A29L008 Series
1M X 8 Bit CMOS 3.0 Volt-only,
Preliminary
Features
n
Single power supply operation
- Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
n
Access times:
-
70/90 (max.)
n
Current:
- 9 mA typical active read current
- 20 mA typical program/erase current
-
200 nA typical CMOS standby
-
200 nA Automatic Sleep Mode current
n
Flexible sector architecture
-
16 Kbyte/ 8 KbyteX2/ 32 Kbyte/ 64 KbyteX15 sectors
-
Any combination of sectors can be erased
-
Supports full chip erase
-
Sector protection:
A hardware method of protecting sectors to prevent
any inadvertent program or erase operations within
that sector. Temporary Sector Unprotect feature
allows code changes in previously locked sectors
n
Extended operating temperature range: -40°C ~ +85°C
for -U series
n
Unlock Bypass Program Command
- Reduces overall programming time when issuing
multiple program command sequence
n
Top or bottom boot block configurations available
n
Embedded Algorithms
- Embedded Erase algorithm will automatically erase
the entire chip or any combination of designated
sectors and verify the erased sectors
- Embedded Program algorithm automatically writes
and verifies data at specified addresses
n
Typical 100,000 program/erase cycles per sector
n
20-year data retention at 125°C
-
Reliable operation for the life of the system
n
Compatible with JEDEC-standards
- Pinout and software compatible with single-power-
supply Flash memory standard
-
Superior inadvertent write protection
n
Data
Polling and toggle bits
-
Provides a software method of detecting completion
of program or erase operations
n
Ready /
BUSY
pin (RY /
BY
)
- Provides a hardware method of detecting completion
of program or erase operations
n
Erase Suspend/Erase Resume
-
Suspends a sector erase operation to read data from,
or program data to, a non-erasing sector, then
resumes the erase operation
n
Hardware reset pin (
RESET
)
-
Hardware method to reset the device to reading array
data
n
Package options
-
40-pin TSOP (I)
Boot Sector Flash Memory
PRELIMINARY
(November, 2002, Version 0.0)
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AMIC Technology, Corp.
A29L008 Series
General Description
The A29L008 is an 8Mbit, 3.0 volt-only Flash memory
organized as 1,048,576 bytes. The data appear on I/O
0
- I/O
7
.
The A29L008 is offered in 40-pin TSOP package. This device
is designed to be programmed in-system with the standard
system 3.0 volt VCC supply. Additional 12.0 volt VPP is not
required for in-system write or erase operations. However,
the A29L008 can also be programmed in standard EPROM
programmers.
The A29L008 has the first toggle bit, I/O
6
, which indicates
whether an Embedded Program or Erase is in progress, or it
is in the Erase Suspend. Besides the I/O
6
toggle bit, the
A29L008 has a second toggle bit, I/O
2
, to indicate whether
the addressed sector is being selected for erase. The
A29L008 also offers the ability to program in the Erase
Suspend mode. The standard A29L008 offers access times
of 70 and 90ns, allowing high-speed microprocessors to
operate without wait states. To eliminate bus contention the
device has separate chip enable (
CE
), write enable (
WE
)
and output enable (
OE
) controls.
The device requires only a single 3.0 volt power supply for
both read and write functions. Internally generated and
regulated voltages are provided for the program and erase
operations.
The A29L008 is entirely software command set compatible
with the JEDEC single-power-supply Flash standard.
Commands are written to the command register using
standard microprocessor write timings. Register contents
serve as input to an internal state-machine that controls the
erase and programming circuitry. Write cycles also internally
latch addresses and data needed for the programming and
erase operations. Reading data out of the device is similar to
reading from other Flash or EPROM devices.
Device programming occurs by writing the proper program
command sequence. This initiates the Embedded Program
algorithm - an internal algorithm that automatically times the
program pulse widths and verifies proper program margin.
Device erasure occurs by executing the proper erase
command sequence. This initiates the Embedded Erase
algorithm - an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper erase margin. The Unlock Bypass mode
facilitates faster programming times by requiring only two
write cycles to program data instead of four.
The host system can detect whether a program or erase
operation is complete by observing the RY /
BY
pin, or by
reading the I/O
7
(
Data
Polling) and I/O
6
(toggle) status bits.
After a program or erase cycle has been completed, the
device is ready to read array data or accept another
command.
The sector erase architecture allows memory sectors to be
erased and reprogrammed without affecting the data
contents of other sectors. The A29L008 is fully erased when
shipped from the factory.
The hardware sector protection feature disables operations
for both program and erase in any combination of the
sectors of memory. This can be achieved via programming
equipment.
The Erase Suspend/Erase Resume feature enables the user
to put erase on hold for any period of time to read data from,
or program data to, any other sector that is not selected for
erasure. True background erase can thus be achieved.
The hardware
RESET
pin terminates any operation in
progress and resets the internal state machine to reading
array data. The
RESET
pin may be tied to the system reset
circuitry. A system reset would thus also reset the device,
enabling the system microprocessor to read the boot-up
firmware from the Flash memory.
The device offers two power-saving features. When
addresses have been stable for a specified amount of time,
the device enters the automatic sleep mode. The system can
also place the device into the standby mode. Power
consumption is greatly reduced in both these modes.
PRELIMINARY
(November, 2002, Version 0.0)
2
AMIC Technology, Corp.
