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74LVT244A-Q100;

74LVTH244A-Q100

3.3 V octal buffer/line driver; 3-state

Rev. 1 — 22 April 2013

Product data sheet

1. General description

The 74LVT244A-Q100; 74LVTH244A-Q100 is a high-performance BiCMOS product

designed for V

operation at 3.3 V.

This device is an octal buffer that is ideal for driving bus lines. The device features two

output enables (1OE, 2OE), each controlling four of the 3-state outputs.

This product has been qualified to the Automotive Electronics Council (AEC) standard

Q100 (Grade 3) and is suitable for use in automotive applications.

2. Features and benefits



Automotive product qualification in accordance with AEC-Q100 (Grade 3)



Specified from

40 C

to +85

C



Octal bus interface



3-state buffers



Output capability: +64 mA and

32



TTL input and output switching levels



Input and output interface capability to systems at 5 V supply



Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs



Live insertion and extraction permitted



Power-up 3-state



No bus current loading when output is tied to 5 V bus



Latch-up protection



JESD78 Class II exceeds 500 mA



ESD protection:



MIL-STD-883, method 3015 exceeds 2000 V



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0

)

NXP Semiconductors

74LVT244A-Q100; 74LVTH244A-Q100

3.3 V octal buffer/line driver; 3-state

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74LVT244AD-Q100

74LVTH244AD-Q100

74LVT244APW-Q100

74LVTH244APW-Q100

74LVT244ABQ-Q100

74LVTH244ABQ-Q100

40 C

to +85

C

40 C

to +85

C

TSSOP20

40 C

to +85

C

SO20

Description

plastic small outline package; 20 leads;

body width 7.5 mm

plastic thin shrink small outline package;

20 leads; body width 4.4 mm

Version

SOT163-1

SOT360-1

Type number

DHVQFN20 plastic dual in-line compatible thermal enhanced SOT764-1

very thin quad flat package; no leads;

20 terminals; body 2.5



4.5



0.85 mm

4. Functional diagram

1A0

1Y0

1A1

1Y1

1A2

1Y2

1A3

1OE

1Y3

2A0

2Y0

mna826

2A1

2Y1

2A2

2Y2

2A3

2OE

2Y3

mna825

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

74LVT_LVTH244A_Q100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 22 April 2013

2 of 15

NXP Semiconductors

74LVT244A-Q100; 74LVTH244A-Q100

3.3 V octal buffer/line driver; 3-state

5. Pinning information

5.1 Pinning

/97$4

/97+$4

*1'

WHUPLQDO

LQGH[ DUHD

/97$4

/97+$4

DDD

*1'

DDD

7UDQVSDUHQW WRS YLHZ

(1) This is not a supply pin. The substrate is attached to this

pad using conductive die attach material. There is no

electrical or mechanical requirement to solder this pad.

However, if it is soldered, the solder land should remain

floating or be connected to GND.

Fig 3.

Pin configuration for SO20 and TSSOP20

Fig 4.

Pin configuration for DHVQFN20

5.2 Pin description

Table 2.

Symbol

1OE, 2OE

1A0, 1A1, 1A2, 1A3

2Y0, 2Y1, 2Y2, 2Y3

GND

2A0, 2A1, 2A2, 2A3

1Y0, 1Y1, 1Y2, 1Y3,

Pin description

1, 19

2, 4, 6, 8

9, 7, 5, 3

Description

output enable input (active low)

data input

data output

ground (0 V)

11, 13, 15, 17 data input

18, 16, 14, 12 data output

supply voltage

74LVT_LVTH244A_Q100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 22 April 2013

3 of 15

NXP Semiconductors

74LVT244A-Q100; 74LVTH244A-Q100

3.3 V octal buffer/line driver; 3-state

6. Functional description

6.1 Function table

Table 3.

Control

nOE

[1]

Function table

[1]

Input

nAn

Output

nYn

H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

7. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

stg

tot

[1]

[2]

[3]

Parameter

supply voltage

input voltage

output voltage

input clamping current

output clamping current

output current

storage temperature

junction temperature

total power dissipation

Conditions

[1]

Min

0.5

65

[2]

Max

+4.6

+7.0

50

128

64

+150

150

500

Unit

C

output in OFF-state or

HIGH-state

< 0 V

output in LOW-state

output in HIGH-state

[1]

amb

40

to +85

C

[3]

The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.

The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction

temperatures which are detrimental to reliability.

For SO20 package: above 70

C

derate linearly with 8 mW/K.

For TSSOP20 package: above 60

C

derate linearly with 5.5 mW/K.

For DHVQFN20 package: above 60

C

derate linearly with 4.5 mW/K.

8. Recommended operating conditions

Table 5.

