Freescale Semiconductor, Inc.
Data Sheet: Technical Data
K22P144M120SF5
Rev 4, 11/2014
Kinetis K22F Sub-Family Data
Sheet
120 MHz ARM® Cortex®-M4-based Microcontroller with FPU
The K22 product family members are optimized for cost-sensitive
applications requiring low-power, USB connectivity, processing
efficiency with floating point unit. It shares the comprehensive
enablement and scalability of the Kinetis family. This product
offers:
• Up to 1 MB of flash memory with up to 128 KB of SRAM
• Small package with high memory density
• Run power consumption down to 279 μA/MHz. Static
power consumption down to 5.1 μA with full state retention
and 5 μs wakeup. Lowest Static mode down to 268 nA
• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO
voltage regulator
MK22FX512VLQ12
MK22FN1M0VLQ12
MK22FX512VMD12
MK22FN1M0VMD12
144 LQFP
144 BGA
20 x 20 x 1.6 mm Pitch 13 x 13 x 1.7 mm Pitch
0.5 mm
1 mm
Performance
• Up to 120 MHz ARM Cortex-M4-based core with DSP
instructions delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• Up to 1 MB program flash memory and 128 KB RAM
• Up to 128 KB FlexNVM and 4 KB FlexRAM on
FlexMemory devices
• FlexBus external bus interface
System peripherals
• Multiple low-power modes; low leakage wakeup unit
• Memory protection unit with multi-master protection
• 16-channel DMA controller
• External watchdog monitor and software watchdog
Security and integrity modules
• Hardware CRC module
• 128-bit unique identification (ID) number per chip
Analog modules
• Two 16-bit SAR ADCs
• Two 12-bit DACs
• Three analog comparators (CMP)
• Voltage reference
Communication interfaces
• USB full-/low-speed On-the-Go controller
• USB Device Charger detect
• Controller Area Network (CAN) module
• Three SPI modules
• Three I2C modules
• Six UART modules
• Secure Digital host controller (SDHC)
• I2S module
Timers
• Two 8-channel Flex-Timers (PWM/Motor Control)
• Two 2-channel Flex-Timers (PWM/Quad Decoder)
• Periodic interrupt timers and 16-bit low-power timer
• Carrier modulator transmitter
• Real-time clock
• Programmable delay block
Clocks
• 3 to 32 MHz and 32 kHz crystal oscillator
• PLL, FLL, and multiple internal oscillators
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): –40 to 105°C
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2013–2015 Freescale
Semiconductor, Inc. All rights reserved.
Ordering Information
1
Part Number
Flash (KB)
MK22FX512VLQ12
MK22FN1M0VLQ12
MK22FX512VMD12
MK22FN1M0VMD12
512 KB
1 MB
512 KB
1 MB
Memory
SRAM (KB)
128
128
128
128
100
100
100
100
Maximum number of I\O's
1. To confirm current availability of ordererable part numbers, go to
http://www.freescale.com
and perform a part number
search.
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Package
drawing
Description
The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Package dimensions are provided in package drawings.
Resource
Solution Advisor
K20PB
1
K22P144M50SF5RM
1
K22P144M50SF5
1
• LQFP 144-pin:
98ASS23177W
1
• MAPBGA-144 pin:
98ASA00222D
1
1. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term.
2
Freescale Semiconductor, Inc.
Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014.
Kinetis K21D Family
ARM
®
Cortex™-M4
Core
System
Internal
and external
watchdogs
Debug
interfaces
Interrupt
controller
DSP
DMA
Memories and Memory Interfaces
Program
flash
FlexMemory
Serial
programming
interface
RAM
Clocks
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
Floating
point
Low-leakage
wakeup
Internal
reference
clocks
and Integrity
CRC
Random
number
generator
Hardware
encryption
Tamper
detect
Security
Analog
16-bit ADC
Timers
FlexTimers
Communication Interfaces
I
C
2
Human-Machine
Interface (HMI)
GPIO
I
S
2
Analog
comparator
Carrier
modulator
transmitter
Programmable
UART
USB OTG
LS/FS/HS
6-bit DAC
delay block
SPI
USB LS/FS
transceiver
USB charger
detect
USB voltage
regulator
12-bit DAC
Periodic
interrupt
timers
Low power
timer
Voltage
reference
Independent
real-time
clock
Figure 1. K20 block diagram
Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014.
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................7
2.2.1
Voltage and current operating requirements.....7
2.2.2
LVD and POR operating requirements............. 8
2.2.3
Voltage and current operating behaviors.......... 8
2.2.4
Power mode transition operating behaviors......10
2.2.5
Power consumption operating behaviors.......... 10
2.2.6
EMC radiated emissions operating behaviors...14
2.2.7
Designing with radiated emissions in mind....... 15
2.2.8
Capacitance attributes...................................... 15
2.3 Switching specifications...................................................15
2.3.1
Device clock specifications............................... 15
2.3.2
General switching specifications....................... 16
2.4 Thermal specifications..................................................... 17
2.4.1
Thermal operating requirements....................... 17
2.4.2
Thermal attributes............................................. 17
3 Peripheral operating requirements and behaviors.................. 19
3.1 Core modules.................................................................. 19
3.1.1
Debug trace timing specifications..................... 19
3.1.2
JTAG electricals................................................ 19
3.2 System modules.............................................................. 22
3.3 Clock modules................................................................. 22
3.3.1
MCG specifications........................................... 22
3.3.2
Oscillator electrical specifications..................... 25
3.3.3
32 kHz oscillator electrical characteristics.........27
3.4 Memories and memory interfaces................................... 27
3.4.1
3.4.2
Flash (FTFE) electrical specifications............... 27
EzPort switching specifications......................... 32
3.4.3
Flexbus switching specifications....................... 33
3.5 Security and integrity modules........................................ 36
3.6 Analog............................................................................. 36
3.6.1
ADC electrical specifications.............................37
3.6.2
CMP and 6-bit DAC electrical specifications.....41
3.6.3
12-bit DAC electrical characteristics................. 43
3.6.4
Voltage reference electrical specifications........ 46
3.7 Timers..............................................................................47
3.8 Communication interfaces............................................... 47
3.8.1
USB electrical specifications............................. 47
3.8.2
USB DCD electrical specifications.................... 48
3.8.3
USB VREG electrical specifications..................48
3.8.4
CAN switching specifications............................ 49
3.8.5
DSPI switching specifications (limited voltage
range)................................................................49
3.8.6
DSPI switching specifications (full voltage
range)................................................................51
3.8.7
I2C switching specifications.............................. 52
3.8.8
UART switching specifications.......................... 53
3.8.9
SDHC specifications......................................... 53
3.8.10 I2S switching specifications.............................. 54
Dimensions............................................................................. 66
4.1 Obtaining package dimensions....................................... 66
Pinout...................................................................................... 67
5.1 K22 Signal Multiplexing and Pin Assignments.................67
5.2 K22 Pinouts..................................................................... 73
Revision History...................................................................... 75
Copyright................................................................................. 0
Legal....................................................................................... 0
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4
Freescale Semiconductor, Inc.
Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014.
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014.
5
Freescale Semiconductor, Inc.