A29L008 Series
Pin Configurations
n
TSOP (I)
A16
A15
A14
A13
A12
A11
A9
A8
WE
RESET
NC
RY/BY
A18
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
A17
VSS
NC
A19
A10
I/O
7
I/O
6
I/O
5
I/O
4
VCC
VCC
NC
I/O
3
I/O
2
I/O
1
I/O
0
OE
VSS
CE
A0
Standard TSOP
31
30
29
28
27
26
25
24
23
22
21
PRELIMINARY
(November, 2002, Version 0.0)
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AMIC Technology, Corp.
A29L008 Series
Block Diagram
RY/BY
VCC
VSS
I/O
0
- I/O
7
Sector Switches
Erase Voltage
Generator
State
Control
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
STB
Data Latch
Input/Output
Buffers
RESET
WE
BYTE
Command
Register
CE
OE
STB
VCC Detector
Timer
Address Latch
Y-Decoder
Y-Gating
A0-A19
X-decoder
Cell Matrix
Pin Descriptions
Pin No.
A0 - A19
I/O
0
- I/O
7
Description
Address Inputs
Data Inputs/Outputs
Chip Enable
Write Enable
Output Enable
Hardware Reset
Selects Byte Mode or Word Mode
Ready/
BUSY
- Output
Ground
Power Supply
Pin not connected internally
CE
WE
OE
RESET
BYTE
RY/
BY
VSS
VCC
NC
PRELIMINARY
(November, 2002, Version 0.0)
4
AMIC Technology, Corp.
A29L008 Series
Absolute Maximum Ratings*
Storage Temperature Plastic Packages . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0°C to + 70°C
. . . . . . . . . . . . . . . . . . . . . . for -U series: -40°C to +85°C
Ambient Temperature with Power Applied . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to + 70°C
. . . . . . . . . . . . . . . . . . . . . . for -U series: -40°C to +85°C
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +4.0V
A9,
OE
&
RESET
(Note 2) . . . . . . . . . . . . -0.5 to +12.5V
All other pins (Note 1) . . . . . . . . . . . . -0.5V to VCC + 0.5V
Output Short Circuit Current (Note 3) . . . . . . . . . 200mA
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above
those indicated in the operational sections of these
specification is not implied or intended. Exposure to
the absolute maximum rating conditions for extended
periods may affect device reliability.
Operating Ranges
Commercial (C) Devices
Ambient Temperature (T
A
) . . . . . . . . . . . . . . 0°C to +70°C
Extended Range Devices
Ambient Temperature (T
A
) . . . . . . . . . . . . -40°C to +85°C
VCC Supply Voltages
VCC for all devices . . . . . . . . . . . . . . . . . . +2.7V to +3.6V
Operating ranges define those limits between which the
functionally of the device is guaranteed.
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5V. During
voltage transitions, input or I/O pins may undershoot
VSS to -2.0V for periods of up to 20ns. Maximum DC
voltage on input and I/O pins is VCC +0.5V. During
voltage transitions, input or I/O pins may overshoot to
VCC +2.0V for periods up to 20ns.
2. Minimum DC input voltage on A9,
OE
and
RESET
is
-0.5V. During voltage transitions, A9,
OE
and
RESET
may overshoot VSS to -2.0V for periods of up to 20ns.
Maximum DC input voltage on A9 is +12.5V which may
overshoot to 14.0V for periods up to 20ns.
3. No more than one output is shorted at a time. Duration
of the short circuit should not be greater than one
second.
Device Bus Operations
This section describes the requirements and use of the
device bus operations, which are initiated through the
internal command register. The command register itself
does not occupy any addressable memory location. The
register is composed of latches that store the commands,
along with the address and data information needed to
execute the command. The contents of the register serve
as inputs to the internal state machine. The state machine
outputs dictate the function of the device. The appropriate
device bus operations table lists the inputs and control
levels required, and the resulting output. The following
subsections describe each of these operations in further
detail.
Table 1. A29L008 Device Bus Operations
Operation
CE
OE
WE
RESET
Read
L
L
H
H
D
OUT
Write
L
H
L
H
D
IN
CMOS Standby
X
X
High-Z
VCC
±
0.3 V
VCC
±
0.3 V
Output Disable
L
H
H
H
High-Z
Hardware Reset
X
X
X
L
High-Z
Sector Protect
L
H
L
V
ID
D
IN
, D
OUT
(See Note 2)
Sector Unprotect
L
H
L
V
ID
D
IN
, D
OUT
(See Note 2)
Temporary Sector
X
X
X
V
ID
A
IN
D
IN
Unprotect
Legend:
L = Logic Low = V
IL
, H = Logic High = V
IH
, V
ID
= 12.0
±
0.5V, X = Don't Care, D
IN
= Data In, D
OUT
= Data Out, A
IN
= Address In
Notes:
1. Addresses are A19-A0 in word mode (
BYTE=V
IH
), A18: A
-1
in byte mode (
BYTE=V
IL
).
2. See the “Sector Protection/Unprotection” section and Temporary Sector Unprotect for more information.
A0 – A19
(Note 1)
A
IN
A
IN
X
X
X
Sector Address,
A6=L, A1=H, A0=L
Sector Address,
A6=H, A1=H, A0=L
I/O
0
- I/O
7
PRELIMINARY
(November, 2002, Version 0.0)
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AMIC Technology, Corp.
