NTB0104
Dual supply translating transceiver; auto direction sensing;
3-state
Rev. 4 — 19 April 2018
Product data sheet
1. General description
The NTB0104 is a 4-bit, dual supply translating transceiver with auto direction sensing,
that enables bidirectional voltage level translation. It features two 4-bit input-output ports
(An and Bn), one output enable input (OE) and two supply pins (V
CC(A)
and V
CC(B)
). V
CC(A)
can be supplied at any voltage between 1.2 V and 3.6 V and V
CC(B)
can be supplied at any
voltage between 1.65 V and 5.5 V, making the device suitable for translating between any
of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V).
Pins An and OE are referenced to V
CC(A)
and pins Bn are referenced to V
CC(B)
. A LOW
level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is
fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables
the output, preventing the damaging backflow current through the device when it is
powered down.
2. Features and benefits
Wide supply voltage range:
V
CC(A)
: 1.2 V to 3.6 V and V
CC(B)
: 1.65 V to 5.5 V
I
OFF
circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM JESD22-A114E Class 2 exceeds 2500 V for A port
HBM JESD22-A114E Class 3B exceeds 15000 V for B port
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1500 V (For NTB0104UK 1000 V)
Latch-up performance exceeds 100 mA per JESD 78B Class II
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
NXP Semiconductors
NTB0104
Dual supply translating transceiver; auto direction sensing; 3-state
3. Ordering information
Table 1.
Ordering information
Topside
marking
B0104
Package
Name
Description
Version
SOT762-1
DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad
flat package; no leads; 14 terminals; body 2.5
3
0.85 mm
XQFN12
WLCSP12
Type number
NTB0104BQ
NTB0104GU12 t4
NTB0104UK
t04
plastic, extremely thin quad flat package; no leads; 12 terminals; SOT1174-1
body 1.70
2.0
0.50 mm
wafer level chip-size package, 12 bumps; body 1.20
1.60
0.56 mm. (Backside Coating included)
NTB0104UK
3.1 Ordering options
Table 2.
Ordering options
Orderable
part number
NTB0104BQ,115
Package
Packing method
Minimum
order quantity
Temperature
T
amb
=
40 C
to +125
C
Type number
NTB0104BQ
DHVQFN14 REEL 7" Q1/T1
3000
*STANDARD MARK
SMD
XQFN12
REEL 7" Q1/T1
4000
*STANDARD MARK
SMD
REEL 7" Q1/T1
*SPECIAL MARK
CHIPS DP
5000
NTB0104GU12
NTB0104GU12,115
T
amb
=
40 C
to +125
C
NTB0104UK
NTB0104UK,012
WLCSP12
T
amb
=
40 C
to +125
C
NTB0104
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 4 — 19 April 2018
2 of 28
NXP Semiconductors
NTB0104
Dual supply translating transceiver; auto direction sensing; 3-state
4. Functional diagram
OE
A1
B1
A2
B2
A3
B3
A4
B4
V
CC(A)
V
CC(B)
001aam795
Fig 1.
Logic symbol
NTB0104
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 4 — 19 April 2018
3 of 28
NXP Semiconductors
NTB0104
Dual supply translating transceiver; auto direction sensing; 3-state
5. Pinning information
5.1 Pinning
NTB0104
V
CC(A)
2
3
4
5
6
7
GND
OE
8
GND
(1)
1
terminal 1
index area
A1
A2
A3
A4
n.c.
14 V
CC(B)
13 B1
12 B2
11 B3
10 B4
9
n.c.
001aam797
Transparent top view
(1) This is not a supply pin, the substrate is attached to this pad using conductive die attach material. There is no electrical or
mechanical requirement to solder this pad, however if it is soldered the solder land should remain floating or be connected to
GND
Fig 2.
Pin configuration DHVQFN14 (SOT762-1)
NTB0104
12 OE
terminal 1
index area
V
CC(A)
1
A1 2
A2 3
A3 4
A4 5
ball A1
index area
A
11 V
CC(B)
10 B1
9 B2
8 B3
D
7 B4
001aam799
NTB0104
1
2
3
B
C
GND 6
Transparent top view
aaa-000415
Transparent top view
Fig 3.
Pin configuration XQFN12 (SOT1174-1)
Fig 4.
Pin configuration WLCSP12 package
NTB0104
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 4 — 19 April 2018
4 of 28
NXP Semiconductors
NTB0104
Dual supply translating transceiver; auto direction sensing; 3-state
NTB0104
1
A
B1
2
V
CC(B)
3
A1
B
B2
V
CC(A)
A2
C
B3
OE
A3
D
B4
GND
A4
Transparent top view
aaa-000416
Fig 5.
Ball mapping for WLCSP12
5.2 Pin description
Table 3.
Symbol
V
CC(A)
A1, A2, A3, A4
n.c.
GND
OE
B4, B3, B2, B1
V
CC(B)
Pin description
Pin
SOT762-1
1
2, 3, 4, 5
6, 9
7
8
10, 11, 12, 13
14
SOT1174-1
1
2, 3, 4, 5
-
6
12
7, 8, 9, 10
11
Ball
WLCSP12
B2
A3, B3, C3, D3
-
D2
C2
D1, C1, B1, A1
A2
supply voltage A
data input or output (referenced to V
CC(A)
)
not connected
ground (0 V)
output enable input (active HIGH; referenced to
V
CC(A)
)
data input or output (referenced to V
CC(B)
)
supply voltage B
Description
6. Functional description
Table 4.
V
CC(A)
1.2 V to V
CC(B)
1.2 V to V
CC(B)
GND
[2]
[1]
[2]
Function table
[1]
Input
V
CC(B)
1.65 V to 5.5 V
1.65 V to 5.5 V
GND
[2]
OE
L
H
X
Input/output
An
Z
input or output
Z
Bn
Z
output or input
Z
Supply voltage
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
When either V
CC(A)
or V
CC(B)
is at GND level, the device goes into power-down mode.
NTB0104
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 4 — 19 April 2018
5 of 28