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935324564557

Microcontroller

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
Objectid
7371214034
Reach Compliance Code
unknown
Country Of Origin
Mainland China, Malaysia
ECCN代码
3A991.A.2
kg CO2e/kg
11.6
Average Weight (mg)
322
CO2e (mg)
3735.2
YTEOL
3
具有ADC
YES
地址总线宽度
位大小
8
CPU系列
HCS08
最大时钟频率
20 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
S-PQFP-G64
JESD-609代码
e3
长度
14 mm
湿度敏感等级
3
I/O 线路数量
57
端子数量
64
最高工作温度
105 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装等效代码
QFP64,.63SQ,32
封装形状
SQUARE
封装形式
FLATPACK
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
RAM(字节)
4096
ROM(单词)
32768
ROM可编程性
FLASH
速度
20 MHz
最大压摆率
14.8 mA
最大供电电压
5.5 V
最小供电电压
2.7 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN
端子形式
GULL WING
端子节距
0.8 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
40
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
Freescale Semiconductor
Data Sheet: Technical Data
Document Number MC9S08PA60
Rev. 3, 06/2015
MC9S08PA60 Series Data
Sheet
Supports: MC9S08PA60(A) and
MC9S08PA32(A)
Key features
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 105 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 60 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM; 2-byte erase sector;
program and erase while executing flash
– Up to 4096 byte random-access memory (RAM)
– Flash and RAM access protection
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable clocks to
unused modules, reducing currents; allows clocks to
remain enabled to specific peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz
– Internal clock source (ICS) - containing a frequency-
locked-loop (FLL) controlled by internal or external
reference; precision trimming of internal reference
allowing 1% deviation across temperature range of 0
°C to 70 °C and 2% deviation across temperature
range of -40 °C to 105 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
MC9S08PA60
MC9S08PA60A and MC9S08PA32A
are recommended for new design
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger modes
• Peripherals
– ACMP - one analog comparator with both positive
and negative inputs; separately selectable interrupt
on rising and falling comparator output; filtering
– ADC - 16-channel, 12-bit resolution; 2.5 µs
conversion time; data buffers with optional
watermark; automatic compare function; internal
bandgap reference channel; operation in stop mode;
optional hardware trigger
– CRC - programmable cyclic redundancy check
module
– FTM - three flex timer modulators modules
including one 6-channel and two 2-channel ones;
16-bit counter; each channel can be configured for
input capture, output compare, edge- or center-
aligned PWM mode
– IIC - One inter-integrated circuit module; up to 400
kbps; multi-master operation; programmable slave
address; supporting broadcast mode and 10-bit
addressing; supporting SMBUS and PMBUS
– MTIM - Two modulo timers with 8-bit prescaler and
overflow interrupt
– RTC - 16-bit real timer counter (RTC)
– SCI - three serial communication interface (SCI/
UART) modules optional 13-bit break; full duplex
non-return to zero (NRZ); LIN extension support
– SPI - one 8-bit and one 16-bit serial peripheral
interface (SPI) modules; full-duplex or single-wire
bidirectional; master or slave mode
© 2011–2015 Freescale Semiconductor, Inc.
• Input/Output
– Up to 57 GPIOs including one output-only pin
– Two 8-bit keyboard interrupt modules (KBI)
– Two true open-drain output pins
– Eight, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 64-pin LQFP; 64-pin QFP
– 48-pin LQFP
– 44-pin LQFP
– 32-pin LQFP
MC9S08PA60 Series Data Sheet, Rev. 3, 06/2015
2
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts.......................................................................................4
1.1 Determining valid orderable parts............................................... 4
2 Part identification................................................................................. 4
2.1 Description...................................................................................4
2.2 Format.......................................................................................... 4
2.3 Fields............................................................................................4
2.4 Example....................................................................................... 5
3 Parameter Classification.......................................................................5
4 Ratings..................................................................................................6
4.1 Thermal handling ratings............................................................. 6
4.2 Moisture handling ratings............................................................ 6
4.3 ESD handling ratings................................................................... 6
4.4 Voltage and current operating ratings..........................................6
5 General................................................................................................. 7
5.1 Nonswitching electrical specifications........................................ 7
5.1.1
5.1.2
5.1.3
DC characteristics.......................................................... 7
Supply current characteristics........................................ 14
EMC performance..........................................................15
5.2.2
5.2.3
Debug trace timing specifications..................................17
FTM module timing....................................................... 18
5.3 Thermal specifications................................................................. 19
5.3.1
5.3.2
Thermal operating requirements.................................... 19
Thermal characteristics.................................................. 19
6 Peripheral operating requirements and behaviors................................ 20
6.1 External oscillator (XOSC) and ICS characteristics....................20
6.2 NVM specifications..................................................................... 22
6.3 Analog..........................................................................................23
6.3.1
6.3.2
ADC characteristics....................................................... 23
Analog comparator (ACMP) electricals.........................26
6.4 Communication interfaces........................................................... 26
6.4.1
SPI switching specifications.......................................... 26
7 Dimensions...........................................................................................29
7.1 Obtaining package dimensions.................................................... 29
8 Pinout................................................................................................... 30
8.1 Signal multiplexing and pin assignments.................................... 30
8.2 Device pin assignment................................................................. 32
9 Revision history....................................................................................36
5.2 Switching specifications.............................................................. 16
5.2.1
Control timing................................................................ 16
MC9S08PA60 Series Data Sheet, Rev. 3, 06/2015
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: PA60 and PA32.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
MC 9 S08 PA AA (V) B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
MC
9
S08
PA
AA
(V)
Qualification status
Memory
Core
Device family
Approximate flash size in KB
Mask set version
Description
• 9 = flash based
• S08 = 8-bit CPU
• PA
• 60 = 60 KB
• 32 = 32 KB
• (blank) = Any version
• A = Rev. 2 or later version, this is
recommended for new design
Table continues on the next page...
Values
• MC = fully qualified, general market flow
MC9S08PA60 Series Data Sheet, Rev. 3, 06/2015
4
Freescale Semiconductor, Inc.
Parameter Classification
Field
B
CC
Package designator
Description
Operating temperature range (°C)
• V = –40 to 105
QH = 64-pin QFP
LH = 64-pin LQFP
LF = 48-pin LQFP
LD = 44-pin LQFP
LC = 32-pin LQFP
Values
2.4 Example
This is an example part number:
MC9S08PA60VQH
3 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P
C
T
D
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
MC9S08PA60 Series Data Sheet, Rev. 3, 06/2015
Freescale Semiconductor, Inc.
5
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