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93C56CT-E/MSG

128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8

器件类别:存储    存储   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
零件包装代码
MSOP
包装说明
TSSOP, TSSOP8,.19
针数
8
Reach Compliance Code
compliant
ECCN代码
EAR99
备用内存宽度
8
最大时钟频率 (fCLK)
3 MHz
数据保留时间-最小值
200
耐久性
1000000 Write/Erase Cycles
JESD-30 代码
S-PDSO-G8
JESD-609代码
e3
长度
3 mm
内存密度
2048 bit
内存集成电路类型
EEPROM
内存宽度
16
湿度敏感等级
1
功能数量
1
端子数量
8
字数
128 words
字数代码
128
工作模式
SYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-40 °C
组织
128X16
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP8,.19
封装形状
SQUARE
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行
SERIAL
峰值回流温度(摄氏度)
260
电源
5 V
认证状态
Not Qualified
座面最大高度
1.1 mm
串行总线类型
MICROWIRE
最大待机电流
0.000005 A
最大压摆率
0.002 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
3 mm
最长写入周期时间 (tWC)
2 ms
写保护
SOFTWARE
文档预览
93AA56A/B/C, 93LC56A/B/C,
93C56A/B/C
2K Microwire
®
-Compatible Serial EEPROM
Device Selection Table
Part Number
93AA56A
93AA56B
93LC56A
93LC56B
93C56A
93C56B
93AA56C
93LC56C
93C56C
V
CC
Range
1.8-5.5
1.8-5-5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
ORG Pin
No
No
No
No
No
No
Yes
Yes
Yes
Word Size
8-bit
16-bit
8-bit
16-bit
8-bit
16-bit
8 or 16-bit
8 or 16-bit
8 or 16-bit
Temp Ranges
I
I
I, E
I, E
I, E
I, E
I
I, E
I, E
Packages
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS, OT
P, SN, ST, MS
P, SN, ST, MS
P, SN, ST, MS
Features
Low power CMOS technology
ORG pin to select word size for ‘56C version
256 x 8-bit organization ‘A’ ver. devices (no ORG)
128 x 16-bit organization ‘B’ ver. devices (no
ORG)
Self-timed ERASE/WRITE cycles (including
auto-erase)
Automatic ERAL before WRAL
Power on/off data protection circuitry
Industry standard 3-wire serial I/O
Device status signal (READY/BUSY)
Sequential READ function
1,000,000 E/W cycles
Data retention > 200 years
Temperature ranges supported:
- Industrial (I)
- Automotive (E)
-40°C to +85°C
-40°C to +125°C
Description
The Microchip Technology Inc. 93XX56A/B/C devices
are 2K bit low voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93AA56C, 93LC56C or 93C56C are dependent
upon external logic levels driving the ORG pin to set
word size. For dedicated 8-bit communication, the
93AA56A, 93LC56A or 93C56A devices are available,
while the 93AA56B, 93LC56B and 93C56B devices
provide dedicated 16-bit communication. Advanced
CMOS technology makes these devices ideal for low
power, non-volatile memory applications. The entire
93XX Series is available in standard packages includ-
ing 8-lead PDIP and SOIC, and advanced packaging
including 8-lead MSOP, 6-lead SOT-23, and 8-lead
TSSOP. Pb-free (Pure Matte Sn) finish is also
available.
Package Types (not to scale)
ROTATED SOIC
(ex: 93LC56BX)
NC
V
CC
1
2
3
4
8
7
6
5
ORG*
V
SS
DO
DI
CS
CLK
DI
DO
PDIP/SOIC
(P, SN)
1
2
3
4
8
7
6
5
V
CC
NC
ORG*
V
SS
Pin Function Table
Name
CS
CLK
DI
DO
V
SS
NC
ORG
V
CC
Function
Chip Select
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
No internal connection
Memory Configuration
Power Supply
CS
CLK
TSSOP/MSOP
(ST, MS)
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
V
CC
NC
ORG*
V
SS
DO
V
SS
DI
SOT-23
(OT)
1
2
3
6
5
4
V
CC
CS
CLK
* ORG pin is NC on A/B devices
Microwire is a registered trademark of National Semiconductor.
2003 Microchip Technology Inc.
DS21794A-page 1
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
V
CC
.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. V
SS
......................................................................................................... -0.6V to V
CC
+1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins
......................................................................................................................................................≥
4 kV
NOTICE:
Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
D1
D2
D3
D4
D5
D6
D7
D8
D9
V
IH
1
V
IH
2
V
IL
1
V
IL
2
Vol1
Vol2
V
OH
1
V
OH
2
I
LI
I
LO
C
IN
,
C
OUT
Parameter
High level input voltage
Low level input voltage
Low level output voltage
High level output voltage
Input leakage current
Output leakage current
Pin capacitance (all inputs/
outputs)
V
CC
= range by device (see Table on Page 1)
Industrial (I):
T
AMB
= -40°C to +85°C
Automotive (E): T
AMB
= -40°C to +125°C
Min
2.0
0.7 V
CC
-0.3
-0.3
2.4
V
CC
- 0.2
Typ
500
100
Max
V
CC
+1
V
CC
+1
0.8
0.2 V
CC
0.4
0.2
±10
±10
7
2
1
500
1
5
Units
V
V
V
V
V
V
V
V
µA
µA
pF
mA
µA
mA
µA
µA
µA
µA
Conditions
V
CC
2.7V
V
CC
< 2.7V
V
CC
2.7V
V
CC
< 2.7V
I
OL
= 2.1 mA, V
CC
= 4.5V
I
OL
= 100
µA,
V
CC
= 2.5V
I
OH
= -400
µA,
V
CC
= 4.5V
I
OH
= -100
µA,
V
CC
= 2.5V
V
IN
= V
SS
to V
CC
V
OUT
= V
SS
to V
CC
V
IN
/V
OUT
= 0V
(Note 1)
T
AMB
= 25°C, F
CLK
= 1 MHz
F
CLK
= 3 MHz, Vcc = 5.5V
F
CLK
= 2 MHz, Vcc = 2.5V
F
CLK
= 3 MHz, V
CC
= 5.5V
F
CLK
= 2 MHz, V
CC
= 3.0V
F
CLK
= 2 MHz, V
CC
= 2.5V
I – Temp
E – Temp
CLK = Cs = 0V
ORG = DI = V
SS
or V
CC
(Note 2) (Note 3)
(Note 1)
I
CC
write Write current
I
CC
read Read current
D10
I
CCS
Standby current
D11
V
POR
V
CC
voltage detect
93AA56A/B/C, 93LC56A/B/C
93C56A/B/C
1.5V
3.8V
V
V
Note 1:
2:
3:
This parameter is periodically sampled and not 100% tested.
ORG pin not available on ‘A’ or ‘B’ versions.
READY/BUSY status must be cleared from DO, see Section 3.4.
DS21794A-page 2
2003 Microchip Technology Inc.
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
AC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Param.
Symbol
No.
A1
F
CLK
Parameter
Clock frequency
V
CC
= range by device (see Table on Page 1)
Industrial (I):
T
AMB
= -40°C to +85°C
Automotive (E): T
AMB
= -40°C to +125°C
Min
Max
3
2
1
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
ms
ms
Conditions
4.5V
V
CC
< 5.5V, 93XX56C only
2.5V
V
CC
< 5.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V, 93XX56C only
2.5V
V
CC
< 5.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V, 93XX56C only
2.5V
V
CC
< 5.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V
2.5V
V
CC
< 4.5V
1.8V
V
CC
< 2.5V
1.8V
V
CC
< 5.5V
1.8V
V
CC
< 5.5V
4.5V
V
CC
< 5.5V, 93XX56C only
2.5V
V
CC
< 5.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V, 93XX56C only
2.5V
V
CC
< 5.5V
1.8V
V
CC
< 2.5V
4.5V
V
CC
< 5.5V, CL = 100 pF
2.5V
V
CC
< 4.5V, CL = 100 pF
1.8V
V
CC
< 2.5V, CL = 100 pF
4.5V
V
CC
< 5.5V,
(Note 1)
1.8V
V
CC
< 4.5V,
(Note 1)
4.5V
V
CC
< 5.5V, CL = 100 pF
2.5V
V
CC
< 4.5V, CL = 100 pF
1.8V
V
CC
< 2.5V, CL = 100 pF
ERASE/WRITE mode (AA and LC
versions)
ERASE/WRITE mode
(93C versions)
ERAL mode, 4.5V
V
CC
5.5V
WRAL mode, 4.5V
V
CC
5.5V
A2
T
CKH
Clock high time
200
250
450
100
200
450
50
100
250
0
250
50
100
250
50
100
250
A3
T
CKL
Clock low time
A4
T
CSS
Chip select setup time
A5
A6
A7
T
CSH
T
CSL
T
DIS
Chip select hold time
Chip select low time
Data input setup time
A8
T
DIH
Data input hold time
A9
T
PD
Data output delay time
200
250
400
100
200
200
300
500
6
2
6
15
A10
A11
T
CZ
T
SV
Data output disable time
Status valid time
A12
A13
A14
A15
A16
Note 1:
2:
T
WC
T
WC
T
EC
T
WL
Program cycle time
Endurance
1M
cycles 25°C, V
CC
= 5.0V,
(Note 2)
This parameter is periodically sampled and not 100% tested.
This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance Model which may be obtained on www.microchip.com.
2003 Microchip Technology Inc.
DS21794A-page 3
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
FIGURE 1-1:
CS
V
IH
V
IL
V
IH
CLK
V
IL
T
DIS
V
IH
DI
V
IL
DO
(READ)
V
OH
V
OL
T
SV
STATUS VALID
T
PD
T
PD
T
CZ
T
DIH
T
CSS
T
CKH
T
CKL
T
CSH
SYNCHRONOUS DATA TIMING
T
CZ
DO V
OH
(PROGRAM)
V
OL
Note:
T
SV
is relative to CS.
TABLE 1-1: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX56B OR 93XX56C WITH ORG = 1)
Instruction
ERASE
ERAL
EWDS
EWEN
READ
WRITE
WRAL
SB
1
1
1
1
1
1
1
Opcode
11
00
00
00
10
01
00
X
1
0
1
X
X
0
Address
A6 A5 A4 A3 A2 A1 A0
0
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Data In
D15 – D0
D15 – D0
Data Out
(RDY/BSY)
(RDY/BSY)
HIGH-Z
HIGH-Z
D15 – D0
(RDY/BSY)
(RDY/BSY)
Req. CLK Cycles
11
11
11
11
27
27
27
A6 A5 A4 A3 A2 A1 A0
A6 A5 A4 A3 A2 A1 A0
1
X
X
X
X
X
X
TABLE 1-2: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX56A OR 93XX56C WITH ORG = 0)
Instruction
ERASE
ERAL
EWDS
EWEN
READ
WRITE
WRAL
SB
1
1
1
1
1
1
1
Opcode
11
00
00
00
10
01
00
Address
X A7 A6 A5 A4 A3 A2 A1 A0
1
0
1
0
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Data In
D7 – D0
D7 – D0
Data Out
(RDY/BSY)
(RDY/BSY)
HIGH-Z
HIGH-Z
D7 – D0
(RDY/BSY)
(RDY/BSY)
Req. CLK
Cycles
12
12
12
12
20
20
20
X A7 A6 A5 A4 A3 A2 A1 A0
X A7 A6 A5 A4 A3 A2 A1 A0
0
1
X
X
X
X
X
X
X
DS21794A-page 4
2003 Microchip Technology Inc.
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
2.0
FUNCTIONAL DESCRIPTION
2.2
Data In/Data Out (DI/DO)
When the ORG* pin is connected to V
CC
, the (x16)
organization is selected. When it is connected to
ground, the (x8) organization is selected. Instructions,
addresses and write data are clocked into the DI pin on
the rising edge of the clock (CLK). The DO pin is
normally held in a HIGH-Z state except when reading
data from the device, or when checking the READY/
BUSY status during a programming operation. The
READY/BUSY status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the HIGH-Z
state on the falling edge of CS.
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the READ operation, if A0 is a logic
HIGH level. Under such a condition the voltage level
seen at Data Out is undefined and will depend upon the
relative impedances of Data Out and the signal source
driving A0. The higher the current sourcing capability of
A0, the higher the voltage at the Data Out pin. In order
to limit this current, a resistor should be connected
between DI and DO.
2.3
Data Protection
2.1
START Condition
The START bit is detected by the device if CS and DI
are both HIGH with respect to the positive edge of CLK
for the first time.
Before a START condition is detected, CS, CLK, and DI
may change in any combination (except to that of a
START condition), without resulting in any device
operation (READ, WRITE, ERASE, EWEN, EWDS,
ERAL, or WRAL). As soon as CS is HIGH, the device
is no longer in Standby mode.
An instruction following a START condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
All modes of operation are inhibited when V
CC
is below
a typical voltage of 1.5V for '93AA' and '93LC' devices
or 3.8V for '93C' devices.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note:
For added protection, an EWDS command
should be performed after every write
operation.
After power-up, the device is automatically in the
EWDS mode. Therefore, an
EWEN
instruction must be
performed before the initial
ERASE
or
WRITE
instruction
can be executed.
Block Diagram
V
CC
V
SS
Address
Decoder
Memory
Array
Address
Counter
Data Register
DI
ORG*
CS
CLK
Mode
Decode
Logic
Clock
Register
Output
Buffer
DO
*ORG input is not available on A/B devices
2003 Microchip Technology Inc.
DS21794A-page 5
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00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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