v4.0
SX-A Family FPGAs
Le a di n g- E d ge P er f o r m a n ce
u e
• 250 MHz System Performance
• 350 MHz Internal Performance
• 3.8 ns Clock-to-Out (Pad-to-Pad)
S p e ci f i c a t i on s
•
•
•
•
12,000 to 108,000 Available System Gates
Up to 360 User-Programmable I/O Pins
Up to 2,012 Dedicated Flip-Flops
0.22
µ
/0.25
µ
CMOS Process Technology
• Configurable I/O Support for 3.3V/5V PCI, 5V TTL,
3.3V LVTTL, 2.5V LVCMOS2
• 2.5V, 3.3V, and 5V Mixed-Voltage Operation with 5V Input
Tolerance and 5V Drive Strength
• Devices Support Multiple Temperature Grades
• Configurable Weak-Resistor Pull-up or Pull-down for
Outputs at Power-up
• Individual Output Slew Rate Control
• Up to 100% Resource Utilization and 100% Pin Locking
• Deterministic, User-Controllable Timing
• Unique In-System Diagnostic and Verification Capability
with Silicon Explorer II
• Boundary Scan Testing in Compliance with IEEE
Standard 1149.1 (JTAG)
• Actel’s Secure Programming Technology with FuseLock™
Prevents Reverse Engineering and Design Theft
Fe a t ur es
• Hot-Swap Compliant I/Os
• Power-up/down Friendly (No Sequencing Required for
Supply Voltages)
• 66 MHz PCI Compliant
• Single-Chip Solution
• Nonvolatile
SX - A P r od u ct P r o f i l e
Device
A54SX08A
A54SX16A
A54SX32A
A54SX72A
Capacity
Typical Gates
8,000
16,000
32,000
72,000
System Gates
12,000
24,000
48,000
108,000
Logic Modules
768
1,452
2,880
6,036
Combinatorial Cells
512
924
1,800
4,024
Register Cells
Dedicated Flip-Flops
256
528
1,080
2,012
Maximum Flip-Flops
512
990
1,980
4,024
Maximum User I/Os
130
180
249
360
3
3
3
3
Global Clocks
Quadrant Clocks
0
0
0
4
Boundary Scan Testing
Yes
Yes
Yes
Yes
3.3V/5V PCI
Yes
Yes
Yes
Yes
Clock-to-Out
4.2 ns
4.6 ns
4.7 ns
5.8 ns
Input Set-Up (External)
0 ns
0 ns
0 ns
0 ns
Speed Grades
–F, Std, –1, –2, –3 –F, Std, –1, –2, –3 –F, Std, –1, –2, –3 –F, Std, –1, –2, –3
Temperature Grades
C, I, A
C, I, M, A
C, I, M, A
C, I, M, A
Package
(by pin count)
208
208
208
PQFP
208
100, 144
100, 144, 176
—
TQFP
100, 144
—
329
—
PBGA
—
256, 484
144, 256
144, 256, 484
FBGA
144
208, 256
208, 256
CQFP*
Note:
For more information about the CQFP package options, refer to the
HiRel SX-A
datasheet at:
www.actel.com/documents/HRSXADS.pdf
A p r i l 20 0 3
1
© 2001 Actel Corporation
S X -A F a m il y F P GA s
O r d e r i n g I nf o r m a t i o n
A54SX16
A
2
PQ
208
Application (Temperature Range)
Blank = Commercial (0 to +70°C)
I
= Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
A = Automotive (–40 to +125°C)
Package Lead Count
Package Type
BG = 1.27mm Plastic Ball Grid Array
FG = 1.0mm Fine Pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4mm) Quad Flat Pack
CQ = Ceramic Quad Flat Pack*
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
–F = Approximately 40% Slower than Standard
A = 0.22µ/0.25µ CMOS Technology
Part Number
A54SX08A
A54SX16A
A54SX32A
A54SX72A
=
=
=
=
12,000 System Gates
24,000 System Gates
48,000 System Gates
108,000 System Gates
*For more information about the CQFP package options, refer to the
HiRel SX-A
datasheet at:
www.actel.com/documents/HRSXADS.pdf
Pl a s t i c D e vi c e Re so u r ce s
User I/Os (including clock buffers)
Device
A54SX08A
A54SX16A
A54SX32A
A54SX72A
PQFP
208-Pin
130
175
174
171
TQFP
100-Pin
81
81
81
—
TQFP
144-Pin
113
113
113
—
TQFP
176-Pin
—
—
147
—
PBGA
329-Pin
—
—
249
—
FBGA
144-Pin
111
111
111
—
FBGA
256-Pin
—
180
203
203
FBGA
484-Pin
—
—
249
360
Contact your Actel sales representative for product availability.
