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93AA86BTIPG

16K Microwire Compatible Serial EEPROM

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

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93AA86A/B/C, 93LC86A/B/C,
93C86A/B/C
16K Microwire Compatible Serial EEPROM
Device Selection Table
Part Number
93AA86A
93AA86B
93LC86A
93LC86B
93C86A
93C86B
93AA86C
93LC86C
93C86C
V
CC
Range
1.8-5.5
1.8-5-5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
ORG Pin
No
No
No
No
No
No
Yes
Yes
Yes
PE Pin
No
No
No
No
No
No
Yes
Yes
Yes
Word Size
8-bit
16-bit
8-bit
16-bit
8-bit
16-bit
8 or 16-bit
8 or 16-bit
8 or 16-bit
Temp Ranges
I
I
I, E
I, E
I, E
I, E
I
I, E
I, E
Packages
OT
OT
OT
OT
OT
OT
P, SN, ST, MS, MC
P, SN, ST, MS, MC
P, SN, ST, MS, MC
Features:
Low-power CMOS technology
ORG pin to select word size for ‘86C’ version
2048 x 8-bit organization ‘A’ devices (no ORG)
1024 x 16-bit organization ‘B’ devices (no ORG)
Program Enable pin to write-protect the entire
array (‘86C’ version only)
Self-timed erase/write cycles (including
auto-erase)
Automatic ERAL before WRAL
Power-on/off data protection circuitry
Industry standard 3-wire serial I/O
Device Status signal (Ready/Busy)
Sequential read function
1,000,000 E/W cycles
Data retention > 200 years
Temperature ranges supported:
- Industrial (I)
-40°C to +85°C
- Automotive (E) -40°C to +125°C
Description:
The Microchip Technology Inc. 93XX86A/B/C devices
are 16K bit low-voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX86C are dependent upon external logic
levels driving the ORG pin to set word size. In the
SOT-23 package, the 93XX86A devices provide
dedicated 8-bit memory organization, while the
93XX86B devices provide dedicated 16-bit memory
organization. A Program Enable (PE) pin allows the
user to write-protect the entire memory array.
Advanced CMOS technology makes these devices
ideal for low-power, nonvolatile memory applications.
The entire 93XX Series is available in standard
packages including 8-lead PDIP and SOIC, and
advanced packaging including 8-lead MSOP, 6-lead
SOT-23, 8-lead 2x3 DFN and 8-lead TSSOP. Pb-free
(Pure Matte Sn) finish is available.
Package Types (not to scale)
PDIP/SOIC
(P, SN)
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
V
CC
PE
ORG
V
SS
DO
V
SS
DI
SOT-23
(OT)
1
2
3
6
5
4
V
CC
CS
CLK
Pin Function Table
Name
CS
CLK
DI
DO
V
SS
PE
ORG
V
CC
Chip Select
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
Program Enable
Memory Configuration
Power Supply
Function
TSSOP/MSOP
(ST, MS)
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
V
CC
CS
CLK
PE
DI
ORG DO
V
SS
1
2
3
4
DFN
(MC)
8
7
6
5
V
CC
PE
ORG
V
SS
©
2005 Microchip Technology Inc.
DS21797G-page 1
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
V
CC
.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. V
SS
......................................................................................................... -0.6V to V
CC
+1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins
......................................................................................................................................................≥
4 kV
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C, V
CC
= +1.8V to 5.5V
Automotive (E): T
A
= -40°C to +125°C, V
CC
= +2.5V to 5.5V
Min
2.0
0.7 V
CC
-0.3
-0.3
2.4
V
CC
- 0.2
Typ
500
100
Max
V
CC
+1
V
CC
+1
0.8
0.2 V
CC
0.4
0.2
±1
±1
7
3
1
500
1
5
Units
V
V
V
V
V
V
V
V
μA
μA
pF
mA
μA
mA
μA
μA
μA
μA
Conditions
V
CC
2.7V
V
CC
< 2.7V
V
CC
2.7V
V
CC
< 2.7V
I
OL
= 2.1 mA, V
CC
= 4.5V
I
OL
= 100
μA,
V
CC
= 2.5V
I
OH
= -400
μA,
V
CC
= 4.5V
I
OH
= -100
μA,
V
CC
= 2.5V
V
IN
= V
SS
or V
CC
V
OUT
= V
SS
or V
CC
V
IN
/V
OUT
= 0V
(Note 1)
T
A
= 25°C, F
CLK
= 1 MHz
F
CLK
= 3 MHz, V
CC
= 5.5V
F
CLK
= 2 MHz, V
CC
= 2.5V
F
CLK
= 3 MHz, V
CC
= 5.5V
F
CLK
= 2 MHz, V
CC
= 3.0V
F
CLK
= 2 MHz, V
CC
= 2.5V
I – Temp
E – Temp
CLK = CS = 0V
ORG = DI
PE = V
SS
or V
CC
(Note 2) (Note 3)
(Note 1)
93AA86A/B/C, 93LC86A/B/C
93C86A/B/C
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
D1
D2
D3
D4
D5
D6
D7
D8
D9
V
IH
1
V
IH
2
V
IL
1
V
IL
2
V
OL
1
V
OL
2
V
OH
1
V
OH
2
I
LI
I
LO
C
IN
,
C
OUT
Parameter
High-level input voltage
Low-level input voltage
Low-level output voltage
High-level output voltage
Input leakage current
Output leakage current
Pin capacitance (all inputs/
outputs)
I
CC
write Write current
I
CC
read Read current
D10
I
CCS
Standby current
D11
V
POR
V
CC
voltage detect
1.5
3.8
V
V
Note 1:
2:
3:
This parameter is periodically sampled and not 100% tested.
ORG and PE pin not available on ‘A’ or ‘B’ versions.
Ready/Busy status must be cleared from DO, see
Section 3.4 “Data Out (DO)”.
DS21797G-page 2
©
2005 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C, V
CC
= +1.8V to 5.5V
Automotive (E): T
A
= -40°C to +125°C, V
CC
= +2.5V to 5.5V
Min
Max
3
2
1
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
