Appendix
Appendix
Package Drawings and Specifications
Package Drawing – SOIC8
.193 (4.90)
.154 (3.91)
.236 (5.99)
NVE
XXXXX
-XX
.015 (.381)
x 45°
.154 (3.91)
.016 (.40) NOM.
.020 (.508)
.188 (4.77)
.017 TYP.
.054 (1.37)
Dimensions: inch (mm)
.061 (1.55)
.050 (1.27) x 6
BASIC
.004 (.10) MIN.
.010 (.26) MAX.
Note: SOIC8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – MSOP8
.118
(3.00)
.118 (3.00)
.005 (.13) NOM.
.193 (4.90)
NVE
XXX
.118 (3.00)
.021 (.533)
.154 (3.91)
.012 TYP.
.034 (.86)
.040 (1.02)
Dimensions: inches (mm)
.0256 (.65) x 6
BASIC
.004 (.10) MIN.
.012 (.31) MAX.
Note: MSOP8 Package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
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Appendix
Package Drawing – TDFN6 2.5 mm x 2.5 mm
0.80 MAX
2.00 ± 0.05
4
6
6
4
2.50 ± 0.10
1.30 ± 0.05
C0.10
PIN 1 ID
1
2.50 ± 0.10
PIN 1 INDEX AREA
3
3
0.30 ± 0.05(6x)
0.0-0.05
1
0.65 TYP. (4x)
1.30 REF (2X)
0.30 ± 0.05(6x)
0.20 REF.
Note: Dimensions in mm. TDFN6 package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – TDFN SO8
PIN 1 INDEX AREA
0.75±0.05
4
1
1
4
Pin 1 ID
6.00 ± 0.20
3.90 ± 0.15
3.40 ± 0.15
5
8
0.65 ± 0.10 (8x)
5
5
4.900 ± 0.20
0.0-0.05
0.40 ± 0.05 (8x)
3.81REF (2x)
1.27 Typ. (6x)
0.75±0.05 MAX
Note: Dimensions in mm. TDFN SO8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
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Appendix
Package Drawing – PLLP6 3.0 mm x 3.0 mm
3.10 (0.122)
3.00 (0.118)
0.98 (0.038)
0.93 (0.036)
0.45 (0.018)
0.35 (0.014)
3.10 (0.122)
3.00 (0.118)
1.55 (0.061)
1.45 (0.057)
0.45 (0.018)
0.40 (0.016)
0.12 (0.005)
0.02 (0.001)
2.30 (0.091)
2.20 (0.087)
1.00 (0.039)
0.85 (0.033)
0.05 (0.002)
0.00 (0.000)
Note: The PLLP6 package has thermal power dissipation of 320°C/Watt in free air. Attaching the package to
a circuit board improves thermal performance. Dimensions are in mm (inches).
Note on Lead-Free Packages
The electronics industry has been working to provide lead-free products in response to concerns about
the environmental impact of the use of lead (Pb) in solder finishes. Increasing customer demand and
directives to decrease the amounts of lead in consumer electronics products from governments around
the globe, drives this effort.
Lead-free finishes utilizing pure tin (Sn) have already been qualified at NVE and are available in most
of our products. However, additional lead times are associated with these parts.
Since most lead-free solders being used in board assembly environments have higher melting
temperatures than traditional tin-lead solders, higher reflow temperatures may be necessary to form an
equivalent solder joint between the component and the PC board. NVE characterizes all lead-free
packages using elevated temperature (245°C to 260°C) reflow profiles characteristic of lead-free board
assembly environments. All lead-free products will be identified with an “E” suffix on the part number
and a lower case “e” marking on the package.
This lead-free transition is an important component of NVE’s commitment to take an active part in
protecting the environment and our responsibility to our customers and the communities around the
world in which we do business. We remain dedicated to meeting our customers’ requirements and
expectations.
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Appendix
Recommended Solder Reflow Profile
NVE recommends the following soldering profile
:
300
For leaded (Pb) parts, the peak temperature shown in this profile can be decreased to as low as 230°C.
Exceeding 265°C at peak or the time at peak temperature shown in this profile can damage the parts.
Specifically:
1.
AA- and AD-Series sensors are rated at 150°C maximum storage temperature. They can withstand
the solder profile shown above with no harmful effects. However, temperatures above 265°C for
even a brief period or extended periods above 160°C can cause degradation of the GMR sensor
element.
AKL- and DD-Series parts contain an on-chip EEPROM. Exposure to temperatures in excess of
265°C can cause EEPROM data corruption, which will cause the parts to fall out of specification.
2.
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Appendix
Magnet Data
NVE supplies Ceramic 8 magnets in some of our GMR sensor evaluation kits. The characteristics for
these magnets are given below:
Material Type
Maximum Operating Temperature
Curie Temperature
Temperature Coefficient of Flux Density
Maximum Energy Product
Residual Induction
Coercive Force
Ceramic 8 (C8)
300°C
450°C
-0.20 %/°C
3.5 MGOe
3850 Gauss
2950 Oersteds
Ceramic 8 M agnetic Characteristics
4500
4000
3000
2500
2000
1500
1000
500
0
-5000
-4000
-3000
-2000
-1000
0
Flux De nsity, G auss (G )
3500
-35C
+25C
+85C
De magne tizing Force , O e rste ds (O e )
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