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AC15CF0122F24

CAP,CERAMIC,1.2NF,200VDC,1% -TOL,1% +TOL,NP0 TC CODE,-30,30PPM TC,2220 CASE

器件类别:无源元件    电容器   

厂商名称:AVX

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1218285814
包装说明
, 2220
Reach Compliance Code
compliant
ECCN代码
EAR99
电容
0.0012 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
高度
1.8 mm
JESD-609代码
e4
长度
5.7 mm
制造商序列号
AC
负容差
1%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形式
SMT
包装方法
Tape, Plastic
正容差
1%
额定(直流)电压(URdc)
200 V
系列
AC
尺寸代码
2220
温度特性代码
NP0
温度系数
-/+30ppm/Cel ppm/°C
端子面层
Silver/Palladium/Platinum (Ag/Pd/Pt)
宽度
5 mm
文档预览
AVX
European Space Agency and CECC
Ceramic Capacitor Products
European Space
www.avx.com
Version 10.10
Table of Contents
AVAILABLE TYPES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
AVAILABLE RELIABILITY LEVELS / TYPES . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
RELEVANT STANDARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
DIELECTRIC CLASS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
ELECTRICAL MEASUREMENTS CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . 3
RELIABILITY LEVELS DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
AVAILABLE TERMINATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
PACKAGING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
MARKING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
AVAILABLE CLIMATIC AND ELECTRIC TESTS . . . . . . . . . . . . . . . . . . . . . . . . . 5
MLC CHIPS RANGE - TYPE I & II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
HOW TO ORDER CODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
ESCC Qualified SMPS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-15
QPL CERTIFICATES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-17
NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements,
information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any
kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that
any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety mea-
sures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications.
1
AVX European Space Agency and CECC
Surface Mount Ceramic Capacitor Products
AVAILABLE TYPES
MLC CHIPS vs ESA ESCC & vs CECC 32101-002, 003 (established reliability) from 25V up to 500V.
AVAILABLE RELIABILITY LEVELS
ESA QUALIFIED - LEVEL B
ESA QUALIFIED - LEVEL C
CECC + 100% Burn in /168H + Thermal shock
+ 85/85 humidity test + on 40 samples per batch + DPA
CECC + 100% Burn in /168H + DPA
CECC + 100% Burn in /48H + DPA
CECC + DPA
NB
NC
T6
T5
T3
T2
with or without LAT I, II or III
Level B
ESA
Level C
T6
T5
T3
T2
Reliability Level
Level T5 & T6: Reliability Level = MIL S
Level T3: Reliability Level = MIL R
CECC
AVAILABLE RELIABILITY LEVELS SUMMARY/TYPES
Types
MLC Chips
Products
T6 to T2
AN, AC & AD
12, 13, 14, 15, 20
(NP0, X7R)
A...C NP0
A...Z X7R
A...G 2C1
CECC
ESA
ESCC
X
Reliability Level
Level B
Level C
MLC Chips
ESA Qualified/3009
X
X
RELEVANT STANDARDS
Type of
Component
MLC Chips
Reliability Level
T2 / T3 / T5 / T6
Level B & C
CECC 32101-002
32101-003