Package Definitions
PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = 1.27mm Plastic Ball Grid Array, FBGA = 1.0mm Fine Pitch Ball
Grid Array
2
v4.0
SX - A F a m ily F P GA s
Pr od uc t P l a n
Speed Grade**
–F
A54SX08A Device
100-Pin Thin Quad Flat Pack (TQFP)
144-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
144-Pin Fine Pitch Ball Grid Array (FBGA)
A54SX16A Device
100-Pin Thin Quad Flat Pack (TQFP)
144-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
144-Pin Fine Pitch Ball Grid Array (FBGA)
256-Pin Fine Pitch Ball Grid Array (FBGA)
A54SX32A Device
100-Pin Thin Quad Flat Pack (TQFP)
144-Pin Thin Quad Flat Pack (TQFP)
176-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
208-Pin Ceramic Quad Flat Pack (CQFP)*
256-Pin Ceramic Quad Flat Pack (CQFP)*
144-Pin Fine Pitch Ball Grid Array (FBGA)
256-Pin Fine Pitch Ball Grid Array (FBGA)
329-Pin Plastic Ball Grid Array (PBGA)
484-Pin Fine Pitch Ball Grid Array (FBGA)
A54SX72A Device
208-Pin Plastic Quad Flat Pack (PQFP)
208-Pin Ceramic Quad Flat Pack (CQFP)*
256-Pin Ceramic Quad Flat Pack (CQFP)*
256-Pin Fine Pitch Ball Grid Array (FBGA)
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Std
–1
–2
–3
C
Application
I
†
M
•
A
484-Pin Fine Pitch Ball Grid Array (FBGA)
✔
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Contact your Actel sales representative for product availability.
*For more information about the CQFP package options, refer to the
HiRel SX-A
datasheet at:
www.actel.com/documents/HRSXADS.pdf
Applications: C = Commercial
Availability:
✔
= Available
**Speed Grade: –1 = Approx. 15% faster than Standard
I = Industrial
–2 = Approx. 25% faster than Standard
M = Military
–3 = Approx. 35% faster than Standard
A = Automotive
–F = Approx. 40%
slower
than Standard
† Only Std, –1, –2 Speed Grade
•
Only Std, –1 Speed Grade
v4.0
3
S X -A F a m il y F P GA s
G en er al D e sc r i p t i on
Actel’s SX-A family of FPGAs features a sea-of-modules
architecture that delivers high device performance. SX-A
devices simplify design time, enable dramatic reductions in
design costs and power consumption, and further decrease
time-to-market for performance-intensive applications.
Actel’s SX-A architecture features two types of logic
modules, the combinatorial cell (C-cell) and the register
cell (R-cell), each optimized for fast and efficient mapping
of synthesized logic functions. The routing and interconnect
resources are in the metal layers above the logic modules,
providing optimal use of silicon. This enables the entire
floor of the device to be spanned with an uninterrupted grid
of fine-grained, synthesis-friendly logic modules (or
“sea-of-modules”), which reduces the distance signals have
to travel between logic modules. To minimize signal
propagation delay, SX-A devices employ both local and
general routing resources. The high-speed local routing
resources (DirectConnect and FastConnect) enable very
fast local signal propagation that is optimal for fast
counters, state machines, and datapath logic. The general
system of segmented routing tracks allows any logic module
in the array to be connected to any other logic or I/O
module. Within this system, propagation delay is minimized
by limiting the number of antifuse interconnect elements to
five (90 percent of connections typically use only three or
fewer antifuses). The unique local and general routing
structure featured in SX-A devices gives fast and predictable
performance, allows 100% pin-locking with full logic
utilization, enables concurrent PCB development, reduces
design time, and allows designers to achieve performance
goals with minimum effort.