ms
ms
Conditions
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
1.8V
V
CC
< 5.5V
1.8V
V
CC
< 5.5V
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V, CL = 100 pF
2.5V
V
CC
< 4.5V, CL = 100 pF
1.8V
V
CC
< 2.5V, CL = 100 pF
4.5V
V
CC
< 5.5V,
(Note 1)
1.8V
V
CC
< 4.5V,
(Note 1)
4.5V
V
CC
< 5.5V, CL = 100 pF
2.5V
V
CC
< 4.5V, CL = 100 pF
1.8V
V
CC
< 2.5V, CL = 100 pF
Erase/Write mode (AA and LC
versions)
Erase/Write mode
(93C versions)
ERAL mode, 4.5V
V
CC
5.5V
WRAL mode, 4.5V
V
CC
5.5V
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
A1
F
CLK
Parameter
Clock frequency
A2
T
CKH
Clock high time
200
250
450
100
200
450
50
100
250
0
250
50
100
250
50
100
250
A3
T
CKL
Clock low time
A4
T
CSS
Chip Select setup time
A5
A6
A7
T
CSH
T
CSL
T
DIS
Chip Select hold time
Chip Select low time
Data input setup time
A8
T
DIH
Data input hold time
A9
T
PD
Data output delay time
100
250
400
100
200
200
300
500
5
2
6
15
A10
A11
T
CZ
T
SV
Data output disable time
Status valid time
A12
A13
A14
A15
A16
Note 1:
2:
T
WC
T
WC
T
EC
T
WL
Program cycle time
Endurance
1M
cycles 25°C, V
CC
= 5.0V,
(Note 2)
This parameter is periodically sampled and not 100% tested.
This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which may be obtained from Microchip’s web site
at www.microchip.com.
©
2005 Microchip Technology Inc.
DS21797G-page 3
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
FIGURE 1-1:
CS
V
IH
V
IL
V
IH
CLK
V
IL
T
DIS
V
IH
DI
V
IL
T
PD
DO
(Read)
DO
(Program)
V
OH
V
OL
V
OH
Status Valid
V
OL
T
SV
is relative to CS.
T
CZ
T
SV
T
PD
T
CZ
T
DIH
T
CSS
T
CKH
T
CKL
T
CSH
SYNCHRONOUS DATA TIMING
Note:
TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX86B OR 93XX86C WITH ORG =
1)
Instruction
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
SB
1
1
1
1
1
1
1
Opcode
10
00
11
00
01
00
00
Address
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
1
X
X
X
X
X
X
X
X
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
0
X
X
X
X
X
X
X
X
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Data In
D15-D0
D15-D0
Data Out
D15-D0
HighZ
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
Req. CLK
Cycles
29
13
13
13
29
29
13
TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX86A OR 93XX86C WITH ORG =
0)
Instruction
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
SB
1
1
1
1
1
1
1
Opcode
10
00
11
00
01
00
00
Address
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
1
X
X
X
X
X
X
X
X
X
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
0
X
X
X
X
X
X
X
X
X
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Data In
D7-D0
D7-D0
Data Out
D7-D0
High-Z
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
Req. CLK
Cycles
22
14
14
14
22
22
14
DS21797G-page 4
©
2005 Microchip Technology Inc.
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
2.0
FUNCTIONAL DESCRIPTION
2.2
Data In/Data Out (DI/DO)
When the ORG pin (93XX86C) is connected to V
CC
,
the (x16) organization is selected. When it is connected
to ground, the (x8) organization is selected. Instruc-
tions, addresses and write data are clocked into the DI
pin on the rising edge of the clock (CLK). The DO pin is
normally held in a High-Z state except when reading
data from the device, or when checking the Ready/
Busy status during a programming operation. The
Ready/Busy status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the High-Z
state on the falling edge of CS.
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation, if A0 is a logic high
level. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of the
driver, the higher the voltage at the Data Out pin. In
order to limit this current, a resistor should be
connected between DI and DO.
2.3
Data Protection
2.1
Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (Read, Write, Erase, EWEN, EWDS, ERAL
or WRAL). As soon as CS is high, the device is no
longer in Standby mode.
An instruction following a Start condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
Note:
When preparing to transmit an instruction,
either the CLK or DI signal levels must be
at a logic low as CS is toggled active high.
All modes of operation are inhibited when V
CC
is below
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices
or 3.8V for ‘93C’ devices.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note:
For added protection, an EWDS
command should be performed after
every write operation and an external 10
kΩ pull-down protection resistor should be
added to the CS pin.
After power-up the device is automatically in the EWDS
mode. Therefore, an
EWEN
instruction must be
performed before the initial
ERASE
or
WRITE
instruction
can be executed.
Note:
To prevent accidental writes to the array in
the 93XX86C devices, set the PE pin to a
logic low.
©
2005 Microchip Technology Inc.
DS21797G-page 5
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