A705
www.addmtek.com
DESCRIPTION
The A705 is a low dropout current regulator rated
for 210mA, 230mA, 250mA, 270mA, and 290mA
constant sink current. The low quiescent current and low
dropout voltage are achieved by advanced Bi-CMOS
process.
200mA ~ 300mA
A
DVANCED
C
URRENT
R
EGULATOR
FEATURES
Only bypass capacitor is required.
210/230/250/270/290mA constant sink current.
Output short / open circuit protection.
Low dropout voltage.
Low quiescent current.
Supply voltage range 2.7V ~ 12V.
2KV HBM ESD protection.
Advanced Bi-CMOS process.
SOT-89 and TO-252 package available.
TYPICAL APPLICATION CIRCUIT
V
LED+
APPLICATIONS
Power LED Driver
LED Cap-Lamp
C
BP
PACKAGE PIN OUT
V
DD
V
DD
OUT
GND
OUT
SOT-89
(Top View)
TO-252
GND
OUT
V
DD
C
IN
VDD
A705X
GND
ORDER INFORMATION
Output Current
200mA ~ 220mA
220mA ~ 240mA
240mA ~ 260mA
260mA ~ 280mA
280mA ~ 300mA
N
SOT-89
3-pin
A705NFT-210
A705NFT-230
A705NFT-250
A705NFT-270
A705NFT-290
S
TO-252
3-pin
A705SFT-210
A705SFT-230
A705SFT-250
A705SFT-270
A705SFT-290
Note: The letter ”F” is marked for Lead Free process, and letter “T” is marked for Tape & Reel.
Copyright
©
2007 ADDtek Corp.
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A705
ABSOLUTE MAXIMUM RATINGS
(Note)
Input Voltage, V
DD
Output Voltage, V
OUT
Maximum Junction Temperature, T
J
Storage Temperature Range
Lead Temperature (Soldering, 10 seconds)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.
Currents are positive into, negative out of the specified terminal.
-0.3V to 13.2V
-0.3V to 17V
150°C
-40°C to 150°C
260°C
BLOCK DIAGRAM
A705
VDD
Band-gap
Reference
Control
Circuit
OUT
GND
PIN DESCRIPTION
Pin Name
V
DD
OUT
GND
Pin Function
Power supply.
Output pins. Connected to load.
Ground.
THERMAL RESISTANCE
Package
N
S
SOT-89
TO-252
θ
JT
(°C /W)
35
7
Note:
T
J
= T
C
+ (P
D
× θ
JT
)
θ
JT
: Thermal Resistance - Junction to Tab.
T
C
: Case (Tab) Temperature.
T
J
: Junction Temperature.
P
D
: Power Consumption.
Copyright
©
2007 ADDtek Corp.
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A705
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Output Sink Current
Operating Free-air Temperature Range
Symbol
V
DD
I
OUT
T
A
Min
2.7
-40
Typ
Max
12
260
+85
Unit
V
mA
°C
DC ELECTRICAL CHARACTERISTICS
V
DD
=3.7V, T
A
=25°C, No Load (Unless otherwise noted)
Parameter
Symbol
Condition
A705P
A705Q
Output Sink Current
I
OUT
V
OUT
=0.2V
A705R
A705S
A705T
Load Regulation
Line Regulation
Output Dropout Voltage
(Note)
Supply Current Consumption
V
OUTL
I
DD
V
OUT
=0.2V to 3V
V
DD
= 3V to 12V,
V
OUT
=0.2V
120
200
Min
200
220
240
260
280
Typ
210
230
250
270
290
Max
220
240
260
280
300
2
2
mA/V
mA/V
mV
uA
VDD
OUT
mA
Unit
Apply
Pin
Note: Output dropout voltage: 90% x I
OUT
@ V
OUT
=200mV
Copyright
©
2007 ADDtek Corp.
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A705
APPLICATION INFORMATION
The Maximum Power Dissipation on Regulator:
P
D(MAX)
= V
OUT(MAX)
×
I
OUT(NOM)
+ V
IN(MAX)
×
I
Q
V
OUT(MAX)
= the maximum voltage on output pin;
I
OUT(NOM)
= the nominal output current;
I
Q
= the quiescent current the regulator consumes at I
OUT(MAX)
;
V
IN(MAX)
= the maximum input voltage.
Thermal Consideration:
The A705 has internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of A705 prevents the device from damage due to excessive power dissipation.
When the device temperature rises to approximately 150°C, the regulator will be turned off. When power consumption
is over about 700mW (SOT-89 package, at T
A
=70°C) or 1000mW (TO-252 package, at T
A
=70°C), additional heat sink
is required to control the junction temperature below 120°C.
The junction temperature is:
T
J
= P
D
(θ
JT
+θ
CS
+θ
SA
) + T
A
P
D
: Dissipated power.
θ
JT
:
Thermal resistance from the junction to the mounting tab of the package.
θ
CS
:
Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically,
θ
CS
< 1.0°C /W)
θ
SA
:
Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size
of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through-hole vias.
PCB
θ
SA
(°C /W)
PCB heat sink size (mm
2
)
59
500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Copyright
©
2007 ADDtek Corp.
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A705
PACKAGE
Top Marking for SOT-89
X : Output Current Options
A705X
YWWVV
P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA
Y : Year Code
WW : Week Code
V : Vendor Code
3-Pin Surface Mount SOT-89
INCHES
MIN
TYP
-
-
-
-
-
-
MAX
0.181
0.102
0.063
0.017
0.090
0.019
MILLIMETERS
MIN
4.39
2.28
1.39
0.38
2.13
0.33
TYP
-
-
-
-
-
-
1.49 BSC
2.99 BSC
0.45
3.94
1.70
0°
0.89
-
-
-
-
-
0.55
4.24
1.82
8°
1.19
MAX
4.59
2.59
1.60
0.43
2.28
0.48
A
L
C
D
A
B
0.173
0.090
C 0.055
D 0.015
K
N
F
J
G
H
B
E
E
F
0.084
0.016
M
G
H
J
K
L
M
0.059 BSC
0.118 BSC
0.018
0.155
0.067
0°
-
-
-
-
-
0.022
0.167
0.072
8°
0.047
N 0.035
Copyright
©
2007 ADDtek Corp.
5
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