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ACT-F128K8N-150F6Q

Flash, 128KX8, 150ns, CDFP32,

器件类别:存储    存储   

厂商名称:Aeroflex

厂商官网:http://www.aeroflex.com/

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器件参数
参数名称
属性值
厂商名称
Aeroflex
包装说明
DFP, FL32,.4
Reach Compliance Code
unknown
最长访问时间
150 ns
命令用户界面
YES
数据轮询
YES
耐久性
100000 Write/Erase Cycles
JESD-30 代码
R-XDFP-F32
内存密度
1048576 bit
内存集成电路类型
FLASH
内存宽度
8
部门数/规模
8
端子数量
32
字数
131072 words
字数代码
128000
最高工作温度
125 °C
最低工作温度
-55 °C
组织
128KX8
封装主体材料
CERAMIC
封装代码
DFP
封装等效代码
FL32,.4
封装形状
RECTANGULAR
封装形式
FLATPACK
并行/串行
PARALLEL
电源
5 V
认证状态
Not Qualified
筛选级别
38535Q/M;38534H;883B
部门规模
16K
最大待机电流
0.0016 A
最大压摆率
0.05 mA
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子形式
FLAT
端子节距
1.27 mm
端子位置
DUAL
切换位
YES
类型
NOR TYPE
文档预览
ACT–F128K8 High Speed
1 Megabit Monolithic FLASH
CIRCUIT TECHNOLOGY
www.aeroflex.com
Features
s
s
s
s
s
s
s
s
s
s
s
Low Power Monolithic 128K x 8 FLASH
TTL Compatible Inputs and CMOS Outputs
Access Times of 60, 70, 90, 120 and 150ns
+5V Programing, +5V Supply
100,000 Erase / Program Cycles
Low Standby Current
Page Program Operation and Internal
Program Control Time
Supports Full Chip Erase
Embedded Erase and Program Algorithms
Supports Full Chip Erase
MIL-PRF-38534 Compliant Circuits Available
s
s
Industry Standard Pinouts
Packaging – Hermetic Ceramic
32 Lead, 1.6" x .6" x .20" Dual-in-line Package (DIP),
Aeroflex code# "P4"
q
32 Lead, .82" x .41" x .125" Ceramic Flat Package
(FP), Aeroflex code# "F6"
q
32 Lead, .82" x .41" x .132" Ceramic Flat Package
(FP Lead Formed), Aeroflex code# "F7"
q
s
Sector Architecture
8 Equal size sectors of 16K bytes each
q
Any Combination of Sectors
can be erased with one
command sequence.
q
s
s
Commercial, Industrial and Military
Temperature Ranges
DESC SMD Pending
5962-96690 (P4,F6,F7)
Block Diagram – DIP (P4) & Flat Packages (F6,F7)
CE
WE
OE
A
0
– A
16
Vss
512Kx8
Vcc
8
I/O
0-7
Pin Description
I/O
0-7
Data I/O
General Description
The ACT–F128K8 is a high
speed, 1 megabit CMOS
monolithic
Flash
module
designed for full temperature
range military, space, or high
reliability applications.
This device is input TTL and
output CMOS compatible. The
command register is written by
bringing write enable (WE) and
chip enable (CE) to a logic low
level and output enable (OE) to a
logic high level. Reading is
accomplished when WE is high
and CE, OE are both low, see
Figure 9. Access time grades of
60ns, 70ns, 90ns, 120ns and
150ns maximum are standard.
The
ACT–F128K8
is
available
in a
choice of
A
0–16
Address Inputs
WE
CE
OE
V
CC
V
SS
NC
Write Enable
Chip Enable
Output Enable
Power Supply
Ground
Not Connected
eroflex Circuit Technology - Advanced Multichip Modules © SCD1676 REV A 5/6/98
General Description, Cont’d
,
hermetically sealed ceramic packages; a
32 lead .82" x .41" x .125" flat package in
both formed or unformed leads or a 32 pin
1.6"x.60" x.20" DIP package for operation
over the temperature range -55°C to
+125°C
and
military
environmental
conditions.
The flash memory is organized as
128Kx8
bits and is designed to be
programmed in-system with the standard
system 5.0V Vcc supply. A 12.0V V
PP
is
not required for write or erase operations.
The device can also be reprogrammed with
standard EPROM programmers (with the
proper socket).