Symbol

Operating conditions

Parameter

supply voltage

input voltage

HIGH-level output current

Conditions

Min

2.7

Typ

Max

3.6

5.5

32

Unit

74LVT_LVTH244A_Q100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 22 April 2013

4 of 15

NXP Semiconductors

74LVT244A-Q100; 74LVTH244A-Q100

3.3 V octal buffer/line driver; 3-state

Table 5.

Symbol

amb

t/V

Operating conditions

…continued

Parameter

LOW-level output current

ambient temperature

Conditions

none

current duty cycle



50 %; f



1 kHz

in free-air

input transition rise and fall rate outputs enabled

Min

40

Typ

Max

+85

Unit

C

ns/V

9. Static characteristics

Table 6.

Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter

amb

40 C

to +85

C

[1]

input clamping voltage

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

= 2.7 V to 3.6 V; I

100 A

= 2.7 V to 3.6 V; I

8

= 3.0 V; I

32

LOW-level output voltage

= 2.7 V; I

= 100

A

= 2.7 V; I

= 24 mA

= 3.0 V; I

= 16 mA

= 3.0 V; I

= 32 mA

= 3.0 V; I

= 64 mA

input leakage current

all input pins

= 0 V or 3.6 V; V

= 5.5 V

control pins

= 3.6 V; V

= V

or GND

data pins

= 3.6 V; V

= V

= 3.6 V; V

= 0 V

OFF

BHL

BHH

BHLO

BHHO

O(pu/pd)

power-off leakage current

bus hold LOW current

bus hold HIGH current

bus hold LOW

overdrive current

bus hold HIGH

overdrive current

output leakage current

power-up/power-down

output current

= 0 V; V

or V

= 0 V to 4.5 V

= 3 V; V

= 0.8 V

= 3 V; V

= 2.0 V

nAn input;

= 0 V to 3.6 V; V

= 3.6 V

nAn input;

= 0 V to 3.6 V; V

= 3.6 V

nYn output in HIGH-state when

> V

; V

= 5.5 V; V

= 3.0 V



1.2 V; V

= 0.5 V to V

;

= GND or V

; nOE = don’t care

[4]

[3]

[2]

Conditions

= 2.7 V; I

18

Min

1.2

2.0

2.4

2.0

5



500

Typ

0.9

2.5

2.2

0.1

0.3

0.25

0.3

0.4

0.1

0.1

0.1

1

150

150

1

Max

0.8

0.2

0.5

0.4

0.5

0.55

1



100

75

500

125

100

Unit

A



0.2 V



0.1

74LVT_LVTH244A_Q100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 22 April 2013

5 of 15

参数对比

与935300471118相近的元器件有：935301624118、935301623118、935300469118、74LVT244ABQ-Q100、74LVTH244ABQ-Q100、74LVTH244AD-Q100、74LVTH244APW-Q100、74LVT244APW-Q100。描述及对比如下：

型号	935300471118	935301624118	935301623118	935300469118	74LVT244ABQ-Q100	74LVTH244ABQ-Q100	74LVTH244AD-Q100	74LVTH244APW-Q100	74LVT244APW-Q100
描述	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	IC DRIVER, Bus Driver/Transceiver	IC DRIVER, Bus Driver/Transceiver	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20	LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
包装说明	TSSOP,	TSSOP,	SOP,	SOP,	2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20	HVQCCN, LCC20,.1X.18,20	7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	compliant	unknown	unknown	unknown
系列	LVT	LVT	LVT	LVT	LVT	LVT	LVT	LVT	LVT
JESD-30 代码	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PQCC-N20	R-PQCC-N20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20
长度	6.5 mm	6.5 mm	12.8 mm	12.8 mm	4.5 mm	4.5 mm	12.8 mm	6.5 mm	6.5 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	4	4	4	4	4	4	4	4	4
功能数量	2	2	2	2	2	2	2	2	2
端口数量	2	2	2	2	2	2	2	2	2
端子数量	20	20	20	20	20	20	20	20	20
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	TSSOP	SOP	SOP	HVQCCN	HVQCCN	SOP	TSSOP	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟（tpd）	5.1 ns	5.1 ns	5.1 ns	5.1 ns	5.1 ns	5.1 ns	5.1 ns	5.1 ns	5.1 ns
筛选级别	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100
座面最大高度	1.1 mm	1.1 mm	2.65 mm	2.65 mm	1 mm	1 mm	2.65 mm	1.1 mm	1.1 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	1.27 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL
宽度	4.4 mm	4.4 mm	7.5 mm	7.5 mm	2.5 mm	2.5 mm	7.5 mm	4.4 mm	4.4 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
厂商名称	NXP(恩智浦)	-	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
是否Rohs认证	-	-	-	-	符合	符合	符合	符合	符合
零件包装代码	-	-	-	-	QFN	QFN	SOIC	TSSOP	TSSOP
针数	-	-	-	-	20	20	20	20	20
湿度敏感等级	-	-	-	-	1	1	1	1	1