a function of
reverse voltage; typical values.
Fig.7
Diode capacitance as a function of
frequency; typical values.
handbook, halfpage
C
24
d
(pF)
20
MGK448
handbook, halfpage
C
(1)
(2)
(3)
(1)
6
d
(pF)
5
MGK449
16
4
12
(2)
(3)
3
8
2
4
1
0
10
2
f (kHz)
10
3
0
10
2
f (kHz)
10
3
(1) T
j
= 85
°C.
(2) T
j
= 25
°C.
(3) T
j
=
−40 °C.
V
R
= 0.
(1) T
j
= 85
°C.
(2) T
j
= 25
°C.
(3) T
j
=
−40 °C.
V
R
= 2 V.
Fig.8
Diode capacitance as a function of
frequency; typical values.
Fig.9
Diode capacitance as a function of
frequency; typical values.
1997 Aug 26
5
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