The standard ACT–F128K8 offers
access times between 60ns and 150ns,
allowing
operation
of
high-speed
microprocessors without wait states. To
eliminate bus contention, the device has
separate chip enable (CE), write enable
(WE) and output enable (OE) controls. The
ACT–F128K8 is command set compatible
with JEDEC standard 1 Mbit EEPROMs.
Commands are written to the command
register using standard microprocessor
write timings. Register contents serve as
input to an internal state-machine which
controls the erase and programming
circuitry. Write cycles also internally latch
addresses and data needed for the
programming and erase operations.
Reading data out of the device is similar
to reading from 12.0V Flash or EPROM
devices. The ACT–F128K8 is programmed
by executing the program command
sequence. This will invoke the Embedded
Program Algorithm which is an internal
algorithm that automatically times the
program pulse widths and verifies proper
cell margin. Typically, each sector can be
programmed and verified in less than 0.3
second. Erase is accomplished by
executing the erase command sequence.
This will invoke the Embedded Erase
Algorithm which is an internal algorithm
that automatically preprograms the array, (if
it is not already programmed before)
executing the erase operation. During
erase, the device automatically times the
erase pulse widths and verifies proper cell
margin.
Also the device features a sector erase
architecture. The sector mode allows for
16K byte blocks of memory to be erased
and reprogrammed without affecting other
blocks. The ACT-F128K8 is erased when
shipped from the factory.
The device features single 5.0V power
supply operation for both read and write
functions.
lnternally
generated
and
regulated voltages are provided for the
program and erase operations. A low V
CC
detector
automatically
inhibits
write
operations on the loss of power. The end of
program or erase is detected by Data
Polling of D7 or by the Toggle Bit feature on
D6. Once the end of a program or erase
cycle has been completed, the device
internally resets to the read mode.
All bits of each die, or all bits within a
sector of a die, are erased via
Fowler-Nordhiem tunneling. Bytes are
programmed one byte at a time by hot
electron injection.
A DESC Standard Military Drawing
(SMD) number is pending.
Aeroflex Circuit Technology
2
SCD1676 REV A 5/6/98
Plainview NY (516) 694-6700
z
Absolute Maximum Ratings
Parameter
Case Operating Temperature
Storage Temperature Range
Supply Voltage Range
Signal Voltage Range (Any Pin Except A9) Note 1
Maximum Lead Temperature (10 seconds)
Data Retention
Endurance (Write/Erase cycles)
A9 Voltage for sector protect, Note 2
V
ID
Symbol
T
C
T
STG
V
CC
V
G
Range
-55 to +125
-65 to +150
-2.0 to +7.0
-2.0 to +7.0
300
10
100,000 Minimum
-2.0 to +14.0
V
Units
°C
°C
V
V
°C
Years
Note 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may undershoot V
SS
to -2.0v for periods of
up to 20ns. Maximum DC voltage on input and I/O pins is V
CC
+ 0.5V. During voltage transitions, inputs and I/O pins may
overshoot to V
CC
+ 2.0V for periods up to 20 ns.
Note 2. Minimum DC input voltage on A9 is -0.5V. During voltage transitions, A9 may undershoot V
SS
to -2.0V for periods of up to 20ns.
Maximum DC input voltage on A9 is +12.5V which may overshoot to 14.0V for periods up to 20ns.
Normal Operating Conditions
Symbol
V
CC
V
IH
V
IL
Tc
V
ID
Parameter
Power Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temperature (Military)
A9 Voltage for sector protect
Minimum
+4.5
+2.0
-0.5
-55
11.5
Maximum
+5.5
V
CC
+ 0.5
+0.8
+125
12.5
Units
V
V
V
°C
V
Capacitance
(V
IN
= 0V, f = 1MHz, Tc = 25°C)
Symbol
C
AD
C
OE
C
WE
C
CE
C
I
/
O
Parameter
A
0
– A
16
Capacitance
OE Capacitance
Write Enable Capacitance
Chip Enable Capacitance
I/O0 – I/O7 Capacitance
Maximum
15
15
15
15
15
Units
pF
pF
pF
pF
pF
Parameters Guaranteed but not tested
DC Characteristics – CMOS Compatible
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C, unless otherwise indicated)
Parameter
Input Leakage Current
Output Leakage Current
Active Operating Supply Current for Read (1)
Active Operating Supply Current for Program or Erase (2)
Operating Standby Supply Current
Output Low Voltage
Output High Voltage
Low Power Supply Lock-Out Voltage (4)
Sym
I
LI
I
LO
I
CC
1
I
CC
2
I
CC
3
V
OL
V
OH
V
LKO
Conditions
V
CC
= 5.5V, V
IN
= GND to V
CC
V
CC
= 5.5V, V
IN
= GND to V
CC
CE = V
IL
,
OE = V
IH
, f = 5MHz
CE = V
IL
,
OE = V
IH
V
CC
= 5.5V, CE = V
IH
, f = 5MHz
I
OL
= +8.0 mA, V
CC
= 4.5V
I
OH
= –2.5 mA, V
CC
= 4.5V
0.85 x V
CC
3.2
Speeds 60, 70, 90, 120 & 150ns
Minimum
Maximum
10
10
35
50
1.6
0.45
Units
µA
µA
mA
mA
mA
V
V
V
Note 1. The Icc current listed includes both the DC operating current and the frequency dependent component (At 6 MHz). The frequency
component typically is less than 2 mA/MHz, with OE at V
IN
.
Note 2. Icc active while Embedded Algorithm (Program or Erase) is in progress.
Note 3. DC Test conditions: V
IL
= 0.3V, V
IH
= V
CC
- 0.3V, unless otherwise indicated.
Note 4. Parameter Guaranteed by design, but not tested.
Aeroflex Circuit Technology
3
SCD1676 REV A 5/6/98
Plainview NY (516) 694-6700
AC Characteristics – Read Only Operations
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Parameter
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable to Output Valid
Chip Enable to Output High Z (1)
Output Enable High to Output High Z(1)
Output Hold from Address, CE or OE Change, Whichever is First
Note 1. Guaranteed by design, but not tested
Symbol
t
AVAV
t
AVQV
t
ELQV
t
GLQV
t
EHQZ
t
GHQZ
t
AXQX
t
RC
t
ACC
t
CE
t
OE
t
DF
t
DF
t
OH
0
60
60
60
30
20
20
0
–60
70
70
70
35
20
20
0
–70
90
90
90
40
25
25
0
–90
–120
120
120
120
50
30
30
0
–150
150
150
150
55
35
35
JEDEC Stand’d Min Max Min Max Min Max Min Max Min Max
Units
ns
ns
ns
ns
ns
ns
ns
AC Characteristics – Write/Erase/Program Operations, WE Controlled
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Parameter
Write Cycle Time
Chip Enable Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation
Typ = 16 µs
Sector Erase Time
Read Recovery Time before Write
Vcc Setup Time
Chip Programming Time
Chip Erase Time
t
WHWH
3
Symbol
t
AVAC
t
ELWL
t
WLWH
t
AVWL
t
DVWH
t
WHDX
t
WLAX
t
WHWL
t
WHWH
1
t
WHWH
2
t
GHWL
t
VCE
0
50
12.5
120
t
WC
t
CE
t
WP
t
AS
t
DS
t
DH
t
AH
t
WPH
60
0
30
0
30
0
45
20
–60
70
0
35
0
30
0
45
20
–70
90
0
45
0
45
0
45
20
–90
–120
120
0
50
0
50
0
50
20
–150
150
0
50
0
50
0
50
20
JEDEC Stand’d Min Max Min Max Min Max Min Max Min Max
Units
ns
ns
ns
ns
ns
ns
ns
ns
µs
Sec
µs
µs
12.5
120
Sec
Sec
14 TYP 14 TYP 14 TYP 14 TYP 14 TYP
60
0
50
12.5
120
60
0
50
12.5
120
60
0
50
12.5
120
60
0
50
60
AC Characteristics – Write/Erase/Program Operations, CE Controlled
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Parameter
Write Cycle Time
Write Enable Setup Time
Chip Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Pulse Width High
Duration of Byte Programming
Sector Erase Time
Read Recovery Time
Chip Programming Time
Chip Erase Time
t
WHWH
3
Symbol
t
AVAC
t
WLE
L
t
ELEH
t
AVEL
t
DVEH
t
EHDX
t
ELAX
t
EHEL
t
WHWH
1
t
WHWH
2
t
WC
t
WS
t
CP
t
AS
t
DS
t
DH
t
AH
t
CPH
60
0
30
0
30
0
45
20
–60
70
0
35
0
30
0
45
20
–70
90
0
45
0
45
0
45
20
–90
–120
120
0
50
0
50
0
50
20
–150
150
0
50
0
50
0
50
20
JEDEC Stand’d Min Max Min Max Min Max Min Max Min Max
Units
ns
ns
ns
ns
ns
ns
ns
ns
µs
Sec
ns
12.5
120
Sec
Sec
14 TYP 14 TYP 14 TYP 14 TYP 14 TYP
60
0
12.5
120
0
12.5
120
60
0
12.5
120
60
0
12.5
120
60
0
60
t
GHEL
Aeroflex Circuit Technology
4
SCD1676 REV A 5/6/98
Plainview NY (516) 694-6700
Device Operation
The ACT-F128K8 Monolithic module is composed of one,
1 megabit flash EEPROM.
Programming of the ACT-F128K8 is accomplished by
executing the program command sequence.
The
program algorithm, which is an internal algorithm,
automatically times the program pulse widths and
verifies proper cell status. Sectors can be programed
and verified in less than 0.3 second.
Erase is
accomplished by executing the erase command
sequence. The erase algorithm, which is internal,
automatically preprograms the array if it is not already
programed before executing the erase operation. During
erase, the device automatically times the erase pulse
widths and verifies proper cell status. The entire
memory is typically erased and verified in 3 seconds
(if pre-programmed). The sector mode allows for 16K
byte blocks of memory to be erased and reprogrammed
without affecting other blocks.
programming, the device will draw active current until the
operation is completed.
WRITE
Device erasure and programming are accomplished via
the command register. The contents of the register
serve as input to the internal state machine. The state
machine outputs dictate the function of the device.
The command register itself does not occupy an
addressable memory location. The register is a latch
used to store the command, along with address and data
information needed to execute the command. The
command register is written by bringing WE to a logic
low level (V
IL
), while CE is low and OE is at V
IH
.
Addresses are latched on the falling edge of WE or CE,
whichever happens later. Data is latched on the rising
edge of the WE or CE whichever occurs first. Standard
microprocessor write timings are used. Refer to AC
Program Characteristics and Waveforms, Figures 3,
8 and 13.
Bus Operation
READ
The ACT-F128K8 has two control functions, both of
which must be logically active, to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output-Enable (OE)
is the output control and should be used to gate data to
the output pins of the chip selected. Figure 7 illustrates
AC read timing waveforms.
Command Definitions
Device operations are selected by writing specific
address and data sequences into the command register.
Table 3 defines these register command sequences.
READ/RESET COMMAND
The read or reset operation is initiated by writing the
read/reset command sequence into the command
register. Microprocessor read cycles retrieve array data
from the memory. The device remains enabled for reads
until the command register contents are altered.
The device will automatically power-up in the read/reset
state. In this case, a command sequence is not required
to read data. Standard microprocessor read cycles will
retrieve array data.
The device will automatically
power-up in the read/reset state. In this case, a
command sequence is not required to read data.
Standard Microprocessor read cycles will retrieve array
data. This default value ensures that no spurious
alteration of the memory content occurs during the
power transition. Refer to the AC Read Characteristics
and Figure 7 for the specific timing parameters.
OUTPUT DISABLE
With Output-Enable at a logic high level (V
IH
), output
from the device is disabled. Output pins are placed in a
high impedance state.
STANDBY MODE
The ACT-F128K8 has two standby modes, a CMOS
standby mode (CE input held at Vcc + 0.5V), where the
current consumed is typically less than 400 µA; and a
TTL standby mode (CE is held V
IH
) is approximately 1
mA. In the standby mode the outputs are in a high
impedance state, independent of the OE input.
If the device is deselected during erasure or
Table 1 – Bus Operations
Operation
READ
STANDBY
OUTPUT DISABLE
WRITE
ENABLE SECTOR
PROTECT
VERIFY SECTOR
PROTECT
Aeroflex Circuit Technology
Table 2 – Sector Addresses Table
I/O
DOUT
HIGH Z
HIGH Z
D
IN
X
Code
SA0
SA1
SA2
SA3
SA4
A16 A15
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
A14
0
1
0
1
0
1
0
1
Address Range
00000h – 03FFFh
04000h – 07FFFh
08000h – 0BFFFh
0C000h – 0FFFFh
10000h – 13FFFh
14000h – 17FFFh
18000h – 1BFFFh
1C000h – 1FFFFh
Plainview NY (516) 694-6700
CE OE WE A0 A1 A9
L
H
L
L
L
L
L
X
H
H
V
ID
L
H
X
H
L
L
H
A
0
A
1
A
9
X
X
X
X
X
X
A
0
A
1
A
9
X
L
X
H
V
ID
V
ID
SA5
SA6
SA7
5
SCD1676 REV A 5/6/98
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