ESA ESCC 3009
32101-801
(IEC 384-8-9-10)
2
AVX European Space Agency and CECC
Surface Mount Ceramic Capacitor Products
DIELECTRIC TYPES USED
Type I
NP0
TPC Code: C
Type II
X7R
2C1
TPC Code: Z
TPC Code: G
ELECTRICAL MEASUREMENT CONDITIONS FOR CECC CHIPS: T2 / T3 / T5 / T6
Type
TPC code
Classification
1
C
1B
C0G
NP0
CG
±30ppm/°C
0
22°C ±3°C
C ≤ 1000 pF
F = 1MHz
C > 1000 pF
F = 1 kHz
Um ≤ 5 Vrms
C
50 pF DF < 1.5 (150/C + 7).10
-4
C>50 pF DF < 15.10
-4
For C
10nF: Ri > 100 GΩ or
For C > 10nF: Ri x Cr > 1000s
For UR ≤ 100V : 2.5 x UR
For UR > 100V : 1.5 UR + 100V
2
Z
2R1
X7R
IEC/CECC
EIA
DIN
MIL
Capacitance change
With temperature & : Ubias = 0
Ubias = UR
Typical ageing (%/dec.)
Reference temperature
Capacitance
Frequency
and D.F.
measurement
Voltage
Dissipation
Factor (DF)
Insulation Resistance
under UR /1 mn
Proof voltage
± 15%
N.A.
1.5
22°C ±3°C
C
100 pF
F = 1MHz
C > 100 pF
F = 1 kHz
Um ≤ 0.3 Vrms ± 0.2
DF < 250 .10
-4
For C ≤ 10nF: Ri > 100 GΩ or
For C > 10nF: Ri x C > 1000s
For UR ≤ 100V: 2.5 x UR
For UR >100V: 1.5 x UR + 100V
Note: ESA Chips are strictly measured vs ESA spec. 3009 + detail spec.
ELECTRICAL MEASUREMENT CONDITIONS FOR ESA CHIPS: LEVEL B & C
Type
TPC code
Classification
1
C
1B
C0G
NP0
CG
±30ppm/°C
0
22°C ±3°C
C ≤ 1000 pF
F = 1MHz
C > 1000 pF
F = 1 kHz
Um ≤ 5 Vrms
C
50 pF DF < 1.5 (150/C + 7).10
-4
C>50 pF DF < 15.10
-4
Ri > 100 GΩ
For UR < 500V : 2.5 x UR
2
Z
2R1
X7R
G
2C1
BX
± 20%
± 20%
*-60/+20%
-30/+20%
1.5
1.5
22°C ±3°C
22°C ±3°C
C
100 pF
F = 1MHz
C > 100 pF
F = 1 kHz
Um ≤ 1 Vrms
DF < 250 .10
-4
For C ≤ 10nF: Ri > 100 GΩ or
For C > 10nF: Ri x C > 1000s
For UR < 500V: 2.5 x UR
For UR = 500V: 2 x UR
IEC/CECC
EIA
DIN
MIL
Capacitance change
With temperature & : Ubias = 0
Ubias = UR
Typical ageing (%/dec.)
Reference temperature
Capacitance
Frequency
and D.F.
measurement
Voltage
Dissipation
Factor (DF)
Insulation Resistance
under UR /1 mn
Proof voltage
*Typical value for this dielectric class
Note: ESA Chips are strictly measured vs ESA spec. 3009 + detail spec.
3
AVX European Space Agency and CECC
Surface Mount Ceramic Capacitor Products
RELIABILITY LEVELS DESCRIPTION
CECC
T2
T3
CECC DESIGN
DPA
Capacitance / DF
IR
Voltage proof
100% control
Visual inspection
AQL sampling
Burn-in
125°C 48h
100% control
Capacitance / DF
IR
Voltage proof
AQL sampling
Solderability
Sampling 10 pieces
Capacitance / DF
IR
Voltage proof
100% control
Solderability
Sampling 10 pieces
Burn-in
125°C 168h
100% control
Capacitance / DF
IR
Voltage proof
100% control
Solderability
Sampling 10 pieces
Thermal Shock
Damp Heat
Electrical
Measurement*
Sampling 40 pieces
*EDX material analysis
ESA - ESCC
T5
T6
Level C
Level B
HIGH RELIABILITY DESIGN versus ESA
IN PROCESS CONTROL
following
ESA ESCC 3009 Chips
CHART II
following
ESA ESCC 3009
CHART III
following
ESA ESCC 3009
Lot acceptance sheet
Certificate of
conformity
T2
Lot acceptance sheet
Certificate of
conformity
T3
Lot acceptance sheet
Certificate of
conformity
T5
Lot acceptance sheet
Certificate of
conformity
T6
DOCUMENTATION
following ESA ESCC
4
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