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935264440557

16-BIT, 30MHz, MICROCONTROLLER, PQFP100, 14 X 14 X 1.40 MM, PLASTIC, SOT-407-1, LQFP-100

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
Objectid
8079268499
包装说明
LFQFP,
Reach Compliance Code
unknown
ECCN代码
3A991.A.2
YTEOL
0
具有ADC
NO
地址总线宽度
20
位大小
16
最大时钟频率
30 MHz
DAC 通道
NO
DMA 通道
YES
外部数据总线宽度
16
JESD-30 代码
S-PQFP-G100
JESD-609代码
e3
长度
14 mm
I/O 线路数量
32
端子数量
100
最高工作温度
85 °C
最低工作温度
-40 °C
PWM 通道
NO
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
座面最大高度
1.6 mm
速度
30 MHz
最大供电电压
3.63 V
最小供电电压
2.97 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
INTEGRATED CIRCUITS
XA-H3
CMOS 16-bit highly integrated
microcontroller
Preliminary specification
IC28 Data Handbook
1999 Sep 24
Philips
Semiconductors
Philips Semiconductors
Preliminary specification
CMOS 16-bit highly integrated microcontroller
XA-H3
DESCRIPTION
The powerful 16-bit XA CPU core and rich feature set make the
XA-H3 and XA-H4 devices ideal for high-performance real-time
applications such as industrial control and networking. By supporting
of up to 32 MB of external memory, these devices provide a low-cost
solution to embedded applications of any complexity. Features like
DMA, memory controller and four advanced UARTs help solve I/O
intensive tasks with a minimum of CPU load.
The XA-H3 feature set is a subset of the XA-H4 (see Table 1). The
XA-H3/H4 devices are members of the Philips XA (eXtended
Architecture) family of high performance 16-bit microcontrollers.
The XA-H3 and XA-H4 are designed to significantly minimize the
need for external components.
FEATURES
Large Memory Support (up to 6 MB external)
De-multiplexed Address/Data Bus
Six Programmable Chip Selects
Support for Unified Memory – allows easy user modification of
all code
External ISP Flash support for easy code download
Dynamic Bus Timing – each of 6 chip selects has individual
programmable bus timing.
32 Programmable General Purpose I/O Pins
Four UARTs with 230.4 kbps capability
Eight DMA Channels
Dynamic Bus Sizing – each of 6 Chip Selects can be programmed
for 8-bit or 16-bit bus.
Table 1. XA-H3 and XA-H4 features comparison
Feature
Maximum External Memory
(Harvard Memory Mode)
Maximum External Memory (Unified Memory Mode)
Memory Controller supports both Harvard and Unified architectures
De-multiplexed Address/Data Bus
DRAM Controller
DMA Channels
Dynamic Bus Sizing
Dynamic Bus Timing
Programmable Chip Selects
General Purpose IO Pins
Potential Interrupt Pins
Interrupts (programmable priority)
XA-H3
6 MB
6 MB
Yes
Yes
No
8
Yes
Yes
6
33
16
7 Standard SW
4 High Priority SW
13 Hardware Event
Counter/Timers
Baud Rate Generators
1
Serial Ports
Maximum Serial Data Rates
Match Characters
Hardware Autobaud
SCP/SPI Bus
NOTE:
