型号
- 型号
- 关键词
1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100, PLASTIC, MS-026-AED, TQFP-100
厂商官网：https://www.rocelec.com/
下载文档| 型号 | AD9430BSV-210 | AD9430BSVZ-210 | AD9430BSV-170 | AD9430BSVZ-170 |
|---|---|---|---|---|
| 描述 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100, PLASTIC, MS-026-AED, TQFP-100 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100, ROHS COMPLIANT, PLASTIC, MS-026-AED, TQFP-100 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100, PLASTIC, MS-026-AED, TQFP-100 | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100, ROHS COMPLIANT, PLASTIC, MS-026-AED, TQFP-100 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | HTFQFP, | HTFQFP, | HTFQFP, | HTFQFP, |
| 针数 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 最大模拟输入电压 | 2.9 V | 2.9 V | 2.9 V | 2.9 V |
| 最小模拟输入电压 | 2.65 V | 2.65 V | 2.65 V | 2.65 V |
| 最长转换时间 | 0.0047 µs | 0.0047 µs | 0.0058 µs | 0.0058 µs |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
| JESD-609代码 | e0 | e3 | e0 | e3 |
| 长度 | 14 mm | 14 mm | 14 mm | 14 mm |
| 最大线性误差 (EL) | 0.061% | 0.061% | 0.0549% | 0.0549% |
| 湿度敏感等级 | 3 | 3 | NOT APPLICABLE | 3 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTFQFP | HTFQFP | HTFQFP | HTFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 | 260 | NOT APPLICABLE | 260 |
| 采样速率 | 210 MHz | 210 MHz | 170 MHz | 170 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 40 | NOT APPLICABLE | 40 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm |