compliant gap filling interface pad with a thermal
conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron
nitride filler in the composition.
The high conductivity, in combination with extreme softness produces incredibly low thermal
resistances.
Tflex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal
performance. Tflex™ 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94
V0 rating.
FEATURES AND BENEFITS
• Very high compliancy for low stress
applications
• 3 W/mK thermal conductivity
• Available in thicknesses from 0.020” - 0.200”
(0.5mm - 5.0mm)
• Naturally tacky, needs no further
adhesive coating
APPLICATIONS
•
•
•
•
•
•
Cooling components to the chassis or frame
High speed mass storage drives
RDRAM memory modules
Heat pipe thermal solutions
Automotive engine control units
Telecommunications hardware
Americas: +1.800.843.4556
Europe: +49.8031.24600
Asia: +86.755.2714.116
CLV-customerservice@lairdtech.com
Tflex
™
600 Series
Thermal Gap Filler
TEST METHOD
Tflex™ 600
Construction & Composition
Color
Thickness Range
Thickness Tolerance
Density (g/cc)
Hardness (Shore 00)
Tensile Strength
% Elongation
Outgassing Conditions
Outgassing TML (weight %)
Outgassing CVCM (weight %)
UL Flammability Rating
Temperature Range
Thermal Conductivity
Thermal Impedance
@ 40 mils, 10 psi
@ 1 mm, 69kPa
Thermal Expansion
Volume Resistivity
Dielectric Constant @ 1MHz
Boron nitride filled
silicone elastomer
Blue-Violet
0.020” (0.50mm) - 0.200” (5.08mm)
± 10%
1.34
51; 3 seconds
48; 30 seconds
15 psi
75
Post cured
0.13%
0.05%
94 V0
-45°C to 200°C
3.0 W/mK
0.62°C–in
2
/W
4.00°C–cm
2
/W
430 ppm/°C
2 x 10
13
ohm-cm
331%
Visual
Helium Pycnometer
ASTM D2240
ASTM D412
ASTM D412
ASTM E595
ASTM E595
UL FILE E180840
Hot Disk
ASTM D5470
(modified)
IPC-TM-650
2.4.24
ASTM D257
ASTM D150
STANDARD THICKNESSES
0.020 to 0.200-inch (0.5 to 5.0mm)
0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments
Inquire about availability of material and options above 0.200-inches
STANDARD SHEET SIZES
9 x 9” (229 x 229mm). 18 x 18” (457 x 457mm). 9 x 9” only over 0.100” thickness. Tflex
TM
600
can be die cut to individual shapes. Pressure sensitive adhesive is not applicable for Tflex
TM
600
products.
TACKY ONE SIDE ONLY
Tflex™ 600 is naturally tacky on both sides. Tflex™ 600 can be provided tacky on one side only.
This is indicated by the suffix “DC1”. This option offers good separation properties allowing the
tacky side to stick to the heatsink/chasis/cold plate/etc. and the other “dry” side to release easily
from the component(s).
REINFORCEMENT
Fiberglass is required in 0.020” (0.51mm) and 0.030” (0.76mm). Thicknesses of 0.040” (1.02mm)
and above do not require reinforcement. Data for design engineer guidance only. Observed
performance varies in application. Engineers are reminded to test the material in applicatio
n.
THR-DS-TFLEX-600_07_2_14
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies
materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential
damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be
registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a
license under any Laird Technologies or any third party intellectual property rights. A13512-00 Rev. K EO #9655, 06/2014.
Microchip MCU
