Bus Driver, CBTLV/3B Series, 4-Func, 1-Bit, True Output, CMOS, PQCC14
厂商名称:Nexperia
器件标准:
下载文档型号 | 935289342115 | 935289343118 | 935289344118 |
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描述 | Bus Driver, CBTLV/3B Series, 4-Func, 1-Bit, True Output, CMOS, PQCC14 | Bus Driver, CBTLV/3B Series, 4-Func, 1-Bit, True Output, CMOS, PDSO16 | Bus Driver, CBTLV/3B Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14 |
是否Rohs认证 | 符合 | 符合 | 符合 |
包装说明 | HVQCCN, | SSOP, | TSSOP, |
Reach Compliance Code | compliant | compliant | compliant |
系列 | CBTLV/3B | CBTLV/3B | CBTLV/3B |
JESD-30 代码 | R-PQCC-N14 | R-PDSO-G16 | R-PDSO-G14 |
JESD-609代码 | e4 | e4 | e4 |
长度 | 3 mm | 4.9 mm | 5 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER |
湿度敏感等级 | 1 | 1 | 1 |
位数 | 1 | 1 | 1 |
功能数量 | 4 | 4 | 4 |
端口数量 | 2 | 2 | 2 |
端子数量 | 14 | 16 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | SSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 0.31 ns | 0.31 ns | 0.31 ns |
座面最大高度 | 1 mm | 1.73 mm | 1.1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.635 mm | 0.65 mm |
端子位置 | QUAD | DUAL | DUAL |
宽度 | 2.5 mm | 3.9 mm | 4.4 mm |