1. Can be used as additional counters if not needed as BRGs.
2 plus Watchdog
4
4 UARTS
asynch to 230.4 kbps (no sync)
No
No
No
XA-H4
32 MB
(16 MB Code, 16 MB Data)
16 MB
Yes
Yes
Yes
8
Yes
Yes
6
33
16
7 Standard SW
4 High Priority SW
13 Hardware Event
2 plus Watchdog
4
4 USARTS
asynch to 230.4 kbps
sync to 1 Mbps
4 async chars per USART
up to 230.4 kbps
1999 Sep 24
2
Philips Semiconductors
Preliminary specification
CMOS 16-bit highly integrated microcontroller
XA-H3
ORDERING INFORMATION
ROMless Only
H3 = PXAH30KFBE
Temperature range
°C
and Package
–40 to +85
°
C, 100-Pin Low Profile Quad Flat Package (LQFP)
Freq (MHz)
30
Package Drawing Number
SOT407-1
NOTE
K=30 MHz, F = (–40 to +85), BE = LQFP
PIN CONFIGURATION
83 P2.3_ComClk_TRClk3
94 P0.4_TRClk0
95 P0.5_RTClk0
82 P2.2_RTClk3
90 P0.0_BRG0
87 P2.7_BRG3
92 P0.2_CTS0
85 P2.5_CTS3
91 P0.1_RTS0
86 P2.6_RTS3
80 P2.0_RxD3
81 P2.1_TxD3
93 P0.3_CD0
84 P2.4_CD3
78 CD1_Int2
98 GPOut
97 RxD0
96 TxD0
89 VDD
100 P0.7
77 VDD
99 P0.6
88 VSS
VSS
VDD
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
VSS
VDD
A16
A17
A18
A19
D0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
MOLD MARK
MOLD MARK
76 VSS
75 P1.7_BRG2
74 P1.6_RTS2
73 P1.5_CTS2
72 P1.4_CD2
71 P1.3_TRClk2
70 P1.2_RTClk2
69 P1.1_TxD2
68 P1.0_RxD2
67 P3.7_Int1_TRClk1
66 P3.6_TxD1
65 P3.5_RxD1
64 P3.4_CTS1
63 P3.3_Timer1_BRG1
62 VDD
61 XTALOUT
60 XTALIN
59 VSS
58 P3.2_Timer0_ResetOut
57 P3.1_CS5_RTS1
56 P3.0_CS4_RTClk1
55 Reset_In
54
BLE
53 BHE
52 WAIT_Size16
51 OE
WE
XA-H3
Top View 100 Pin LQFP
Part Number: PXAH30KFBE
K = 30 MHz, F = –40 to +85°C, BE = LQFP pkg
LQFP Package = SOT407-1
D11
ClkOut
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D12
D13
D14
D15
CS3
CS2
79 Int0
CS1
VSS
VDD
VDD
VSS
CS0
SU01234
1999 Sep 24
3
Philips Semiconductors
Preliminary specification
CMOS 16-bit highly integrated microcontroller
XA-H3
LOGIC SYMBOL XA-H3
V
DD
Int0
MISC.
Int2
CS4
CS5
ResetOut, Timer0
Timer1
UART1
CD1
RTClk1
RTS1
BRG1
CTS1
RxD1
TxD1
TRClk1
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
XTAL2
PORT3
V
SS
XTAL1
CS3
CS2
CS1
CS0
Int1
UART3
RxD3
TxD3
RTClk3
ComClk, TRClk3
CD3
CTS3
RTS3
BRG3
PORT2
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
A19 – A0
D15 – D0
UART2
RxD2
TxD2
RTClk2
TRClk2
CD2
CTS2
RTS2
BRG2
PORT1
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
ClkOut
BHE
BLE
OE
WE
UART0
TxD0
RxD0
BRG0
RTS0
CTS0
CD0
TRClk0
RTClk0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
GPOut
SU01235
PORT0
Wait, Size16
ResetIn
1999 Sep 24
4
Philips Semiconductors
Preliminary specification
CMOS 16-bit highly integrated microcontroller
XA-H3
XA-H3 BLOCK DIAGRAM
XA-H3 CPU Core
256 Bytes Data
SRAM
Data
MMR Bus
SFR Bus
DMA R0
UART 0
Port 0
DMA T0
Port 1
DMA R1
UART 1
DMA T1
Port 2
DMA R2
Port 3
UART 2
DMA T2
Timer 0
DMA R3
UART 3
DMA T3
Timer 1
Watchdog
Timer
Memory Bus Controller
6 Chip Selects
Dynamic Bus Sizing
Dynamic Bus Timing
External
System Bus
SU01247
1999 Sep 24
5
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