Further complementing SX-A’s flexible routing structure is a
hardwired, constantly loaded clock network that has been
tuned to provide fast clock propagation with minimal clock
skew. Additionally, the high performance of the internal
logic has eliminated the need to embed latches or flip-flops
in the I/O cells to achieve fast clock-to-out or fast input
set-up times. SX-A devices have easy-to-use I/O cells that do
not require HDL instantiation, facilitating design re-use and
reducing design and verification time.
S X - A F a m i l y A r c hi t ec t u r e
The SX-A family architecture was designed to satisfy
performance
and
integration
requirements
for
production-volume designs in a broad range of applications.
P r ogr am m abl e I nte rc onnec t E lem en t
The SX-A family provides efficient use of silicon by locating
the routing interconnect resources between the top two
metal layers (Figure
1).
This completely eliminates the
channels of routing and interconnect resources between
logic modules (as implemented on SRAM FPGAs and
previous generations of antifuse FPGAs), and enables the
entire floor of the device to be spanned with an
uninterrupted grid of logic modules.
Routing Tracks
Amorphous Silicon/
Dielectric Antifuse
Metal 4
Tungsten Plug Via
Metal 3
Tungsten Plug Via
Metal 2
Metal 1
Tungsten Plug Contact
Silicon Substrate
Note:
A54SX72A has four layers of metal with the antifuse between Metal 3 and Metal 4. A54SX08A, A54SX16A, and
A54SX32A have three layers of metal with antifuse between Metal 2 and Metal 3.
Figure 1 •
SX-A Family Interconnect Elements
4
v4.0
SX - A F a m ily F P GA s
Interconnection between these logic modules is achieved
using Actel’s patented metal-to-metal programmable
antifuse interconnect elements. The antifuses are normally
open circuit and, when programmed, form a permanent
low-impedance connection.
The extremely small size of these interconnect elements
gives the SX-A family abundant routing resources and
provides excellent protection against design pirating.
Reverse engineering is virtually impossible because it is
extremely difficult to distinguish between programmed and
unprogrammed antifuses, and since SX-A is a nonvolatile,
single-chip solution, there is no configuration bitstream to
intercept.
Additionally, the interconnect (i.e., the antifuses and metal
tracks) have lower capacitance and lower resistance than
any other device of similar capacity, leading to the fastest
signal propagation in the industry.
Logi c Modul e Des ign
modules, the register cell (R-cell) and the combinatorial
cell (C-cell).
The R-cell contains a flip-flop featuring asynchronous clear,
asynchronous preset, and clock enable (using the S0 and S1
lines) control signals (Figure
2).
The R-cell registers
feature programmable clock polarity selectable on a
register-by-register basis. This provides additional flexibility
while allowing mapping of synthesized functions into the
SX-A FPGA. The clock source for the R-cell can be chosen
from either the hardwired clock, the routed clocks, or
internal logic.
The C-cell implements a range of combinatorial functions of
up to five inputs (Figure
3 on page 6).
Inclusion of the DB
input and its associated inverter function increases the
number of combinatorial functions that can be implemented
in a single module from 800 options (as in previous
architectures) to more than 4,000 in the SX-A architecture.
An example of the improved flexibility enabled by the
inversion capability is the ability to integrate a 3-input
exclusive-OR function into a single C-cell. This facilitates
construction of 9-bit parity-tree functions with 1.9 ns
propagation delays. At the same time, the C-cell structure is
extremely synthesis friendly, simplifying the overall design
and reducing synthesis time.
The SX-A family architecture is described as a
“sea-of-modules” architecture because the entire floor of
the device is covered with a grid of logic modules with
virtually no chip area lost to interconnect elements or
routing. Actel’s SX-A family provides two types of logic
S0
Routed
Data Input S1
PRE
DirectConnect
Input
D
Q
Y
HCLK
CLKA,
CLKB,
Internal Logic
CKS
CKP
CLR
Figure 2 •
R-Cell
v4.0
5
