• Ceramic package and metal lid assures high precision and reliability.
• Seam sealing.
Pb
RoHS
Compliant
APPLICATIONS:
• Cellular telephones, Pagers.
• Communication and Test equipment.
• High Density applications.
• PCMCIA and wireless applications.
5.0 X 3.2 X 1.1mm
| | | | | | | | | | | | | | |
STANDARD SPECIFICATIONS:
PARAMETERS
ABRACON P/N
Frequency Range
Operation Mode
Operating Temperature
Storage Temperature
Frequency Tolerance @ 25°C
Frequency Stability over the
Operating Temperature
(Ref to + 25°C)
Equivalent Series Resistance
Shunt Capacitance C0
Load Capacitance CL
Drive Level
Aging (First Year) @ 25°C ± 3°C
Insulation Resistance
TABLE 1- Standard ESR
Frequency (MHz)
8.000 - 9.999 (Fund.)
10.000 -11.999 (Fund.)
12.000 - 15.999 (Fund.)
ABM3B Series
8.0MHz - 50.0MHz (Fundamental
50.1MHz - 125MHz (3rd overtone)
Fundamental or 3rd overtone
- 10°C to + 60°C (see options)
- 40°C to + 85°C
± 50 ppm max. (see options)
± 50 ppm max. (see options)
See table 1
7 pF max.
18 pF (see options)
100 µW max., 10 µW typical
± 5ppm max.
500 M Ω min at 100Vdc ± 15 V
ESR(
Ω)
max
200
100
70
Frequency (MHz)
16.000 - 50.000 (Fund.)
50.001 - 80.000 (3rd OT)
80.001 - 125.000 (3rd OT)
ESR(
Ω
max
)
50
60
80
ABRACON IS
ISO 9001:2008
ISO 9001 / QS 9000
CERTIFIED
LLC
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 08.25.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit
www.abracon.com
for Terms and Conditions of Sale
CERAMIC SMD CRYSTAL
ABM3B
Pb
RoHS
Compliant
ABM3B
Height (mm)
Blank: 1.1mm max
1: 0.8mm max
Frequency in MHz
e.g. 8.000MHz
14.31818MHz
26.000MHz
125.000MHz
Load Capacitance
Please specify CL(6 to
32pF) in pF or S for Series
Please contact ABRACON for
values under 6pF
5.0 X 3.2 X 1.1mm
| | | | | | | | | | | | | | |
OPTIONS AND PART IDENTIFICATION: (Left blank if standard)
–
MHz -
-
-
-
-
-
Blank: Bulk
T: 1k pcs per reel
T2: 250 pcs per reel
Packaging
Custom ESR
STD
if
other than standard
R□
□:
Specify a value in
Ω
(e.g.: R40)
Operating Temp.
E: 0°C ~ +70°C
B: -20°C ~ +70°C
C: -30°C ~ +70°C
N: -30°C ~ +85°C
D: -40°C ~ +85°C
J****: -40°C ~ +105°C
K****: -40°C ~ +125°C
L*: -55°C ~ +125°C
Freq. Tolerance
1: ± 10 ppm
7: ± 15 ppm
2: ± 20 ppm
3: ± 25 ppm
4: ± 30 ppm
Freq. Stability
U**: ± 10 ppm
G***: ± 15 ppm
X: ± 20 ppm
W: ± 25 ppm
Y: ± 30 ppm
H: ± 35 ppm
Z: ± 100 ppm
(*) Option Z only
(**)Standard temp or
options E and B only
(***)Standard temp or
options E, B, C and N
only.
(****) Freq. stability
±50ppm and ±100ppm
only. Contact ABRACON
for tighter freq. stability.
OUTLINE DIMENSIONS:
Please see Table 2 below for height and chamfer information.
Chamfer on PIN 1
(Default)
Table 2
Height (mm)
Chamfer PIN #
ABM3B 1.1mm max
#1 (Default), #4 (See Note)
ABM3B1 0.8mm max
#1 (Default), #4 (See Note)
Chamfer on PIN 4
(See Note)
Note: Due to the availability of raw materials, this part may be manufactured with the
chamfer on pin 4. Be advised that this does not affect the electrical characteristics
of the crystal in any way.
Dimension : Inches (mm)
ABRACON IS
ISO 9001:2008
ISO 9001 / QS 9000
CERTIFIED
LLC
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 08.25.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit
www.abracon.com
for Terms and Conditions of Sale
CERAMIC SMD CRYSTAL
ABM3B
REFLOW PROFILE:
Pb
RoHS
Compliant
5.0 X 3.2 X 1.1mm
| | | | | | | | | | | | | | |
TAPE & REEL:
T=1000pcsTape and reel
T2=250pcsTape and reel
Dimension : mm
ATTENTION:
Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applica-
tions. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requiring high reliability where
component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and
authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
受益于全球半导体产能紧缺而引发的扩产潮，日本半导体设备巨头东京电子（TEL，Tokyo Electron Limited）调升财测，营收、纯益拼历史新高纪录，而日本其他设备商也于日前纷纷调升财测。 东京电子于16日日股盘后发布新闻稿宣布，因5G、AI、IoT等情报通讯技术应用扩大，推升芯片需求旺盛，也带动芯片制造设备市场呈现持续扩大，因此在评估客户最新的投资动向及业绩动向后，将今年度（202...[详细]
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PCB设计
